TW418420B - Routing topology for identical connector point layouts on primary and secondary sides of a substrate - Google Patents
Routing topology for identical connector point layouts on primary and secondary sides of a substrate Download PDFInfo
- Publication number
- TW418420B TW418420B TW088102277A TW88102277A TW418420B TW 418420 B TW418420 B TW 418420B TW 088102277 A TW088102277 A TW 088102277A TW 88102277 A TW88102277 A TW 88102277A TW 418420 B TW418420 B TW 418420B
- Authority
- TW
- Taiwan
- Prior art keywords
- connection point
- connection points
- patent application
- scope
- layout
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 34
- 235000012431 wafers Nutrition 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 2
- 239000004744 fabric Substances 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 230000037361 pathway Effects 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 101150085553 cpb-2 gene Proteins 0.000 description 3
- 101150023172 cpb-3 gene Proteins 0.000 description 3
- 101150028534 cpb-1 gene Proteins 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
- G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/023,388 US6118669A (en) | 1998-02-13 | 1998-02-13 | Routing topology for identical connector point layouts on primary and secondary sides of a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW418420B true TW418420B (en) | 2001-01-11 |
Family
ID=21814799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW088102277A TW418420B (en) | 1998-02-13 | 1999-04-03 | Routing topology for identical connector point layouts on primary and secondary sides of a substrate |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6118669A (https=) |
| JP (1) | JP4344088B2 (https=) |
| KR (1) | KR100347444B1 (https=) |
| AU (1) | AU2342199A (https=) |
| TW (1) | TW418420B (https=) |
| WO (1) | WO1999041770A2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6347041B1 (en) * | 2000-01-21 | 2002-02-12 | Dell Usa, L.P. | Incremental phase correcting mechanisms for differential signals to decrease electromagnetic emissions |
| CN1211723C (zh) * | 2000-04-04 | 2005-07-20 | 胜开科技股份有限公司 | 计算机卡制作方法 |
| US6875930B2 (en) * | 2002-04-18 | 2005-04-05 | Hewlett-Packard Development Company, L.P. | Optimized conductor routing for multiple components on a printed circuit board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0249463A (ja) * | 1988-05-27 | 1990-02-19 | Matsushita Electron Corp | 半導体装置 |
| JP2793378B2 (ja) * | 1991-03-28 | 1998-09-03 | 株式会社東芝 | セミカスタム半導体集積回路マクロセル設計法 |
| US5604710A (en) * | 1994-05-20 | 1997-02-18 | Mitsubishi Denki Kabushiki Kaisha | Arrangement of power supply and data input/output pads in semiconductor memory device |
| US5841686A (en) * | 1996-11-22 | 1998-11-24 | Ma Laboratories, Inc. | Dual-bank memory module with shared capacitors and R-C elements integrated into the module substrate |
| US5831890A (en) * | 1996-12-16 | 1998-11-03 | Sun Microsystems, Inc. | Single in-line memory module having on-board regulation circuits |
-
1998
- 1998-02-13 US US09/023,388 patent/US6118669A/en not_active Expired - Lifetime
-
1999
- 1999-01-25 KR KR1020007008853A patent/KR100347444B1/ko not_active Expired - Fee Related
- 1999-01-25 WO PCT/US1999/001555 patent/WO1999041770A2/en not_active Ceased
- 1999-01-25 AU AU23421/99A patent/AU2342199A/en not_active Abandoned
- 1999-01-25 JP JP2000531862A patent/JP4344088B2/ja not_active Expired - Fee Related
- 1999-04-03 TW TW088102277A patent/TW418420B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP4344088B2 (ja) | 2009-10-14 |
| KR100347444B1 (ko) | 2002-08-03 |
| JP2002517080A (ja) | 2002-06-11 |
| KR20010096460A (ko) | 2001-11-07 |
| WO1999041770A3 (en) | 1999-09-23 |
| AU2342199A (en) | 1999-08-30 |
| US6118669A (en) | 2000-09-12 |
| WO1999041770A2 (en) | 1999-08-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |