TW410410B - An arrangement of data input/output circuits for use in a semiconductor memory device - Google Patents
An arrangement of data input/output circuits for use in a semiconductor memory device Download PDFInfo
- Publication number
- TW410410B TW410410B TW088103659A TW88103659A TW410410B TW 410410 B TW410410 B TW 410410B TW 088103659 A TW088103659 A TW 088103659A TW 88103659 A TW88103659 A TW 88103659A TW 410410 B TW410410 B TW 410410B
- Authority
- TW
- Taiwan
- Prior art keywords
- data input
- output
- circuits
- semiconductor memory
- memory cell
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/025—Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/06—Address interface arrangements, e.g. address buffers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/12—Group selection circuits, e.g. for memory block selection, chip selection, array selection
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2207/00—Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
- G11C2207/10—Aspects relating to interfaces of memory device to external buses
- G11C2207/105—Aspects related to pads, pins or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dram (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980023610A KR100306967B1 (ko) | 1998-06-23 | 1998-06-23 | 반도체메모리집적회로장치의데이터입/출력회로배열 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW410410B true TW410410B (en) | 2000-11-01 |
Family
ID=19540414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW088103659A TW410410B (en) | 1998-06-23 | 1999-03-10 | An arrangement of data input/output circuits for use in a semiconductor memory device |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100306967B1 (ko) |
TW (1) | TW410410B (ko) |
-
1998
- 1998-06-23 KR KR1019980023610A patent/KR100306967B1/ko not_active IP Right Cessation
-
1999
- 1999-03-10 TW TW088103659A patent/TW410410B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100306967B1 (ko) | 2001-11-30 |
KR20000002716A (ko) | 2000-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7830692B2 (en) | Multi-chip memory device with stacked memory chips, method of stacking memory chips, and method of controlling operation of multi-chip package memory | |
KR100936637B1 (ko) | 메모리 모듈들에 대한 동적 명령 및/또는 어드레스 미러링시스템 및 방법 | |
US7391634B2 (en) | Semiconductor memory devices having controllable input/output bit architectures | |
TW526498B (en) | High integration memory device, memory module mounting the memory device, and control method of the memory module | |
US7848153B2 (en) | High speed memory architecture | |
JP4707446B2 (ja) | 半導体装置 | |
US20070035980A1 (en) | System and method for optically interconnecting memory devices | |
US6847576B2 (en) | Layout structures of data input/output pads and peripheral circuits of integrated circuit memory devices | |
US4796224A (en) | Layout for stable high speed semiconductor memory device | |
JP3494502B2 (ja) | 半導体記憶装置およびそのパッド配置方法 | |
US8908450B1 (en) | Double capacity computer memory device | |
JP2003051545A (ja) | 半導体メモリチップとそれを用いた半導体メモリ装置 | |
JPH09307058A (ja) | 半導体装置及びそれを用いた電子装置 | |
JPH1187640A (ja) | 半導体装置および電子装置 | |
TW410410B (en) | An arrangement of data input/output circuits for use in a semiconductor memory device | |
US6147924A (en) | Arrangement of data input/output circuits for use in a semiconductor memory device | |
US20070246835A1 (en) | Semiconductor device | |
US5126822A (en) | Supply pin rearrangement for an I.C. | |
EP0382948A1 (en) | Supply pin rearrangement for an integrated circuit | |
US10811057B1 (en) | Centralized placement of command and address in memory devices | |
JPH0582746A (ja) | 半導体記憶装置 | |
TWI252490B (en) | Memory module | |
US20210103533A1 (en) | Memory system and memory chip | |
KR100380023B1 (ko) | 단변 방향의 칩 사이즈를 줄일 수 있는 반도체메모리장치 | |
KR100498448B1 (ko) | 데이터 버스 사이의 커플링을 최소화하는 동기식 반도체장치 및 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |