GB0018386D0 - Method and apparatus for heating a wafer and method and apparatus for baking a photoresist film on a wafer - Google Patents
Method and apparatus for heating a wafer and method and apparatus for baking a photoresist film on a waferInfo
- Publication number
- GB0018386D0 GB0018386D0 GBGB0018386.3A GB0018386A GB0018386D0 GB 0018386 D0 GB0018386 D0 GB 0018386D0 GB 0018386 A GB0018386 A GB 0018386A GB 0018386 D0 GB0018386 D0 GB 0018386D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- wafer
- baking
- heating
- photoresist film
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title 2
- 238000010438 heat treatment Methods 0.000 title 1
- 229920002120 photoresistant polymer Polymers 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990030350A KR100351049B1 (en) | 1999-07-26 | 1999-07-26 | Wafer heating method and the device adopting the same |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0018386D0 true GB0018386D0 (en) | 2000-09-13 |
GB2352508A GB2352508A (en) | 2001-01-31 |
GB2352508B GB2352508B (en) | 2003-10-08 |
Family
ID=36693973
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0018282A Withdrawn GB2352507A (en) | 1999-07-26 | 2000-07-25 | A method and apparatus for heating a wafer |
GB0018386A Expired - Fee Related GB2352508B (en) | 1999-07-26 | 2000-07-26 | Method and apparatus for heating a wafer and method and apparatus for baking a photoresist film on a wafer |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0018282A Withdrawn GB2352507A (en) | 1999-07-26 | 2000-07-25 | A method and apparatus for heating a wafer |
Country Status (6)
Country | Link |
---|---|
JP (2) | JP2001093795A (en) |
KR (1) | KR100351049B1 (en) |
CN (2) | CN1193266C (en) |
DE (2) | DE10036183B4 (en) |
GB (2) | GB2352507A (en) |
TW (2) | TW428224B (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3882141B2 (en) * | 2002-06-13 | 2007-02-14 | 日鉱金属株式会社 | Vapor growth apparatus and vapor growth method |
US7170582B2 (en) * | 2004-12-13 | 2007-01-30 | Asml Netherlands B.V. | Support device and lightographic apparatus |
JP4657940B2 (en) * | 2006-02-10 | 2011-03-23 | 東京エレクトロン株式会社 | Substrate processing system |
JP2007258303A (en) * | 2006-03-22 | 2007-10-04 | Tokyo Electron Ltd | Substrate heat-treatment device |
KR101486407B1 (en) * | 2006-07-28 | 2015-01-26 | 마퍼 리쏘그라피 아이피 비.브이. | Lithography system, method of heat dissipation and frame |
US20080142208A1 (en) * | 2006-12-15 | 2008-06-19 | Applied Materials, Inc. | Method and apparatus for heating a substrate |
US20080145038A1 (en) * | 2006-12-15 | 2008-06-19 | Applied Materials, Inc. | Method and apparatus for heating a substrate |
US8994917B2 (en) | 2008-08-08 | 2015-03-31 | Asml Netherlands B.V. | Temperature stabilization system to stabilize a temperature of an article |
TWI835063B (en) * | 2016-07-28 | 2024-03-11 | 荷蘭商Asml荷蘭公司 | Substrate holding device, method for manufacturing such a device, and apparatus and method for processing or imaging a sample |
US20180096867A1 (en) * | 2016-09-30 | 2018-04-05 | Momentive Performance Materials Inc. | Heating apparatus with controlled thermal contact |
JP6837202B2 (en) * | 2017-01-23 | 2021-03-03 | パナソニックIpマネジメント株式会社 | Substrate heating device and method and manufacturing method of electronic device |
CN108662930A (en) * | 2017-09-28 | 2018-10-16 | 上海微电子装备(集团)股份有限公司 | A kind of hot plate apparatus |
CN108185526B (en) * | 2018-01-03 | 2023-09-01 | 云南中烟工业有限责任公司 | MEMS heating chip integrated with diode temperature sensor and manufacturing method thereof |
CN108354228B (en) * | 2018-01-03 | 2023-07-25 | 云南中烟工业有限责任公司 | MEMS heating chip integrated with Pt temperature sensor and manufacturing method thereof |
