AU2001271717A1 - Universal burn-in socket for testing integrated circuit chip - Google Patents

Universal burn-in socket for testing integrated circuit chip

Info

Publication number
AU2001271717A1
AU2001271717A1 AU2001271717A AU7171701A AU2001271717A1 AU 2001271717 A1 AU2001271717 A1 AU 2001271717A1 AU 2001271717 A AU2001271717 A AU 2001271717A AU 7171701 A AU7171701 A AU 7171701A AU 2001271717 A1 AU2001271717 A1 AU 2001271717A1
Authority
AU
Australia
Prior art keywords
socket
integrated circuit
circuit chip
testing integrated
universal burn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001271717A
Inventor
Phuc Dinh Do
Rafiqul Hussain
Benjamin G. Tubera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2001271717A1 publication Critical patent/AU2001271717A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0483Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AU2001271717A 2000-07-12 2001-06-29 Universal burn-in socket for testing integrated circuit chip Abandoned AU2001271717A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US61472900A 2000-07-12 2000-07-12
US09/614,729 2000-07-12
PCT/US2001/020924 WO2002004968A2 (en) 2000-07-12 2001-06-29 Universal burn-in socket for testing integrated circuit chip

Publications (1)

Publication Number Publication Date
AU2001271717A1 true AU2001271717A1 (en) 2002-01-21

Family

ID=24462474

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001271717A Abandoned AU2001271717A1 (en) 2000-07-12 2001-06-29 Universal burn-in socket for testing integrated circuit chip

Country Status (2)

Country Link
AU (1) AU2001271717A1 (en)
WO (1) WO2002004968A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011015815B4 (en) * 2011-04-01 2014-02-13 Yamaichi Electronics Deutschland Gmbh Test contactor with variable component mounting, use and method
US8535956B2 (en) 2012-02-14 2013-09-17 International Business Machines Corporation Chip attach frame
CN109471017A (en) * 2018-11-23 2019-03-15 昆明理工大学 One kind being based on monolithic processor controlled 78XX family chip model detection circuit and method
CN112269123B (en) * 2020-10-16 2023-03-14 天津津航计算技术研究所 Universal configurable chip test circuit
CN115712056B (en) * 2023-01-06 2023-04-21 法特迪精密科技(苏州)有限公司 Chip temperature cycle aging test table, key seat and test method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2899543B2 (en) * 1995-06-08 1999-06-02 信越ポリマー株式会社 Socket for connecting semiconductor package
KR200165887Y1 (en) * 1997-06-25 2000-01-15 김영환 Socket for inspection of ball grid array package

Also Published As

Publication number Publication date
WO2002004968A3 (en) 2003-11-06
WO2002004968A2 (en) 2002-01-17

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