TW393564B - Method to correct the measure-error of a coordinate measure-machine - Google Patents

Method to correct the measure-error of a coordinate measure-machine Download PDF

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Publication number
TW393564B
TW393564B TW087111708A TW87111708A TW393564B TW 393564 B TW393564 B TW 393564B TW 087111708 A TW087111708 A TW 087111708A TW 87111708 A TW87111708 A TW 87111708A TW 393564 B TW393564 B TW 393564B
Authority
TW
Taiwan
Prior art keywords
function
rotation
coordinates
measurement
blending
Prior art date
Application number
TW087111708A
Other languages
English (en)
Chinese (zh)
Inventor
Klaus Dr Rinn
Original Assignee
Leica Microsystems
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leica Microsystems filed Critical Leica Microsystems
Application granted granted Critical
Publication of TW393564B publication Critical patent/TW393564B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/042—Calibration or calibration artifacts
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Image Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW087111708A 1997-08-11 1998-07-17 Method to correct the measure-error of a coordinate measure-machine TW393564B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19734695A DE19734695C1 (de) 1997-08-11 1997-08-11 Verfahren zur Korrektur der Messfehler einer Koodinaten-Messmaschine

Publications (1)

Publication Number Publication Date
TW393564B true TW393564B (en) 2000-06-11

Family

ID=7838600

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087111708A TW393564B (en) 1997-08-11 1998-07-17 Method to correct the measure-error of a coordinate measure-machine

Country Status (7)

Country Link
US (1) US6317991B1 (ko)
EP (1) EP0931241B1 (ko)
JP (1) JP2001502433A (ko)
KR (1) KR20000068713A (ko)
DE (2) DE19734695C1 (ko)
TW (1) TW393564B (ko)
WO (1) WO1999008070A1 (ko)

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US20020085761A1 (en) * 2000-12-30 2002-07-04 Gary Cao Enhanced uniqueness for pattern recognition
US6598306B2 (en) * 2001-04-17 2003-07-29 Homer L. Eaton Self-loading spatial reference point array
US7246030B2 (en) * 2002-02-14 2007-07-17 Faro Technologies, Inc. Portable coordinate measurement machine with integrated line laser scanner
US7881896B2 (en) 2002-02-14 2011-02-01 Faro Technologies, Inc. Portable coordinate measurement machine with integrated line laser scanner
JP3821739B2 (ja) * 2002-03-22 2006-09-13 株式会社ミツトヨ 測定データ整形方法
DE10224993C1 (de) * 2002-06-05 2003-08-21 Siemens Ag Verfahren zur Vermessung der Verzerrung einer Flächen-Positioniervorrichtung
US6948254B2 (en) * 2003-10-27 2005-09-27 Micronic Laser Systems Ab Method for calibration of a metrology stage
US8825444B1 (en) 2005-05-19 2014-09-02 Nanometrics Incorporated Automated system check for metrology unit
WO2007060840A1 (ja) * 2005-11-28 2007-05-31 Mitsubishi Electric Corporation 位置検出誤差補正方法
US7916284B2 (en) * 2006-07-18 2011-03-29 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
EP2100189B1 (en) 2006-11-09 2018-06-20 Carl Zeiss SMT GmbH Method for determination of residual errors
US7853038B2 (en) * 2007-01-04 2010-12-14 Industrial Technology Research Institute Systems and methods for object dimension estimation
DE102007000999B4 (de) 2007-02-26 2012-06-28 Vistec Semiconductor Systems Gmbh Verfahren zur Beseitigung von Fehlerquellen der Systemkorrektur einer Koordinaten-Messmaschine
JP5468726B2 (ja) * 2007-05-23 2014-04-09 株式会社ミツトヨ 二次元格子校正装置、二次元格子校正プログラム、記録媒体
DE102007030390B4 (de) * 2007-06-29 2010-05-12 Vistec Semiconductor Systems Gmbh Koordinaten-Messmaschine und Verfahren zur Kalibrierung der Koordinaten-Messmaschine
DE102007033345B4 (de) * 2007-07-16 2009-07-16 Vistec Semiconductor Systems Gmbh Verfahren zur Korrektur von Abbildungsfehlern einer Messoptik einer Koordinaten-Messmaschine
DE102007039983A1 (de) * 2007-08-23 2009-02-26 Vistec Semiconductor Systems Gmbh Verfahren zum Messen von Positionen von Strukturen auf einem Substrat mit einer Koordinaten Messmaschine
DE102007000973B4 (de) * 2007-11-05 2013-10-02 Vistec Semiconductor Systems Gmbh Maske, Verwendung der Maske in einer Koordinaten-Messmaschine und Verfahren zur Bestimmung der Drehlage der Maske
DE102008044515B4 (de) * 2008-09-10 2015-08-13 Vistec Semiconductor Systems Gmbh Verfahren zur Kompensation der Tool induced shift bei einer Koordinaten-Messmaschine
JP5438988B2 (ja) * 2009-02-17 2014-03-12 株式会社ミツトヨ 測定システムおよび干渉計
DE102009003503A1 (de) 2009-02-18 2010-08-19 Vistec Semiconductor Systems Gmbh Verfahren zur Kalibrierung eines Messtisches einer Koordinaten-Messmaschine
US8453337B2 (en) * 2009-06-02 2013-06-04 James Richard Lacy System and method for workpiece coordinate measurements
DE102009025895A1 (de) * 2009-06-02 2010-12-09 Kla-Tencor Mie Gmbh Koordinaten-Messmaschine und Verfahren zur Überwachung und Korrektur von systembedingten Fehlern
NL2005412A (en) * 2009-10-28 2011-05-02 Asml Netherlands Bv Calibration method and lithographic apparatus using such a calibration method.
US9393694B2 (en) * 2010-05-14 2016-07-19 Cognex Corporation System and method for robust calibration between a machine vision system and a robot
KR101616366B1 (ko) * 2014-11-27 2016-04-29 삼성중공업(주) 계측기 보상 장치 및 방법
CN107014331B (zh) * 2017-05-31 2023-01-20 中国计量大学 一种关节臂测量力误差辨识装置及误差辨识校正方法
CN112414352B (zh) * 2020-11-10 2022-04-01 重庆市计量质量检测研究院 凸轮轴上被测对象的采样位姿修正与轮廓形貌测量方法
CN114184151B (zh) * 2021-12-15 2024-01-02 上海无线电设备研究所 一种单轴坐标外推方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4583298A (en) * 1984-03-07 1986-04-22 Hewlett-Packard Company Auto calibration method suitable for use in electron beam lithography
JPH0814484B2 (ja) 1985-04-09 1996-02-14 株式会社ニコン パタ−ン位置測定装置
DE3637410A1 (de) * 1986-11-03 1988-05-11 Zeiss Carl Fa Verfahren zur messung von drehtischabweichungen
DE4006835A1 (de) * 1990-03-05 1991-09-12 Eugen Dr Ing Trapet Verfahren zur kalibrierung von zweidimensionalen pruefkoerpern mit elimination systematischer fehler des messgeraets
DE19523885A1 (de) * 1995-06-30 1997-01-02 Zeiss Carl Fa Verfahren zur Filterung von Meßwertkurven

Also Published As

Publication number Publication date
JP2001502433A (ja) 2001-02-20
EP0931241A1 (de) 1999-07-28
EP0931241B1 (de) 2003-08-13
US6317991B1 (en) 2001-11-20
DE59809276D1 (de) 2003-09-18
DE19734695C1 (de) 1998-11-05
WO1999008070A1 (de) 1999-02-18
KR20000068713A (ko) 2000-11-25

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