TW402167U - Back flow tin soldering oven - Google Patents

Back flow tin soldering oven

Info

Publication number
TW402167U
TW402167U TW089203709U TW89203709U TW402167U TW 402167 U TW402167 U TW 402167U TW 089203709 U TW089203709 U TW 089203709U TW 89203709 U TW89203709 U TW 89203709U TW 402167 U TW402167 U TW 402167U
Authority
TW
Taiwan
Prior art keywords
back flow
tin soldering
soldering oven
flow tin
oven
Prior art date
Application number
TW089203709U
Other languages
English (en)
Inventor
Taro Matsuoka
Seiki Sakuyama
Original Assignee
Furukawa Electric Co Ltd
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd, Fujitsu Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW402167U publication Critical patent/TW402167U/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
    • F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace
    • F27B9/24—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace being carried by a conveyor
    • F27B9/243—Endless-strand conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/06—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated
    • F27B9/10—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated heated by hot air or gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/06—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated
    • F27B9/062—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated electrically heated
    • F27B9/066—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated electrically heated heated by lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/04—Circulating atmospheres by mechanical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW089203709U 1997-07-31 1998-07-29 Back flow tin soldering oven TW402167U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9206189A JPH1154903A (ja) 1997-07-31 1997-07-31 リフローソルダリング方法及びリフロー炉

Publications (1)

Publication Number Publication Date
TW402167U true TW402167U (en) 2000-08-11

Family

ID=16519293

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089203709U TW402167U (en) 1997-07-31 1998-07-29 Back flow tin soldering oven

Country Status (4)

Country Link
US (2) US6135344A (zh)
JP (1) JPH1154903A (zh)
KR (1) KR19990014260A (zh)
TW (1) TW402167U (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112002650A (zh) * 2020-08-20 2020-11-27 上海应用技术大学 一种真空回流共晶焊接的工艺方法
TWI804011B (zh) * 2020-11-12 2023-06-01 日商千住金屬工業股份有限公司 焊接裝置

