TW426221U - Thickness measuring apparatus used for correcting a thin-film formation program of a semiconductor device - Google Patents
Thickness measuring apparatus used for correcting a thin-film formation program of a semiconductor deviceInfo
- Publication number
- TW426221U TW426221U TW089212772U TW89212772U TW426221U TW 426221 U TW426221 U TW 426221U TW 089212772 U TW089212772 U TW 089212772U TW 89212772 U TW89212772 U TW 89212772U TW 426221 U TW426221 U TW 426221U
- Authority
- TW
- Taiwan
- Prior art keywords
- correcting
- thin
- semiconductor device
- film formation
- measuring apparatus
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950040265A KR0165470B1 (ko) | 1995-11-08 | 1995-11-08 | 반도체 소자의 박막형성 프로그램의 자동보정 시스템 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW426221U true TW426221U (en) | 2001-03-11 |
Family
ID=19433380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW089212772U TW426221U (en) | 1995-11-08 | 1996-09-20 | Thickness measuring apparatus used for correcting a thin-film formation program of a semiconductor device |
Country Status (4)
Country | Link |
---|---|
US (1) | US5893050A (zh) |
JP (1) | JPH09143722A (zh) |
KR (1) | KR0165470B1 (zh) |
TW (1) | TW426221U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI611509B (zh) * | 2015-03-30 | 2018-01-11 | Hitachi Int Electric Inc | 半導體裝置的製造方法、基板處理系統、基板處理裝置及程式 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6067509A (en) * | 1998-03-18 | 2000-05-23 | Gaiski; Stephen N. | Method for generating computed statistical control charts from pelt gage thickness measurements |
JP3897922B2 (ja) * | 1998-12-15 | 2007-03-28 | 株式会社東芝 | 半導体装置の製造方法、及びコンピュ−タ読取り可能な記録媒体 |
ATE291240T1 (de) * | 1999-10-14 | 2005-04-15 | Hoya Corp | Gerät und verfahren zur bildung dünner schichten |
US6524449B1 (en) * | 1999-12-03 | 2003-02-25 | James A. Folta | Method and system for producing sputtered thin films with sub-angstrom thickness uniformity or custom thickness gradients |
GB0026868D0 (en) * | 2000-11-03 | 2000-12-20 | Isis Innovation | Control of deposition and other processes |
US6444481B1 (en) * | 2001-07-02 | 2002-09-03 | Advanced Micro Devices, Inc. | Method and apparatus for controlling a plating process |
US6539321B2 (en) * | 2001-07-17 | 2003-03-25 | International Business Machines Corporation | Method for edge bias correction of topography-induced linewidth variation |
JP4068327B2 (ja) * | 2001-10-11 | 2008-03-26 | 株式会社東芝 | 半導体製造装置と半導体装置の製造方法 |
AU2003268618A1 (en) * | 2002-10-15 | 2004-05-04 | Unaxis Balzers Ag | Method and apparatus for processing substrates |
US7407324B2 (en) * | 2005-08-10 | 2008-08-05 | Tokyo Electron, Ltd. | Method and apparatus for monitoring the thickness of a conductive coating |
US20070125303A1 (en) | 2005-12-02 | 2007-06-07 | Ward Ruby | High-throughput deposition system for oxide thin film growth by reactive coevaportation |
US8003158B2 (en) * | 2007-09-28 | 2011-08-23 | Abbott Cardiovascular Systems Inc. | Spray coating stents with fixed No. of layers |
CN104979228A (zh) * | 2014-04-11 | 2015-10-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 薄膜厚度的控制方法以及半导体加工设备 |
BE1022682B1 (nl) * | 2015-01-11 | 2016-07-14 | Soleras Advanced Coatings Bvba | Een deksel met een sensorsysteem voor een configureerbaar meetsysteem voor een configureerbaar sputtersysteem |
JP6109224B2 (ja) | 2015-03-30 | 2017-04-05 | 株式会社日立国際電気 | 半導体装置の製造方法、プログラムおよび基板処理装置 |
JP6126155B2 (ja) * | 2015-03-31 | 2017-05-10 | 株式会社日立国際電気 | 半導体装置の製造方法、プログラムおよび基板処理装置 |
