DE102011015815B4 - Test contactor with variable component mounting, use and method - Google Patents

Abstract

Test contactor (1) for an integrated circuit component (3) with a receiving device (7) comprising: a component receptacle (9) with a predeterminable longitudinal extension (2) along a longitudinal direction (L) and with a predeterminable width extension (b) along a width direction (B), -; at least one movable component guide device (17a, 17b, 17c, 17d), the longitudinal extension (2) and / or the width extension (b) of the component holder (9) being adjustable by means of the at least one movable component guide device (17a, 17b, 17c, 17d) , whereby the longitudinal extent (1) of the component receptacle (9) to a length (x) of the integrated circuit component (3) and / or the width extension (b) of the component receptacle (9) to a length (y) of the integrated circuit component (3) adaptable is.

Description

The present invention relates to a test contactor for an integrated circuit device (IC), a use and a method.

The abbreviation "IC" stands for "integrated circuit". An IC may be a single transistor or an array of transistors or an electronic circuit, each within a package. An IC can be part of a microprocessor, for example. An IC can also be part of another electronic or electrical device. In particular, an IC can comprise or be part of any type of so-called "embedded electronic".

Conventionally, ICs are tested after manufacture for operability. For this purpose, an IC is connected to a printed circuit board and checked whether predetermined electrical contacts of the IC are present. The IC can also be operated as a test. In order to avoid a time-consuming soldering of the IC to the printed circuit board or, if the IC can not be soldered, the IC is connected to the printed circuit board by means of a test contactor.

The testing of the ICs takes place both manually and automatically in testing machines. For each test, the IC to be tested must be replaced, ie. H. one IC is removed from the test contactor and another IC is placed in the test contactor with the IC held in an operative position. The replacement of the ICs and the holding of the ICs can be done for example by the testing machine. It should be understood that the ICs to be tested must not be damaged during the test, especially if a mass-production test in rapid time and with appropriate. fast automated replacement of the ICs. Therefore, each IC to be tested must be securely held during the testing process regardless of its external shape and dimensions.

The publication US 2004/0 112 142 A1 discloses a test device for a semiconductor package having a pick and place device for picking up and loading the semiconductor package into the test device, a semiconductor package guide, and a socket disposed under the guide means.

The publication US 2009/0 134 511 A1 discloses a socket configured to receive a first substrate with a first semiconductor die package or a second substrate with another semiconductor die package. The pedestal has positioning elements which engage in locating the substrates in complementary positioning elements so that the substrates can be properly positioned.

The publication WO 02/004 968 A2 discloses a socket having a replaceable positioning frame.

It is therefore an object of the present invention to provide a test contactor which enables fast and gentle handling of integrated circuit components for testing purposes.

This object is achieved by the test contactor according to claim 1, the use of the test contactor according to claim 9 and the method for connecting an integrated circuit component according to claim 10. Preferred embodiments are subject of the dependent claims.

One aspect of the present invention relates to a test contactor for an integrated circuit device having a receptacle comprising:
A component receptacle with a predeterminable longitudinal extension 1 along the longitudinal direction L and with a predeterminable widthwise extension b along the width direction B,
The longitudinal extent l and / or the width extension b of the component receptacle is adjustable by means of the at least one movable component guide device, whereby the longitudinal extent l of the component receptacle to a length x of the integrated circuit component and / or the width extent b of the component receptacle to a Length y of the integrated circuit component is adaptable.

Advantageously, the test contactor can be adjusted in a quick and easy manner to the IC to be tested, so that a large number of different ICs can be tested with a single test contactor. Further advantageously, the dead time between two tests of different ICs can be reduced. An assembly of different test contactors to the rest of the test apparatus is omitted.

The integrated circuit component can be inserted at least partially into the component receptacle of the receiving device along the insertion direction E. In other words, in an operating position, the IC is at least partially received by the receiving device or inserted therein. The IC may have a plurality of contact elements, wherein at least the contact elements are received in the operating position in the component receptacle. The IC can be in the operating position at least partially in positive engagement with the / the component receiving wall forming (s), in particular with the at least one Component guide device, or with a bottom element of the receiving device. Advantageously, by the receiving device, a spatial displacement of the IC along a displacement direction which is parallel to the longitudinal direction L or the width direction B or which is substantially perpendicular to the insertion direction E, be inhibited.

Incidentally, the term "operating position" describes a state of the test contactor, wherein an integrated circuit component or an IC is accommodated in the receiving device and can be tested or tested for its function. In other words, the term "operating position" describes the state of the test contactor during normal operational use.

In order to introduce the IC in the component holder, the component receptacle, so formed by the receiving device receiving space for receiving the integrated circuit component must be greater than or substantially equal to the size of the IC to be recorded. The component holder is characterized by the longitudinal extent l along the longitudinal direction L and the width extension b along the width direction B. An IC is then receivable along the insertion direction E into the component receptacle if the length x of the IC is less than or equal to the longitudinal extent l and the width y of the IC is less than or equal to the width extent b, ie if x ≦ l and y ≦ b.

The insertion direction E is preferably not within the plane defined by the longitudinal direction L and the width direction B. In other words, the insertion direction E is preferably linearly independent of the longitudinal direction L and the width direction B. Specifically, the insertion direction E, the longitudinal direction L and the width direction B are perpendicular to each other.

The longitudinal extension 2 and / or the width extension b of the component holder can be predetermined and adjusted by means of the at least one movable component guide device. In other words, the size of the component holder can be advantageously adapted in a simple manner to the IC to be tested. In this case, the component holder, for example, be adapted to the IC or adapted so that the IC can not be completely or partially absorbed in the component holder, but for example, first rests with the housing at an edge portion of the component holder, in which case the longitudinal extent and / or width extension of the component holder is set such that the IC is inserted into the component holder, for example, falls due to gravity in the component holder. However, the component receptacle can also be adjusted or adapted to the IC such that the IC can be introduced directly along the insertion direction into the component receptacle and accommodated by the component receptacle.

In order to predetermine the lengthwise extent l of the component receptacle along the longitudinal direction L and the width extent b of the width direction B or to adapt it to the IC to be tested, the receiving device of the test contactor comprises at least one movable component guiding device. The at least one component guiding device is designed or arranged to be movable along the longitudinal direction L and / or the width direction B. Movable in the sense of the application means that the component guide device is mounted displaceably and / or rotatably in order to predetermine the size of the component receptacle depending on the spatial position of the component guiding device.

By means of the at least one movable component guiding device, the integrated circuit component can be positioned relative to the receiving device. In particular, the receiving device may be connected to a printed circuit board which has a plurality of contact regions for electrical contacting with associated contact elements of an IC to be tested. In this case, a contact element of the IC can contact the assigned contact region of the printed circuit board directly or indirectly via an electrically conductive contacting element of the receiving device. In particular, the contact elements of the IC can protrude into or through through openings of the bottom element of the receiving device in the operating position in order to contact the contact regions or contacting elements.

Since the contact elements of an IC are generally arranged according to a pitch, for example at a regular pitch of about 2.54 mm, about 1.27 mm, about 0.8 mm or about 0.64 mm, the contact areas the printed circuit board or the contacting elements of the receiving device and / or the passage openings in the bottom element of the receiving device are arranged or designed in accordance with this grid dimension.

For example, the contact regions, the contacting elements or the passage openings can be arranged according to a rectangular matrix, wherein each contact area, each contacting element or each passage opening coincides with the node point of a rectangular grid. Therefore, the circuit board I × J contact areas and / or the receiving device I × J contacting elements or passage openings, where I and J are each natural numbers. For example, 1 × 2, 1 × 3, 2 × 8, 2 × 16, 4 × 4, 4 × 16, 32 × 32, 60 × 64, 68 × 72 or 72 x 72 contact areas, contacting elements or openings should be provided. Particularly preferably, no contact area or contacting element or no passage opening can be arranged at one or more nodes of the rectangular grid in order to produce, for example, reverse polarity protection or anti-rotation protection. In particular, the matrix may be rectangular and equidistant, so that the distance of a contact region, a contacting element or a passage opening to one / an adjacent, ie the grid spacing, is the same in both grating directions. The grid spacing in a grid direction and / or in both grid directions may be between 0.5 mm and 5 mm, preferably between 1 mm and 3 mm, in particular approximately 2.54 mm, approximately 2 mm, approximately 1.27 mm, 1 mm, approximately 0.8 mm, about 0.65 mm, about 0.5 mm, 0.4 mm or about 0.2 mm.

Advantageously, the spatial positions of the movable component guiding devices can be predetermined such that a contact element of the IC can be directly or indirectly contacted with an associated contact region of the printed circuit board when the IC is received along the insertion direction E in the component receptacle and the test contactor is in the operating position. If the longitudinal extent l and the width extension b of the component receptacle are set substantially equal to the length x and the width y of the IC, the IC can be accommodated only in a predetermined position except for a slight local deviation in the component receptacle, whereby a predeterminable or predetermined Contact configuration of the contact elements of the IC with the contact areas of the printed circuit board or the contacting elements can be produced.

A small local deviation means that the deviation is smaller than the pitch for which the receiving device is designed, that is, the pitch of the insertable into the exception device ICs. Preferably, the deviation is less than half the pitch, and more preferably less than one quarter of the pitch. Thus, a small local deviation may mean that the deviation is less than, for example, 2.54 mm, less than 1.27 mm, less than 1 mm, less than about 0.8 mm, or less than 0.65 mm, but preferably, less than 0.5 mm, less than 0.4 mm, less than 0.32 mm or less than 0.16 mm.

Preferably, the at least one component guiding device is displaceably mounted linearly along the longitudinal direction L and / or the width direction B. Advantageously, a linear displacement even in the event that there is already an IC in the component holder, take place in such a way that no shear forces act on the IC.

Preferably, the receiving device of the test contactor may have two opposing component guiding devices, which can be actuated in opposite directions or in opposite directions, in order to adjust the longitudinal extent l or the width extent b of the component receptacle. In particular, the receiving device of the test contactor may have four pairs of opposing component guiding devices, which can be actuated in opposite directions to adjust both the longitudinal extent I and the width extension b of the component receptacle.

Preferably, the receiving device further comprises an actuating device, by means of which at least one of the movable component guiding devices is adjustable. In particular, an associated actuating device can be provided for each component guiding device. In other words, the receiving device in particular comprises an equal number of component guiding devices and actuating devices. Such an actuating device may comprise, for example, a setting screw or an adjusting screw, which is manually and / or motor-operated. Advantageously, this results in a flexible adjustment with respect to the size of the component holder and with respect to the relative positioning with respect to the receiving device.

Preferably, the receiving device comprises exactly one actuating device, by means of which all movable component guiding devices are jointly adjustable. In other words, the receiving device comprises in particular a plurality of component guiding devices, for example two, three, four or more component guiding devices, and precisely one actuating device. Such an actuating device may for example comprise a control disk, which is manually and / or motor-operated.

The actuating device preferably has a control disk with guide grooves in which pins of associated component guiding devices engage, so that a movement or actuation, for example a rotation, of the control disk leads to a displacement of the component guiding devices. Advantageously, a single actuation is sufficient to adjust all component guiding devices. Further advantageously, a centering of the position of the IC relative to the receiving device can be achieved by the simultaneous or synchronous actuation or movement of the component guiding devices.

In particular, the control disk can be actuated by means of an operating lever or by means of a servomotor or a stepper motor. For example, the control disk can be rotated or rotated manually or by a motor about a rotation axis parallel to the insertion direction E. The guide grooves can be designed such that the rotation of the control disk is converted into a linear displacement of the component guiding devices along the longitudinal direction L and / or the width direction B. Advantageously, the component guiding devices can thereby be displaced simultaneously and in particular by equal distances.

Preferably, the actuating device has a latching mechanism which periodically engages or causes an increased actuation resistance. The latching mechanism may, for example, have a pin, which is guided in a guide groove which has an elastically deformable, resilient constriction of the groove at periodic intervals, which impedes the further displacement and therefore leads to a latching effect. Advantageously, the latching by a click sound acoustically indicate the actuation progress.

In particular, latching could occur as soon as one of the component guiding devices has been displaced by a certain distance, for example by a quarter, a half or the simple of the pitch of the IC under test or an integral multiple thereof. The pitch corresponds to the periodic distance between two adjacent contact elements of the IC under test and can for example between 0.5 mm and 5 mm, preferably between 1 mm and 3 mm, in particular about 2.54 mm, about 2 mm, about 1.27 mm , 1 mm, about 0.8 mm, about 0.64 mm, about 0.5 mm, about 0.4 mm or about 0.2 mm.

Use according to one aspect

One aspect of the present invention relates to the use of a test contactor described above for connecting an integrated circuit component to a printed circuit board, wherein at least one contact element of the integrated circuit component is contacted with an associated contact region of the printed circuit board.

In particular, each contact area of the printed circuit board is assigned exactly one contact element of the IC. In particular, the electrical connection of each contact region of the printed circuit board can be effected indirectly via a contacting element to form a uniquely assigned contact element of the IC. Advantageously, the contact areas of the printed circuit board can thus be contacted in a simple manner with the contact elements of the IC.

Preferably, the test contactor has a pressure element which is designed to apply a contact pressure K along the insertion direction E to the IC in the operating position. Preferably, the use of the test contact in such a way that in the operating position, a predetermined pressing force K along the insertion direction E is applied to the integrated circuit component. The pressure element may be detachably or non-detachably connected to the receiving device. The desired contact pressure K to be applied can be a function of the number of contact elements of the IC. Preferably, the number of contact elements of the IC is multiplied by a force of about 0.1 Newton to about 0.5 Newton. The resulting pressing force K applied to the IC by the pressing member may be in a range between about 1 Newton and about 500 Newton. Advantageously, each individual contact element of the IC can be pressed in the operating position due to the applied pressure force with a predetermined force to the associated contact region of the circuit board or to the associated contacting element in an electrically contacting manner to the contact resistance to the formed electrical contact below a certain limit hold.

