TW368764B - Socket apparatus for IC packages - Google Patents

Socket apparatus for IC packages

Info

Publication number
TW368764B
TW368764B TW086118408A TW86118408A TW368764B TW 368764 B TW368764 B TW 368764B TW 086118408 A TW086118408 A TW 086118408A TW 86118408 A TW86118408 A TW 86118408A TW 368764 B TW368764 B TW 368764B
Authority
TW
Taiwan
Prior art keywords
socket
contact pins
seating portion
terminal leads
contact
Prior art date
Application number
TW086118408A
Other languages
English (en)
Inventor
Masao Tohyama
Hideki Sano
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18427192&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW368764(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW368764B publication Critical patent/TW368764B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/32Holders for supporting the complete device in operation, i.e. detachable fixtures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/1023Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW086118408A 1996-12-13 1997-12-08 Socket apparatus for IC packages TW368764B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35289596A JP3266530B2 (ja) 1996-12-13 1996-12-13 ソケット

Publications (1)

Publication Number Publication Date
TW368764B true TW368764B (en) 1999-09-01

Family

ID=18427192

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086118408A TW368764B (en) 1996-12-13 1997-12-08 Socket apparatus for IC packages

Country Status (5)

Country Link
US (1) US6045382A (zh)
JP (1) JP3266530B2 (zh)
KR (1) KR100466483B1 (zh)
SG (1) SG67453A1 (zh)
TW (1) TW368764B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10992067B2 (en) 2017-07-14 2021-04-27 Phoenix Contact Gmbh & Co. Kg Connection device for connection of an electrical line

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4412828B2 (ja) * 2000-08-03 2010-02-10 Okiセミコンダクタ株式会社 半導体パッケージの測定用ソケット及びその測定方法
TWI260109B (en) * 2003-09-03 2006-08-11 Hon Hai Prec Ind Co Ltd Socket connector
JP4347027B2 (ja) * 2003-11-28 2009-10-21 株式会社エンプラス 電気部品用ソケット
JP6567954B2 (ja) * 2015-10-28 2019-08-28 株式会社エンプラス 電気部品用ソケット

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2784570B2 (ja) * 1987-06-09 1998-08-06 日本テキサス・インスツルメンツ 株式会社 ソケツト
JP2696234B2 (ja) * 1988-11-04 1998-01-14 日本テキサス・インスツルメンツ株式会社 ソケット
JP3245747B2 (ja) * 1991-09-18 2002-01-15 日本テキサス・インスツルメンツ株式会社 ソケット
JPH0734379B2 (ja) * 1991-10-15 1995-04-12 山一電機株式会社 電気部品用ソケット
JPH0636843A (ja) * 1992-07-16 1994-02-10 Texas Instr Japan Ltd ソケット
JPH0752662B2 (ja) * 1992-12-26 1995-06-05 山一電機株式会社 Icソケット
US5409392A (en) * 1993-05-14 1995-04-25 Wells Electronics, Inc. Burn-in socket
JP3259122B2 (ja) * 1994-10-04 2002-02-25 日本テキサス・インスツルメンツ株式会社 ソケット
JP3518091B2 (ja) * 1995-09-25 2004-04-12 株式会社エンプラス Icソケット

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10992067B2 (en) 2017-07-14 2021-04-27 Phoenix Contact Gmbh & Co. Kg Connection device for connection of an electrical line

Also Published As

Publication number Publication date
JP3266530B2 (ja) 2002-03-18
SG67453A1 (en) 1999-09-21
US6045382A (en) 2000-04-04
KR19980064022A (ko) 1998-10-07
JPH10172704A (ja) 1998-06-26
KR100466483B1 (ko) 2005-05-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees