TW370700B - Socket apparatus for testing semiconductor package - Google Patents

Socket apparatus for testing semiconductor package

Info

Publication number
TW370700B
TW370700B TW087106439A TW87106439A TW370700B TW 370700 B TW370700 B TW 370700B TW 087106439 A TW087106439 A TW 087106439A TW 87106439 A TW87106439 A TW 87106439A TW 370700 B TW370700 B TW 370700B
Authority
TW
Taiwan
Prior art keywords
package
socket apparatus
main body
semiconductor package
locking member
Prior art date
Application number
TW087106439A
Other languages
English (en)
Inventor
Yu-Sik Lim
Original Assignee
Magnachip Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magnachip Semiconductor Ltd filed Critical Magnachip Semiconductor Ltd
Application granted granted Critical
Publication of TW370700B publication Critical patent/TW370700B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW087106439A 1997-06-25 1998-04-27 Socket apparatus for testing semiconductor package TW370700B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019970015606U KR200165887Y1 (ko) 1997-06-25 1997-06-25 비지에이 패키지 검사용 소켓

Publications (1)

Publication Number Publication Date
TW370700B true TW370700B (en) 1999-09-21

Family

ID=19503948

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087106439A TW370700B (en) 1997-06-25 1998-04-27 Socket apparatus for testing semiconductor package

Country Status (4)

Country Link
US (1) US5989039A (zh)
JP (1) JP3044460B2 (zh)
KR (1) KR200165887Y1 (zh)
TW (1) TW370700B (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100318621B1 (ko) * 1999-02-20 2001-12-28 로마스 엘 심스 대칭 구조를 갖는 접속핀을 이용한 집적회로 검사 소켓
JP4270337B2 (ja) * 1999-06-18 2009-05-27 モレックス インコーポレイテド Ｉｃパッケージソケット
JP3758069B2 (ja) * 1999-07-30 2006-03-22 株式会社エンプラス 電気部品用ソケット
US6402528B2 (en) * 1999-11-30 2002-06-11 Texas Instruments Incorporated Electronic part mounting device
AU2001271717A1 (en) * 2000-07-12 2002-01-21 Advanced Micro Devices Inc. Universal burn-in socket for testing integrated circuit chip
US6447322B1 (en) * 2000-08-22 2002-09-10 Intle Corporation Test socket for an electronic assembly which reduces damage to the electronic assembly
US6485311B2 (en) 2001-03-20 2002-11-26 International Business Machines Corporation Compression connector actuation system
JP4471941B2 (ja) * 2005-03-10 2010-06-02 山一電機株式会社 半導体装置用ソケット
US6981882B1 (en) * 2005-03-29 2006-01-03 Ironwood Electronics, Inc. Packaged device adapter with torque limiting assembly
JP4151908B2 (ja) * 2005-08-31 2008-09-17 日本航空電子工業株式会社 電気ソケット
US7565843B2 (en) * 2006-08-29 2009-07-28 Ironwood Electronics, Inc. Packaged device adapter with torque indicating assembly
KR100917000B1 (ko) * 2007-03-23 2009-09-14 세크론 주식회사 테스트 보조체
KR100865890B1 (ko) * 2007-03-23 2008-10-29 세크론 주식회사 테스트 보조체
JP2009036679A (ja) * 2007-08-02 2009-02-19 Yamaichi Electronics Co Ltd 半導体装置用ソケット
US7736166B2 (en) * 2007-08-31 2010-06-15 Hon Hai Precision Ind. Co., Ltd. Socket with push finger
JP4495200B2 (ja) * 2007-09-28 2010-06-30 山一電機株式会社 半導体装置用ソケット
JP2010118275A (ja) * 2008-11-13 2010-05-27 Yamaichi Electronics Co Ltd 半導体装置用ソケット
TWM366780U (en) * 2009-04-03 2009-10-11 Hon Hai Prec Ind Co Ltd Electrical connector
US20110059635A1 (en) * 2009-09-08 2011-03-10 Paricon Technologies, Inc. Electronic socket with an adjustable floating load
US20140111239A1 (en) * 2012-10-22 2014-04-24 Qualcomm Incorporated Localized printed circuit board layer extender apparatus for relieving layer congestion near high pin-count devices
JP6192530B2 (ja) * 2013-12-25 2017-09-06 株式会社エンプラス 電気部品用ソケット
KR20160131965A (ko) * 2015-05-08 2016-11-16 (주)제이티 테스트소켓 용 어댑터
DE102017004267A1 (de) * 2017-05-03 2018-11-08 Yamaichi Electronics Deutschland Gmbh Kontaktor zum Kontaktieren eines Halbleiterbauteils, Verwendung und Verfahren
JP2019125438A (ja) * 2018-01-12 2019-07-25 東芝メモリ株式会社 Ｉｃソケット

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5205742A (en) * 1991-08-22 1993-04-27 Augat Inc. High density grid array test socket
US5161984A (en) * 1991-10-16 1992-11-10 Amp Incorporated Electrical socket
JP3259109B2 (ja) * 1993-02-08 2002-02-25 日本テキサス・インスツルメンツ株式会社 ソケット
JPH07335350A (ja) * 1994-06-07 1995-12-22 Ueruzu Japan Kk Ｉｃソケット
JPH08213128A (ja) * 1995-02-08 1996-08-20 Texas Instr Japan Ltd ソケット
US5626481A (en) * 1995-06-12 1997-05-06 Yamaichi Electronics Co., Ltd. Structure for electrical connection of electric part
US5646447A (en) * 1996-06-03 1997-07-08 Pcd Inc. Top loading cam activated test socket for ball grid arrays
JP2816132B2 (ja) * 1996-03-26 1998-10-27 山一電機株式会社 Ｉｃソケットにおけるｉｃ押え機構

Also Published As

Publication number Publication date
JPH11111418A (ja) 1999-04-23
US5989039A (en) 1999-11-23
KR19990002086U (ko) 1999-01-15
KR200165887Y1 (ko) 2000-01-15
JP3044460B2 (ja) 2000-05-22

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