TW370480B - Apparatus and method for mounting electrically conductive balls - Google Patents
Apparatus and method for mounting electrically conductive ballsInfo
- Publication number
- TW370480B TW370480B TW086104100A TW86104100A TW370480B TW 370480 B TW370480 B TW 370480B TW 086104100 A TW086104100 A TW 086104100A TW 86104100 A TW86104100 A TW 86104100A TW 370480 B TW370480 B TW 370480B
- Authority
- TW
- Taiwan
- Prior art keywords
- electrically conductive
- conductive balls
- flux
- attracting tool
- attracting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP07854496A JP3261970B2 (ja) | 1996-04-01 | 1996-04-01 | 導電性ボールの搭載装置および搭載方法 |
JP22092896A JP3303684B2 (ja) | 1996-08-22 | 1996-08-22 | 導電性ボール搭載装置及び導電性ボール搭載方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW370480B true TW370480B (en) | 1999-09-21 |
Family
ID=26419604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086104100A TW370480B (en) | 1996-04-01 | 1997-03-31 | Apparatus and method for mounting electrically conductive balls |
Country Status (3)
Country | Link |
---|---|
US (1) | US5890283A (zh) |
KR (1) | KR100262844B1 (zh) |
TW (1) | TW370480B (zh) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100268632B1 (ko) * | 1996-03-08 | 2000-10-16 | 야마구치 다케시 | 범프형성방법 및 장치 |
US6105245A (en) * | 1997-02-17 | 2000-08-22 | Nippon Steel Semiconductor Corporation | Method of manufacturing a resin-encapsulated semiconductor package |
JP2850901B2 (ja) | 1997-06-02 | 1999-01-27 | 日本電気株式会社 | ボール配列治具及びその製造方法 |
US6107181A (en) * | 1997-09-08 | 2000-08-22 | Fujitsu Limited | Method of forming bumps and template used for forming bumps |
US5985694A (en) * | 1997-09-29 | 1999-11-16 | Motorola, Inc. | Semiconductor die bumping method utilizing vacuum stencil |
KR100453689B1 (ko) * | 1997-12-30 | 2005-02-23 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지제조용볼범핑시스템의자동볼싸이즈필터링장치및그방법 |
JPH11340695A (ja) * | 1998-05-25 | 1999-12-10 | Sony Corp | 組立装置 |
US6325272B1 (en) * | 1998-10-09 | 2001-12-04 | Robotic Vision Systems, Inc. | Apparatus and method for filling a ball grid array |
JP3932501B2 (ja) * | 1998-12-01 | 2007-06-20 | 澁谷工業株式会社 | ボールマウント装置 |
JP3024113B1 (ja) * | 1999-01-27 | 2000-03-21 | 株式会社日鉄マイクロメタル | 金属球配列方法及び配列装置 |
TW451359B (en) * | 1999-03-16 | 2001-08-21 | Matsushita Electric Ind Co Ltd | Mounting equipment and mounting method of conductive balls |
JP3283026B2 (ja) * | 1999-04-30 | 2002-05-20 | 新光電気工業株式会社 | ボール状端子の吸着装置及びボール状端子の搭載方法 |
JP4598240B2 (ja) * | 1999-06-24 | 2010-12-15 | アスリートFa株式会社 | ボール搭載装置及びボール搭載方法 |
US6484927B1 (en) * | 1999-11-05 | 2002-11-26 | Delaware Capital Formation Corporation | Method and apparatus for balling and assembling ball grid array and chip scale array packages |
AT410499B (de) * | 2000-10-31 | 2003-05-26 | Datacon Semiconductor Equip | Einrichtung zur führung eines linear bewegbaren werkzeuges |
US6769596B1 (en) * | 2002-11-15 | 2004-08-03 | Qlogic Corporation | Method and system for reworking ball grid arrays |
WO2004107432A1 (ja) * | 2003-05-29 | 2004-12-09 | Fujitsu Limited | 電子部品の実装方法、取外し方法及びその装置 |
US8671561B2 (en) * | 2007-05-24 | 2014-03-18 | Shinko Electric Industries Co., Ltd. | Substrate manufacturing method |
KR101944396B1 (ko) * | 2017-04-25 | 2019-02-01 | (주)에스에스피 | 반도체패키징용 플럭스툴 |
CN109623080A (zh) * | 2019-01-24 | 2019-04-16 | 合肥巨动力系统有限公司 | 一种高效率扁线电机绕组端部焊接装置及焊接工艺 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4292116A (en) * | 1978-04-18 | 1981-09-29 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Apparatus for mounting chip type circuit elements on a printed circuit board |
US5729894A (en) * | 1992-07-21 | 1998-03-24 | Lsi Logic Corporation | Method of assembling ball bump grid array semiconductor packages |
US5284287A (en) * | 1992-08-31 | 1994-02-08 | Motorola, Inc. | Method for attaching conductive balls to a substrate |
JP3303109B2 (ja) * | 1993-05-31 | 2002-07-15 | シチズン時計株式会社 | 半田ボール供給装置と供給方法 |
JP2916086B2 (ja) * | 1994-10-28 | 1999-07-05 | 株式会社日立製作所 | 電子部品の実装方法 |
JP3079921B2 (ja) * | 1994-11-28 | 2000-08-21 | 松下電器産業株式会社 | 半田ボールの搭載装置および搭載方法 |
US5547740A (en) * | 1995-03-23 | 1996-08-20 | Delco Electronics Corporation | Solderable contacts for flip chip integrated circuit devices |
-
1997
- 1997-03-27 KR KR1019970010904A patent/KR100262844B1/ko not_active IP Right Cessation
- 1997-03-28 US US08/825,380 patent/US5890283A/en not_active Expired - Lifetime
- 1997-03-31 TW TW086104100A patent/TW370480B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5890283A (en) | 1999-04-06 |
KR100262844B1 (ko) | 2000-09-01 |
KR970072227A (ko) | 1997-11-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |