WO1998039803A3 - Halbleiterbauelemente umfassende schaltungsanordnung mit mitteln zur überwachung der junktion-temperatur - Google Patents

Halbleiterbauelemente umfassende schaltungsanordnung mit mitteln zur überwachung der junktion-temperatur Download PDF

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Publication number
WO1998039803A3
WO1998039803A3 PCT/EP1998/001569 EP9801569W WO9839803A3 WO 1998039803 A3 WO1998039803 A3 WO 1998039803A3 EP 9801569 W EP9801569 W EP 9801569W WO 9839803 A3 WO9839803 A3 WO 9839803A3
Authority
WO
WIPO (PCT)
Prior art keywords
semi
conductor
circuit board
circuit configuration
devices
Prior art date
Application number
PCT/EP1998/001569
Other languages
English (en)
French (fr)
Other versions
WO1998039803A2 (de
Inventor
Hartmut Alwon
Original Assignee
Alsthom Cge Alcatel
Hartmut Alwon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alsthom Cge Alcatel, Hartmut Alwon filed Critical Alsthom Cge Alcatel
Publication of WO1998039803A2 publication Critical patent/WO1998039803A2/de
Publication of WO1998039803A3 publication Critical patent/WO1998039803A3/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Die Erfindung geht aus von einer Schaltungsanordnung mit einem Trägerkörper (1), der eine Leiterbahnanordnung (7) und ein (gehäustes) Halbleiterbauelement (4) trägt. Das Halbleiterbauelement (4) ist über Anschlußpins (5) mit der Leiterbahnanordnung elektrisch verbunden. Aufgabe der Erfindung ist es, Mittel zu einer Temperaturüberwachung des Halbleiterbauelements bereitzustellen. Erfindungsgemäß ist vorgesehen, auf dem Trägerkörper benachbart zum Halbleiterbauelement einen Temperatursensor (6) aufzubringen. Der Temperatursensor (6) ist über eine speziell geformte Verbindungsleiterbahn (8) elektrisch leitend mit einem der Anschlußpins (5) des Halbleiterbauelements (4) verbunden. Außerdem hat der Trägerkörper eine wesentlich geringere Wärmeleitfähigkeit als die Verbindungsleiterbahn, so daß nur eine geringe thermische Ablage auftritt.
PCT/EP1998/001569 1997-03-04 1998-03-04 Halbleiterbauelemente umfassende schaltungsanordnung mit mitteln zur überwachung der junktion-temperatur WO1998039803A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1997108653 DE19708653C2 (de) 1997-03-04 1997-03-04 Vorrichtung zur Bestimmung der Temperatur mindestens eines auf einem Trägerkörper mit geringer Wärmeleitfähigkeit angeordneten Halbleiterbauelements
DE19708653.5 1997-03-04

Publications (2)

Publication Number Publication Date
WO1998039803A2 WO1998039803A2 (de) 1998-09-11
WO1998039803A3 true WO1998039803A3 (de) 1998-12-10

Family

ID=7822119

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1998/001569 WO1998039803A2 (de) 1997-03-04 1998-03-04 Halbleiterbauelemente umfassende schaltungsanordnung mit mitteln zur überwachung der junktion-temperatur

Country Status (2)

Country Link
DE (1) DE19708653C2 (de)
WO (1) WO1998039803A2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19852080C1 (de) * 1998-11-11 2000-08-17 Trw Automotive Electron & Comp Verfahren und Vorrichtung zur Überwachung der Temperatur eines verlustbehafteten elektronischen Bauelements, insbesondere eines Leistungshalbleiters
DE10125694A1 (de) * 2001-05-25 2003-01-02 Eupec Gmbh & Co Kg Halbleitermodul mit mindestens einem Temperatursensor
ITTO20020277A1 (it) * 2002-03-28 2003-09-29 Btm S R L Dispositivo di rilevazione della temperatura di componenti elettronici.
JP3815362B2 (ja) * 2002-04-08 2006-08-30 株式会社村田製作所 温度検出素子およびこれを備える回路基板
JP4154325B2 (ja) * 2003-12-19 2008-09-24 株式会社日立産機システム 電気回路モジュール
TW200530566A (en) 2004-03-05 2005-09-16 Hitachi Ind Equipment Sys Method for detecting temperature of semiconductor element and semiconductor power converter
SE532651C2 (sv) * 2008-07-10 2010-03-09 Ett för en momentan temperatur känsligt och temperaturen fastställande, arrangemang
CN103234656B (zh) * 2013-05-17 2014-11-12 厦门大学 一种发光二极管结温的测量方法
DE102013213448B4 (de) * 2013-07-09 2021-12-09 Siemens Aktiengesellschaft Elektronikbaugruppe mit Leistungshalbleiter
EP3461229B1 (de) * 2017-09-22 2022-08-10 Electrolux Appliances Aktiebolag Induktionskochfeld

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832361A (ja) * 1994-07-14 1996-02-02 Toyota Autom Loom Works Ltd 保護装置付き増幅回路

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
DE4020304A1 (de) * 1990-06-26 1992-01-02 Siemens Ag Anordnung zur temperaturmessung an gekuehlten elektronischen bauelementen
DE19516260C1 (de) * 1995-04-27 1996-10-02 Mannesmann Ag Anordnung zur Temperaturerfassung an einem Meßwandler

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832361A (ja) * 1994-07-14 1996-02-02 Toyota Autom Loom Works Ltd 保護装置付き増幅回路

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
HUTCHINSON K ET AL: "SELF PROTECTING TRANSISTOR DESIGN", MOTOROLA TECHNICAL DEVELOPMENTS, vol. 7, 1 October 1987 (1987-10-01), pages 62, XP000068637 *
PATENT ABSTRACTS OF JAPAN vol. 096, no. 006 28 June 1996 (1996-06-28) *

Also Published As

Publication number Publication date
DE19708653A1 (de) 1998-09-10
DE19708653C2 (de) 1999-07-08
WO1998039803A2 (de) 1998-09-11

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