JP6230573B2 (ja) * | 2015-07-06 | 2017-11-15 | 株式会社日立国際電気 | 半導体装置の製造方法、プログラム、基板処理システム及び基板処理装置 |
JP6153975B2 (ja) * | 2015-08-07 | 2017-06-28 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理システム、プログラム、記録媒体および基板処理装置 |
CN105088172B (zh) * | 2015-09-21 | 2017-12-01 | 京东方科技集团股份有限公司 | 膜厚控制系统及膜厚控制方法 |
JP7183126B2 (ja) * | 2019-07-17 | 2022-12-05 | 東京エレクトロン株式会社 | 基板処理装置、情報処理装置及び情報処理方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0224502A (ja) * | 1988-07-12 | 1990-01-26 | Dainippon Screen Mfg Co Ltd | 膜厚測定方法 |
DE4005744C1 (zh) * | 1990-02-23 | 1991-11-21 | Hans-Christian Prof. Dr.-Ing. 4513 Belm De Gudehus | |
JP2708300B2 (ja) * | 1991-10-21 | 1998-02-04 | 株式会社日立製作所 | 電子線描画方法 |
JP3571785B2 (ja) * | 1993-12-28 | 2004-09-29 | キヤノン株式会社 | 堆積膜形成方法及び堆積膜形成装置 |
-
1995
- 1995-11-08 KR KR1019950040265A patent/KR0165470B1/ko not_active IP Right Cessation
-
1996
- 1996-09-20 TW TW089212772U patent/TW426221U/zh not_active IP Right Cessation
- 1996-10-04 JP JP8264407A patent/JPH09143722A/ja active Pending
- 1996-11-08 US US08/745,360 patent/US5893050A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI611509B (zh) * | 2015-03-30 | 2018-01-11 | Hitachi Int Electric Inc | 半導體裝置的製造方法、基板處理系統、基板處理裝置及程式 |
Also Published As
Publication number | Publication date |
---|---|
US5893050A (en) | 1999-04-06 |
JPH09143722A (ja) | 1997-06-03 |
KR0165470B1 (ko) | 1999-02-01 |
KR970030550A (ko) | 1997-06-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW426221U (en) | Thickness measuring apparatus used for correcting a thin-film formation program of a semiconductor device | |
GB2303095B (en) | Method and apparatus for dicing a substrate | |
IL109030A0 (en) | Apparatus and method for thick wafer measurement | |
IL118246A (en) | Method for correcting a signal delivered by a measuring instrument | |
EP0730845A3 (en) | Device for measuring the area of a wound | |
EP0836408A4 (en) | APPARATUS AND METHOD FOR MEASURING TYPICAL DISPLACEMENT | |
GB2299251B (en) | Method and apparatus for detecting crystalline and polycrystalline substances | |
IL107549A0 (en) | A device for measuring the thickness of thin films | |
AU652817B2 (en) | Method and apparatus for measuring a coating state | |
GB2298313B (en) | Method of forming capacitors for a semiconductor device | |
EP0751382A3 (en) | Method and device for measuring spectra | |
GB9525600D0 (en) | Method and apparatus for adjusting the accuracy of electronic timepieces | |
SG45511A1 (en) | Process for forming a semiconductor device | |
GB2305724B (en) | Apparatus for measuring pressure | |
AU6324094A (en) | A method and apparatus for measuring the surface temperature of a semiconductor | |
GB2298923B (en) | A device for measuring the phase angle of a sample impedance | |
HK1004957A1 (en) | Apparatus for measuring a figure | |
TW369210U (en) | An apparatus for detecting and aligning a substrate | |
IL112218A0 (en) | A method and apparatus for measuring linear displacements | |
GB2308654B (en) | A method and apparatus for measuring retardation and birefringance | |
GB2300266B (en) | Method and apparatus for the measurement of humidity | |
GB9619116D0 (en) | Method for forming interlayer insulatiing film of semiconductor device | |
GB9929080D0 (en) | Apparatus for measuring pressure | |
GB9611346D0 (en) | Measuring method and apparatus for detecting interfaces | |
TW475779U (en) | Wafer sensing apparatus for sensing wafer insertion |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MK4K | Expiration of patent term of a granted utility model |