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154903A (ja) * 1997-07-31 1999-02-26 Fujitsu Ltd リフローソルダリング方法及びリフロー炉
JP3348639B2 (ja) * 1997-10-20 2002-11-20 富士通株式会社 リフロー炉内のハンダバンプの温度制御方法
JP3785435B2 (ja) * 1998-08-27 2006-06-14 株式会社デンソー はんだペーストおよび表面実装型電子装置
WO2001028304A1 (fr) * 1999-10-14 2001-04-19 Fujitsu Limited Four de refusion
JP2001170767A (ja) 1999-12-10 2001-06-26 Hitachi Ltd はんだ付け装置
JP3441067B2 (ja) * 2000-08-03 2003-08-25 株式会社大進工業研究所 ろう付装置
JP4602536B2 (ja) * 2000-11-27 2010-12-22 株式会社タムラ製作所 リフローはんだ付け装置
US6386422B1 (en) * 2001-05-03 2002-05-14 Asm Assembly Automation Limited Solder reflow oven
JP4499963B2 (ja) * 2001-09-07 2010-07-14 パナソニック株式会社 リフロー装置
DE10147789B4 (de) * 2001-09-27 2004-04-15 Infineon Technologies Ag Vorrichtung zum Verlöten von Kontakten auf Halbleiterchips
KR20030059704A (ko) * 2002-01-04 2003-07-10 엘지전자 주식회사 무연 솔더의 리플로우 장치
US6768083B2 (en) * 2002-09-19 2004-07-27 Speedline Technologies, Inc. Reflow soldering apparatus and method for selective infrared heating
US7080345B1 (en) * 2003-10-15 2006-07-18 Altera Corporation Methods and apparatus for design entry and synthesis of digital circuits
US6991967B2 (en) * 2004-02-23 2006-01-31 Asm Assembly Automation Ltd. Apparatus and method for die attachment
KR200396256Y1 (ko) * 2005-06-30 2005-09-20 주식회사 티에스엠 리플로우 납땜장치
JP4956963B2 (ja) * 2005-11-02 2012-06-20 富士通セミコンダクター株式会社 リフロー装置、リフロー方法、および半導体装置の製造方法
WO2007077727A1 (ja) * 2006-01-06 2007-07-12 Tamura Corporation リフロー装置
JP5130643B2 (ja) * 2006-04-07 2013-01-30 オムロン株式会社 加熱方法および加熱装置
DE102006026948B3 (de) * 2006-06-09 2007-12-06 Rewatronik Gmbh Beheizungseinrichtung
EP1898170A3 (de) 2006-09-05 2008-08-27 Elino Industrie-Ofenbau Carl Hanf GmbH & Co. KG Vorrichtung zur physikalischen und/oder chemischen Behandlung von Teilen
JP4685992B2 (ja) * 2007-01-23 2011-05-18 株式会社タムラ製作所 はんだ付け装置及びはんだ付け方法並びにはんだ付け用プログラム
WO2011130518A1 (en) 2010-04-14 2011-10-20 Babcock & Wilcox Technical Services Y-12, Llc Heat treatment furnace
US8196799B2 (en) * 2010-06-28 2012-06-12 Illinois Tool Works Inc. Compression box for reflow oven heating with a pressurizing plate
US8940099B2 (en) 2012-04-02 2015-01-27 Illinois Tool Works Inc. Reflow oven and methods of treating surfaces of the reflow oven
US9170051B2 (en) * 2012-04-02 2015-10-27 Illinois Tool Works Inc. Reflow oven and methods of treating surfaces of the reflow oven
US9198300B2 (en) 2014-01-23 2015-11-24 Illinois Tool Works Inc. Flux management system and method for a wave solder machine
US9161459B2 (en) 2014-02-25 2015-10-13 Illinois Tool Works Inc. Pre-heater latch and seal mechanism for wave solder machine and related method
US9296056B2 (en) 2014-07-08 2016-03-29 International Business Machines Corporation Device for thermal management of surface mount devices during reflow soldering
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
CN106001819A (zh) * 2014-10-24 2016-10-12 周杰 工件不易损坏的贴片led灯的回流焊接方法
DE102016110040A1 (de) * 2016-05-31 2017-11-30 Endress + Hauser Gmbh + Co. Kg Fertigungslinie zum Löten
JP6642386B2 (ja) 2016-11-18 2020-02-05 株式会社デンソー リフロー装置およびそれを用いた基板の製造方法
US11633797B2 (en) * 2019-11-15 2023-04-25 General Electric Company Braze joints for a component and methods of forming the same
JP6854436B1 (ja) * 2020-09-08 2021-04-07 千住金属工業株式会社 はんだ付け装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3720912A1 (de) * 1986-07-03 1988-01-07 Licentia Gmbh Verfahren und anordnung zum reflow-loeten und reflow-entloeten von leiterplatten
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus
JPS6471571A (en) * 1987-09-11 1989-03-16 Senju Metal Industry Co Reflow furnace
JPH01262069A (ja) 1988-04-13 1989-10-18 Matsushita Electric Ind Co Ltd 基板の加熱装置及び加熱方法
DE4016366C2 (de) * 1990-05-21 1994-04-28 Siemens Nixdorf Inf Syst Verfahren und Einrichtung zum Reflow-Löten von Elektronik-Bauteilen auf eine Leiterplatte
US5154338A (en) * 1990-06-06 1992-10-13 Senju Metal Industry Co., Ltd. Solder reflow furnace
US5069380A (en) * 1990-06-13 1991-12-03 Carlos Deambrosio Inerted IR soldering system
JPH07115166B2 (ja) * 1991-03-26 1995-12-13 日立テクノエンジニアリング株式会社 リフローはんだ付け方法およびその装置
US5942842A (en) * 1992-02-07 1999-08-24 Fogle, Jr.; Homer William Hermetically-sealed electrically-absorptive low-pass radio frequency filters and electromagnetically lossy ceramic materials for said filters
JP2731665B2 (ja) * 1992-04-16 1998-03-25 日立テクノエンジニアリング株式会社 リフローはんだ付け装置
DE4302976A1 (de) * 1992-07-22 1994-01-27 Bosch Gmbh Robert Vorrichtung und Verfahren zum Auflöten von Bauelementen auf Platinen
JPH06292964A (ja) * 1992-07-22 1994-10-21 A Tec Tekutoron Kk 自動半田付け装置
JPH0645748A (ja) * 1992-07-23 1994-02-18 Matsushita Electric Ind Co Ltd リフロー方法
JPH06224551A (ja) * 1993-01-23 1994-08-12 Sony Corp リフロー半田付け装置の温度制御方法
US5347103A (en) * 1993-08-31 1994-09-13 Btu International Convection furnace using shimmed gas amplifier
US5364007A (en) * 1993-10-12 1994-11-15 Air Products And Chemicals, Inc. Inert gas delivery for reflow solder furnaces
US5607609A (en) * 1993-10-25 1997-03-04 Fujitsu Ltd. Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering
JP3527272B2 (ja) 1994-01-20 2004-05-17 株式会社タムラ製作所 基板冷却装置
US5567151A (en) * 1994-10-21 1996-10-22 Senju Metal Industry Company Limited Reflow furnaces with hot air blow type heaters
JP3229533B2 (ja) 1995-12-28 2001-11-19 日本電熱計器株式会社 リフローはんだ付け方法およびリフローはんだ付け装置
US5785233A (en) * 1996-02-01 1998-07-28 Btu International, Inc. Apparatus and method for solder reflow bottom cooling
JPH09237965A (ja) * 1996-02-29 1997-09-09 Furukawa Electric Co Ltd:The リフロー炉
JPH1154903A (ja) * 1997-07-31 1999-02-26 Fujitsu Ltd リフローソルダリング方法及びリフロー炉

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112002650A (zh) * 2020-08-20 2020-11-27 上海应用技术大学 一种真空回流共晶焊接的工艺方法
TWI804011B (zh) * 2020-11-12 2023-06-01 日商千住金屬工業股份有限公司 焊接裝置

Also Published As

Publication number Publication date
US6345757B1 (en) 2002-02-12
US6135344A (en) 2000-10-24
KR19990014260A (ko) 1999-02-25
JPH1154903A (ja) 1999-02-26

Similar Documents

Publication Publication Date Title
TW402167U (en) Back flow tin soldering oven
GB2326330B (en) Cooking grill
HK1021561A1 (en) Cooking device
ZA98145B (en) Rotisserie cooker
AU6055098A (en) Lead-free solder
EP0855242A4 (en) LEAD-FREE LOT
IL132555A0 (en) Lead-free solder
PL334729A1 (en) Lead-free tin alloy
HU9700191D0 (en) Electric-insulating compositions based on epoxy-silicon hybridresins
HUP0004090A3 (en) Soldering device
PL329399A1 (en) Baking oven
GB2321835B (en) Cooking ovens
GB2328276B (en) Oil-fired stove
GB9806276D0 (en) Baking tin
ZA984044B (en) Oven
TW350298U (en) Frying stove
IL154056A0 (en) Lead-free tin projectile
HU9700684D0 (en) Potato oven
GB9823367D0 (en) Stoves
ZA983393B (en) Lead-free solder
AU138645S (en) BBQ oven
GB9717502D0 (en) Oven unit
GB2321837B (en) Cooking ovens
GB2321836B (en) Cooking ovens
CA79818S (en) Cooking utensil

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees