TW366570B - Semiconductor device and the wiring unit - Google Patents

Semiconductor device and the wiring unit

Info

Publication number
TW366570B
TW366570B TW087103775A TW87103775A TW366570B TW 366570 B TW366570 B TW 366570B TW 087103775 A TW087103775 A TW 087103775A TW 87103775 A TW87103775 A TW 87103775A TW 366570 B TW366570 B TW 366570B
Authority
TW
Taiwan
Prior art keywords
wiring unit
wiring
semiconductor device
face
semiconductor
Prior art date
Application number
TW087103775A
Other languages
English (en)
Inventor
Sachiyuki Nose
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Application granted granted Critical
Publication of TW366570B publication Critical patent/TW366570B/zh

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
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    • H01L23/49541—Geometry of the lead-frame
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    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW087103775A 1997-03-26 1998-03-13 Semiconductor device and the wiring unit TW366570B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7314297 1997-03-26

Publications (1)

Publication Number Publication Date
TW366570B true TW366570B (en) 1999-08-11

Family

ID=13509663

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087103775A TW366570B (en) 1997-03-26 1998-03-13 Semiconductor device and the wiring unit

Country Status (4)

Country Link
US (1) US6040621A (zh)
EP (1) EP0867939A3 (zh)
KR (1) KR19980080691A (zh)
TW (1) TW366570B (zh)

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JP3957237B2 (ja) * 1998-01-19 2007-08-15 富士通株式会社 集積回路装置モジュール
TW410452B (en) * 1999-04-28 2000-11-01 Siliconware Precision Industries Co Ltd Semiconductor package having dual chips attachment on the backs and the manufacturing method thereof
US6523254B1 (en) * 2000-04-19 2003-02-25 Micron Technology, Inc. Method for gate blocking x-outs during a molding process
US7199477B1 (en) * 2000-09-29 2007-04-03 Altera Corporation Multi-tiered lead package for an integrated circuit
US6507114B2 (en) 2001-01-30 2003-01-14 Micron Technology, Inc. BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die
KR100411254B1 (ko) * 2001-06-04 2003-12-18 삼성전기주식회사 Ｓｍｄ 패키지의 리드융착방법
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EP0867939A3 (en) 1999-08-18
KR19980080691A (ko) 1998-11-25
US6040621A (en) 2000-03-21
EP0867939A2 (en) 1998-09-30

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