Method according to one aspect

• – Auswählen eines mit der Leiterplatte zu kontaktierenden integrierten Schaltkreisbauteils;
• – Anpassen einer Längserstreckung l einer Bauteilaufnahme eines Testkontaktors mittels zumindest einer beweglichen Bauteilführungseinrichtung des Testkontaktors an eine Länge x des integrierten Schaltkreisbauteils und/oder Anpassen einer Breitenerstreckung b der Bauteilaufnahme mittels zumindest einer beweglichen Bauteilführungseinrichtung an eine Länge y des integrierten Schaltkreisbauteils;
• – zumindest bereichsweises Einführen des integrierten Schaltkreisbauteils entlang einer Einführrichtung E in die Bauteilaufnahme;
• – elektrisches Kontaktieren des integrierten Schaltkreisbauteils mit der Leiterplatte.

One aspect of the present invention relates to a method for connecting an integrated circuit component to a printed circuit board comprising the steps:

• - selecting an integrated circuit component to be contacted with the circuit board;
• Adjusting a longitudinal extent l of a component receptacle of a test contactor by means of at least one movable component guide device of the test contactor to a length x of the integrated circuit component and / or fitting a width extension b of the component receptacle by means of at least one movable component guide device to a length y of the integrated circuit component;
• - At least partially inserting the integrated circuit component along an insertion direction E in the component receiving;
• - electrically contacting the integrated circuit device with the circuit board.

In other words, according to the method, an integrated circuit component (IC) is selected, for example to check this circuit component for its function. The integrated circuit component in this case has a certain size, which can be described by the length x and the length y of the integrated circuit component.

The size of the component holder is adapted to the integrated circuit component to be tested. In this case, the component holder can for example be adapted to the integrated circuit component, that the integrated circuit component is initially not or not completely absorbed in the component holder, but for example first rests with the housing on the component holder, in which case in a subsequent step, the longitudinal extent and / or Width extension of the component holder is set such that the integrated circuit component can be inserted into the component holder. For example, the integrated circuit component may fall into the component receptacle due to gravity. However, the component receptacle can also be adjusted in such a way before inserting the integrated circuit component in a single step or be adapted to the integrated circuit component, that the integrated circuit component immediately after setting or adjusting the component holder along the insertion direction introduced into the component holder, in particular completely introduced, and can be received by the component receiving, so that an electrical contacting of the integrated circuit component with the circuit board is possible or is possible.

Preferably, the adjustment or adjustment of the longitudinal extent l and / or the width extension b of the component receiving can be done manually or by motor.

For example, one or more of the moveable component guide means may be manually displaced or moved by a motor, for example by means of a manual or motorized spindle drive.

figure description

Preferred embodiments of a test contactor are described below by way of example with reference to accompanying figures. It shows:

1 a perspective sectional view through an embodiment of the test contact,

2 a plan view of the component receiving the in the 1 shown test contactors,

3 a perspective view of components in the 1 and 2 shown embodiment,

4 a perspective view of components in the 1 to 3 shown embodiment.

1 shows a perspective sectional view of a recording device 7 a test contactor 1 for an integrated circuit component 3 , The test contactor 1 is designed to be the integrated circuit component 3 with a circuit board 5 to contact electrically. The test contactor 1 includes a receiving device 7 , which is designed to be the integrated circuit component 3 along an insertion direction E at least partially in a component receptacle 9 the cradle 7 record and keep in an operating position. The component holder 9 For this purpose, it may be substantially congruent with the shape of the integrated circuit component to be accommodated 3 be educated. In this embodiment, the insertion direction E is perpendicular to that of the circuit board 5 spanned plane, ie also perpendicular to a longitudinal direction L and perpendicular to a width direction B. By means of congruent to the shape of the integrated circuit component 3 trained component holder 9 may be a relative displacement of the integrated circuit device 3 along a displacement direction parallel to the longitudinal direction L and the width direction B, that is, substantially perpendicular to the insertion direction E, are prevented.

The integrated circuit component 3 can relative to the circuit board 5 be positioned so that a contact element 11 of the integrated circuit device 3 with an associated contact area 13 the circuit board 5 is contacted when the integrated circuit component 3 along the insertion direction E in the component holder 9 is included and the test contactor 1 is in the operating position. In the operating position, a direct electrical contact between the at least one contact element preferably takes place 11 of the integrated circuit device 3 and the associated contact area 13 the circuit board 5 , Alternatively, the electrical contact in the operating position between the at least one contact element 11 and the associated contact area 13 by means of an associated contacting element 15 respectively. For this purpose, in the operating position between the contact elements 11 of the integrated circuit device 3 and the associated contact areas 13 the circuit board 5 at least a number of contacting elements 15 be arranged, which is equal to the number of contact elements 11 is, so that the integrated circuit component 3 with all contact elements 11 with the circuit board 5 is contactable.

Preferably, the number corresponds to the circuit board 5 trained contact areas 13 or the number of contacting elements 15 the maximum number of contact elements 11 an integrated circuit to be tested 3 , This can be done with the Testkontaktor 1 also integrated circuits 3 with fewer contact elements 11 be checked so that the test contactor 1 advantageously for testing a variety of different integrated circuits 3 is designed. Because the contact elements 11 an integrated circuit 3 at a predetermined distance from one another, for example at a regular pitch of about 2.54 mm, about 1.27 mm, about 0.8 mm, about 0.64 mm, about 0.5 mm or about 0.4 mm , have ICs with a smaller number of contact elements 11 Also, a smaller size, that is, a shorter length x and / or a smaller width y, as ICs with a higher number of contact elements 11 ,

The component holder 9 has a predeterminable longitudinal extent l along the longitudinal direction L and a predeterminable. Width extension b along the width direction B on. An integrated circuit component 3 is then along the insertion direction E in the component holder 9 receivable when the length x of the integrated circuit component 3 less than or equal to the longitudinal extent l of the component holder 9 is and the width y of the integrated circuit component 3 less than or equal to the width extension b of the component holder 9 is, so if x ≤ l and y ≤ b. In this case, a positioning of the integrated circuit component 3 relative to the circuit board 5 even then done so that a contact element 11 of the integrated circuit device 3 with exactly one assigned contact area 13 the circuit board 5 is contacted when the width extension b or the longitudinal extent l of the component receiving 9 is slightly larger, that is, less than the pitch of, for example, about 2.54 mm, about 1.27 mm, about 0.8 mm, about 0.64 mm, about 0.5 mm, or about 0.4 mm, as the Width y or the length x of the integrated circuit component 3 ,

Correspond to the width extension b or the longitudinal extent 2 the component holder 9 essentially the width y or the length x of the integrated circuit component 3 so can the integrated circuit component 3 by means of the component holder 9 relative to the circuit board 5 be positioned to a specific contact element 11 with a predetermined associated contact area 13 the circuit board 5 electrically contact when the integrated circuit component 3 along the insertion direction E in the component holder 9 is included and the test contactor 1 is in the operating position.

To the longitudinal extent 2 or the width extension b of the component holder 9 to determine or adjust, has the recording device 7 at least one movable component guiding device 17a . 17b . 17c on. The in the 1 The preferred embodiment shown comprises a pair of oppositely disposed component guiding devices 17a . 17b which are respectively formed and arranged to be movable along the longitudinal direction L and a pair of oppositely disposed component guiding devices 17c (where in 1 only one of these component guiding devices is visible), which are each designed or arranged to be movable along the width direction B.

The width extension b or the longitudinal extent l of the component holder 9 may be due to a displacement of the component guiding devices 17a . 17b . 17c be set to a predetermined or predeterminable value. In this case, the longitudinal extent l of the component holder 9 by means of the displacement of the oppositely arranged component guiding devices 17a , 17b to the length x of the integrated circuit device to be tested 3 be set. Alternatively or additionally, the width extension b of the component holder 9 by displacing opposing component guiding devices 17c corresponding to the width y of the integrated circuit component 3 be adjusted. Are the longitudinal extent 2 and the width extension b of the component holder 9 substantially equal to the length x and the width y of the integrated circuit device 3 adjusted, the integrated circuit component 3 only in a predetermined position in the component holder 9 be absorbed so that the position of the integrated circuit component 3 is defined along the longitudinal direction L and the width direction B to a small local deviation. A small local deviation means that the deviation is smaller than the pitch of the contact elements of the integrated circuit device 3 , Preferably less than half of the grid, and more preferably less than a quarter of the grid. Thus, a small local deviation may mean that the deviation is less than, for example, 2.54 mm, less than 1.27 mm, less than 0.8 mm or less than 0.64 mm, but preferably less than 0.5 mm , less than 0.4 mm, less than 0.32 mm or less than 0.16 mm.

The cradle 7 can a variety of N contacting elements 15 in particular, 2, 3, 4, 5, 6, 7, 8, 9, 10, 12, 14, 16, 18, 20, 24, 32, 64, 66, 96 etc. contacting elements 15 which provides indirect electrical contact between the contact elements 11 an integrated circuit component 3 and the associated contact areas 13 the circuit board 5 can produce.

Like in the 1 are shown, the contacting elements 15 preferably arranged in the form of a rectangular matrix, that is, that each contacting element 15 coincides with the node of a rectangular grid. Therefore, the test contactor 1 or the recording device 7 I × J contacting elements 15 where I and J are each natural numbers. For example, the receiving device can be 1 × 2, 1 × 3, 2 × 8, 2 × 16, 4 × 4, 4 × 16, 32 × 32, 60 × 64, 68 × 72 or 72 × 72 contacting elements 15 exhibit. Particularly preferably, no contacting element can be provided at one or more nodes of the rectangular grid 15 be arranged to produce, for example, a reverse polarity protection or torsion protection. In particular, the matrix may be rectangular and equidistant, so that the distance of a contacting element 15 to an adjacent contacting element 15 , ie the grid spacing is the same in both grating directions. The grid spacing in a grid direction and / or in both grid directions may be between 0.5 mm and 5 mm, preferably between 1 mm and 3 mm, in particular approximately 2.54 mm, approximately 2 mm, approximately 1.27 mm, 1 mm, approximately 0.8 mm, about 0.64 mm, about 0.5 mm or about 0.2 mm.

From the large number of contacting elements 15 follows in particular an equal number of contacting element recordings 19 which at least partially in or on the component holder 9 and / or at least partially in or on a Kontaktierungselementhalter 21 may be formed to the contacting elements 15 to hold on or in their predetermined position. Analogous to the contacting elements 15 can the contacting element recordings 19 , as described above, be arranged in a matrix.

Preferably, the contacting elements 15 be made of electrically conductive plastic or metal. In particular, the contacting elements 15 be formed as metal pins, which are elastically deformable when the contact elements 11 of the integrated circuit device 3 in the operating position with a predetermined pressing force against the contacting elements 15 be pressed. The elastic deformability of the metal pins can be achieved, for example, by a resilient mounting of a region of a contacting element 15 opposite the contact area 13 the circuit board 5 respectively. Preferably, a contacting element 15 two resiliently interconnected parts, such as a punch and a sleeve with a spring arranged therebetween.

More preferably, a contacting element 15 consist of an elastically deformable, electrically conductive plastic. The term "deformable" describes in this context a plastic and / or elastic deformability. The elastic deformation of the plastic, which takes place due to the action of a force is reversible, so that the deformed contacting element 15 after the elimination of an acting force substantially assumes its original shape or form or strives for the original shape or form. Making the original shape may be accomplished by another element, e.g. B. the contact element 11 of the integrated circuit device 3 or the contact area 13 the circuit board 5 be at least partially limited.

Each contacting element 15 is in the associated contacting element receptacle 19 of the contacting element holder 21 fixed. The term "fixed" describes that the contacting element 15 possibly within the contacting element receptacle, in particular by applying a force greater than about 0.1 N, greater than about 0.3 N, greater than about 0.5 N, greater than about 1 N, preferably greater than about 5 N. Preferably is the contacting element 15 but not completely removed from the associated Kontaktierungselementaufnahme. The contacting element recordings 19 can at least partially in or on the component holder 9 be formed and the component holder 9 along the insertion direction E at least partially limit. Alternatively or additionally, the contacting element receptacles 19 also at least partially in or on a Kontaktierungselementhalter 21 be educated. The contacting element holder 21 in turn can be detachable or insoluble on the receiving device 7 be attached and the component holder 9 along the insertion direction E at least partially limit.

The component holder 9 can on the side, which in the operating position of the contact elements 11 provided side of the integrated circuit component 3 facing, through a floor element 22 the cradle 7 be limited, which has a plurality of N passages 23 has, so that the contact elements 11 of the integrated circuit device 3 along the insertion direction E in the passage openings 23 at least partially can be introduced to the associated contacting elements 15 to contact. In the operating position, the contact elements 11 of the integrated circuit device 3 at least partially in or through the associated passage openings 23 protrude and the associated contacting elements 15 and above that the associated contact areas 13 the circuit board 5 contact electrically or immediately the associated contact areas 13 the circuit board 5 contact electrically.

The cradle 7 can be detachable on or with the circuit board 5 be attached. For example, the receiving device 7 by means of at least one screw 25 , in particular by means of 4 screws 25 , with the circuit board 5 or with at least one counter element 27 be bolted, with the counter element 27 and the cradle 7 at least partially on different or opposite sides of the circuit board 5 are arranged. In other words, the circuit board 5 between the recording device 7 and the counter element 27 be arranged or held.

2 shows a plan view along the insertion direction E on the component holder 9 in the 1 shown test contactors 1 , The paired opposite arranged component guide devices 17a . 17b . 17c . 17d limit the component pickup 9 to a predetermined longitudinal extent along the longitudinal direction L and to a predetermined widthwise extent b along the width direction B. An integrated circuit component (not shown) having the length x = 2 and the width y = b is along the insertion direction E into the component receiver 9 received. In this case, the integrated circuit component by the component guiding means 17a . 17b . 17c . 17d in the component holder 9 be positioned so that each of the contact elements of the integrated circuit component at least partially into a single associated passage opening 23 of the floor element 22 is inserted or introduced to each electrically and / or mechanically contact an associated contacting element (not shown) or an associated contact region of a printed circuit board (not shown).

Like in the 2 shown are the 729 passages 23 the cradle 7 and thus the associated contacting elements in the preferred embodiment shown are arranged in a 27x27 rectangular matrix. The grid spacing is equidistant and may in particular be about 2.54 mm, about 1.27 mm, about 0.8 mm, about 0.64 mm, about 0.5 mm or about 0.4 mm.

The component guiding devices 17a . 17b . 17c . 17d limit the component acceptance in their position 9 the cradle 7 such that, by way of example, a square integrated circuit device having a number of 21 x 21 contact elements in the component receptacle 9 can be arranged or recorded. In contrast, integrated circuit components of the same pitch, which have a larger number of contact elements, not in the component receiving 9 be recorded.

Each of the component guiding devices 17a . 17b . 17c . 17d is designed to be movable and can for example in one in the receiving device 7 trained guide held or movably mounted. In this case, the component guiding devices 17a . 17b . 17c . 17d be mounted rotatably and / or linearly displaceable. Each of the component guiding devices 17a . 17b . 17c . 17d has an associated actuation element 29a . 29b . 29c . 29d on, with which each of the component guiding devices 17a . 17b . 17c . 17d is operable for positioning. For example, an actuation element 29a . 29b . 29c . 29d having a pin whose position and thus the position of the associated component guiding device 17a . 17b . 17c . 17d can be predetermined by guiding in a complementary guide groove. Next, for example, an actuation element 29a . 29b . 29c . 29d a groove, so that the position of the associated component guide means 17a . 17b . 17c . 17d can be predetermined by means of a pin engaging in the groove. In this preferred manner are in the 2 shown opposite component guide devices 17a . 17b slidable along the longitudinal direction L and the opposing component guiding devices 17c . 17d displaceable along the width direction B.

For example, in the in the 2 shown component holder 9 For example, to accommodate an integrated circuit device having a number of contact elements of 23 × 23, all four component guiding devices could be used 17a . 17b . 17c . 17d by a length corresponding to the simple pitch to the edge of the receiving device 7 , that is to move outwards. Alternatively, however, only two component guiding devices could be used 17a . 17c the total of four component guide devices 17a . 17b . 17c . 17d by a length corresponding to twice the pitch to the edge of the receiving device 7 to be moved.

In other words, the component guiding devices 17a . 17b . 17c . 17d For example, each be independently or individually movable or the component guiding devices 17a . 17b . 17c . 17d may be movable in pairs to each other or component guide means 17a . 17b . 17c . 17d are only jointly, in particular synchronously, movable. Furthermore, the component guiding devices can 17a . 17b . 17c . 17d also be designed such that only one, two or three of the component guiding devices) 17a . 17b . 17c . 17d is movable, while the remaining of the component guiding devices 17a . 17b . 17c . 17d relative to the passage openings 23 immovable.

To the cradle 7 on the circuit board 5 releasably attach, the cradle can 7 at least one through hole 31 have, by each of which a screw (not shown) is feasible. In the in 2 shown preferred embodiment are four through holes 31 in the area of the corners in the cradle 7 educated. Accordingly, holes can 31 in the circuit board 5 be provided so that the screws through the holes 31 and the circuit board 5 protruding with a counter element (see 1 ) can be screwed to the receiving device 7 on the circuit board 5 to fix.

The holes 31 may also serve as a fixing device fixing device to a fixing device (not shown) on the receiving device 7 to fix, wherein the fixing device, the integrated circuit component 3 in a spatial position, in particular around the integrated circuit component 3 to keep in the operating position. Preferably, the fixing device comprises a pressure element (not shown), which in the operating position a predeterminable pressure force K to the integrated circuit component 3 can create along the insertion direction E. Alternatively or additionally, one or more further fixing device fastening devices may be attached to the receiving device 7 be provided to the fixing device releasably connected to the receiving device 7 connect to. The attachment of the fixing device can be done by means of screws.

The 3 and 4 show a perspective view of parts of the in the 1 and 2 shown recording device 7 , wherein like elements are each identified by the same reference numerals.

The paired opposite arranged component guide devices 17a . 17b . 17c . 17d which the component holder 9 spatially limit are in associated guide grooves of a component guide holder 33 held or displaced stored. The actuation elements 29a . 29b . 29c . 29d the component guiding devices 17a . 17b . 17c . 17d are formed in the illustrated preferred embodiment as a pin, which over a surface of the component guide holder 33 protrude, here preferably opposite to the insertion direction E, with a control disk 35 to be engageable or to be engaged. Each actuation element engages 29a . 29b . 29c . 29d or each pin in an associated complementary guide 37a . 37b . 37c . 37d the control disc 35 one.

The control disc 35 can by means of an operating lever 39 be rotated or rotated about a rotation axis parallel to the insertion direction E. Since the guide grooves are not arranged completely tangential to the direction of rotation, but have a radial longitudinal extension component to the axis of rotation, the Aktuierungselemente 29a . 29b . 29c . 29d depending on the direction of rotation of the control disk 35 be moved towards the axis of rotation or away from the axis of rotation. Consequently, the component guide devices become 17a . 17b . 17c . 17d along the longitudinal direction L or the width direction B shifted. Advantageously, by the control disk 35 all component guiding devices 17a . 17b . 17c . 17d be shifted simultaneously and in particular by the same distance. The control disc 35 and the control lever 39 are thus components of a preferred actuating device for adjusting the component guiding devices 17a . 17b . 17c . 17d in the sense of the application.

Preferably, the actuating device may further comprise a locking mechanism which periodically engages or causes an increased operating resistance when the component guiding devices 17a . 17b . 17c . 17d shifted by an integer distance according to the grid size. The snap can be acoustically displayed in particular by a click sound.

Accordingly, an actuation of the actuator to a position of the receiving device 7 suitable for a component with 27 × 27 contact elements to arrive at a position suitable for a component with 21 × 21 contact elements, are displayed by three clicks with or without detent noise.

It is understood that instead of a manual adjustment by means of the operating lever 39 a motor setting, for example by means of a stepping motor, can be done.

LIST OF REFERENCE NUMBERS

1

Testkontaktor

3

integrated circuit component

5

circuit board

7

cradle

9

component pick

11

Contact element of the integrated circuit component 3

13

Contact area of the circuit board 5

15

contacting

17a, b, c, d

Component guiding device

19

Kontaktierungselementaufnahmen

21

Kontaktierungselementhalter

22

floor element

23

Through openings

25

screw

27

counter element

29a, b, c, d

Aktuierungselement

31

drilling

33

Component guide holder

35

control disc

37a, b, c, d

complementary guide groove

39

operating lever

B

width direction

e

insertion

K

pressure force

L

longitudinal direction

Claims (10)

Test contactor ( 1 ) for an integrated circuit component ( 3 ) with a receiving device ( 7 ) comprising: - a component receptacle ( 9 ) with a predeterminable longitudinal extension ( 2 ) along a longitudinal direction (L) and with a predeterminable width extension (b) along a width direction (B), - at least one movable component guiding device ( 17a . 17b . 17c . 17d ), wherein the longitudinal extent ( 2 ) and / or the width extension (b) of the component receptacle ( 9 ) by means of the at least one movable component guiding device ( 17a . 17b . 17c . 17d ) is adjustable, whereby the longitudinal extent ( 1 ) of component mounting ( 9 ) to a length (x) of the integrated circuit component ( 3 ) and / or the width extension (b) of the component receptacle ( 9 ) to a length (y) of the integrated circuit component ( 3 ) is adaptable. Test contactor ( 1 ) according to claim 1, wherein the at least one component guiding device ( 17a . 17b . 17c . 17d ) is slidably mounted linearly along the longitudinal direction (L) and / or the width direction (B). Test contactor ( 1 ) according to claim 1, wherein the receiving device ( 7 ) an actuating device ( 35 . 39 ), by which at least one of the movable component guiding devices ( 17a . 17b . 17c . 17d ) is adjustable. Test contactor ( 1 ) according to claim 3, wherein the receiving device ( 7 ) for each component guiding device ( 17a . 17b . 17c . 17d ) comprises an associated actuator. Test contactor ( 1 ) according to claim 2, wherein the receiving device ( 7 ) exactly one actuator ( 35 . 39 ), by which all movable component guiding devices ( 17a . 17b . 17c . 17d ) are adjustable together. Test contactor ( 1 ) according to claim 5, wherein the actuating device is a control disk ( 35 ) with guide grooves ( 37a . 37b . 37c . 37d ), in which pins ( 29a . 29b . 29c . 29d ) of associated component guiding devices ( 17a . 17b . 17c . 17d ) intervene. Test contactor ( 1 ) according to claim 5, wherein the actuating device ( 35 . 39 ) an actuating device ( 35 . 39 ) has a latching mechanism which engages periodically and / or causes increased actuation resistance. Test contactor ( 1 ) according to one of the preceding claims, with a pressure element which is designed to be in the operating position a pressing force (K) along the insertion direction (E) on the integrated circuit component ( 3 ). Use of a test contactor ( 1 ) according to one of claims 1 to 8 for connecting an integrated circuit component ( 3 ) with a printed circuit board ( 5 ), wherein at least one contact element ( 11 ) of the integrated circuit component ( 3 ) with an associated contact area ( 13 ) of the printed circuit board ( 5 ) is contacted. Method for connecting an integrated circuit component ( 3 ) with a printed circuit board ( 5 ) comprising the steps: - selecting one with the printed circuit board ( 5 ) to be contacted integrated circuit component ( 3 ); - Adapting a longitudinal extent (l) of a component receptacle ( 9 ) of a test contactor ( 1 ) by means of at least one movable component guiding device ( 17a . 17b . 17c . 17d ) of the test contactor ( 1 ) to a length (x) of the integrated circuit component ( 3 ) and / or adjusting a width extension (b) of the component receptacle ( 9 ) by means of at least one movable component guiding device ( 17a . 17b . 17c . 17d ) to a length (y) of the integrated circuit component ( 3 ); At least partially inserting the integrated circuit component ( 3 ) along an insertion direction (E) in the component receiving ( 9 ); - electrically contacting the integrated circuit component ( 3 ) with the printed circuit board ( 5 ).

Images