CN108158039B (en) * | 2018-01-03 | 2023-07-11 | 云南中烟工业有限责任公司 | MEMS heating chip integrated with multiple Pt temperature sensors and manufacturing method thereof |
CN108158040B (en) * | 2018-01-03 | 2023-11-21 | 云南中烟工业有限责任公司 | MEMS electronic cigarette chip capable of uniformly heating and manufacturing method thereof |
CN108538760B (en) * | 2018-04-03 | 2020-11-27 | 德淮半导体有限公司 | Hot plate structure |
CN112789714A (en) * | 2018-08-01 | 2021-05-11 | 莫门蒂夫性能材料股份有限公司 | Detachable thermal leveler |
KR102236933B1 (en) * | 2019-10-21 | 2021-04-05 | 정승수 | Heat block for manufacturing semiconductor and display panel |
US11487206B2 (en) | 2019-12-30 | 2022-11-01 | Texas Instruments Incorporated | Methods and apparatus for digital material deposition onto semiconductor wafers |
JP7491556B2 (en) * | 2020-06-23 | 2024-05-28 | トクデン株式会社 | Heat Transfer Plate |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2129018B (en) * | 1982-08-30 | 1986-01-29 | Ricoh Kk | Vacuum evaporation apparatus |
JPH06103670B2 (en) * | 1989-04-04 | 1994-12-14 | 三菱電機株式会社 | Semiconductor wafer heating device |
DE3943478C2 (en) * | 1989-05-08 | 1995-11-16 | Philips Electronics Nv | Workpiece carrier for a disc-shaped workpiece, as well as a vacuum treatment system |
JP2935867B2 (en) * | 1990-03-28 | 1999-08-16 | ホーヤ株式会社 | Substrate heat treatment equipment |
JP3119950B2 (en) * | 1992-09-30 | 2000-12-25 | 株式会社東芝 | Pattern formation method |
JP2907687B2 (en) * | 1993-06-10 | 1999-06-21 | 大日本スクリーン製造株式会社 | Substrate heating device |
JPH07152158A (en) * | 1993-11-30 | 1995-06-16 | Sigma Merutetsuku Kk | Substrate heater |
JP3614503B2 (en) * | 1995-04-18 | 2005-01-26 | 富士写真フイルム株式会社 | Heat treatment method and apparatus for photosensitive lithographic printing plate |
JP3983831B2 (en) * | 1995-05-30 | 2007-09-26 | シグマメルテック株式会社 | Substrate baking apparatus and substrate baking method |
JPH10189611A (en) * | 1996-12-24 | 1998-07-21 | Sony Corp | Device for heating semiconductor wafer |
KR100339875B1 (en) * | 1998-12-28 | 2002-10-11 | (주) 대홍기업 | Plate heating device |
-
1999
- 1999-07-26 KR KR1019990030350A patent/KR100351049B1/en not_active IP Right Cessation
- 1999-12-15 TW TW088122012A patent/TW428224B/en not_active IP Right Cessation
-
2000
- 2000-07-18 CN CNB001201468A patent/CN1193266C/en not_active Expired - Fee Related
- 2000-07-20 TW TW089114514A patent/TW473873B/en not_active IP Right Cessation
- 2000-07-25 DE DE10036183A patent/DE10036183B4/en not_active Expired - Fee Related
- 2000-07-25 DE DE10036001A patent/DE10036001A1/en not_active Withdrawn
- 2000-07-25 GB GB0018282A patent/GB2352507A/en not_active Withdrawn
- 2000-07-26 GB GB0018386A patent/GB2352508B/en not_active Expired - Fee Related
- 2000-07-26 CN CNB001241370A patent/CN1249522C/en not_active Expired - Fee Related
- 2000-07-26 JP JP2000225991A patent/JP2001093795A/en active Pending
- 2000-07-26 JP JP2000225962A patent/JP2001085324A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
TW473873B (en) | 2002-01-21 |
KR100351049B1 (en) | 2002-09-09 |
GB2352508A (en) | 2001-01-31 |
GB2352507A (en) | 2001-01-31 |
JP2001093795A (en) | 2001-04-06 |
GB2352508B (en) | 2003-10-08 |
GB0018282D0 (en) | 2000-09-13 |
DE10036183B4 (en) | 2004-06-17 |
CN1282005A (en) | 2001-01-31 |
DE10036183A1 (en) | 2001-02-01 |
JP2001085324A (en) | 2001-03-30 |
TW428224B (en) | 2001-04-01 |
DE10036001A1 (en) | 2001-02-22 |
CN1249522C (en) | 2006-04-05 |
KR20010011123A (en) | 2001-02-15 |
CN1282003A (en) | 2001-01-31 |
CN1193266C (en) | 2005-03-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20090726 |