TW365561B - Polishing semiconductor wafer - Google Patents

Polishing semiconductor wafer

Info

Publication number
TW365561B
TW365561B TW087111197A TW87111197A TW365561B TW 365561 B TW365561 B TW 365561B TW 087111197 A TW087111197 A TW 087111197A TW 87111197 A TW87111197 A TW 87111197A TW 365561 B TW365561 B TW 365561B
Authority
TW
Taiwan
Prior art keywords
fabric
polymer layer
belt
semiconductor wafer
polymer
Prior art date
Application number
TW087111197A
Other languages
English (en)
Inventor
Walter Dudovicz
Brian Lombardo
Original Assignee
Peripheral Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peripheral Products Inc filed Critical Peripheral Products Inc
Application granted granted Critical
Publication of TW365561B publication Critical patent/TW365561B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/06—Connecting the ends of materials, e.g. for making abrasive belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW087111197A 1997-07-30 1998-07-10 Polishing semiconductor wafer TW365561B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US90300497A 1997-07-30 1997-07-30
US08/941,386 US6736714B2 (en) 1997-07-30 1997-09-30 Polishing silicon wafers

Publications (1)

Publication Number Publication Date
TW365561B true TW365561B (en) 1999-08-01

Family

ID=27129340

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087111197A TW365561B (en) 1997-07-30 1998-07-10 Polishing semiconductor wafer

Country Status (8)

Country Link
US (3) US6736714B2 (zh)
EP (1) EP0999918B1 (zh)
JP (1) JP2001512057A (zh)
KR (1) KR100646490B1 (zh)
AU (1) AU8453298A (zh)
DE (1) DE69810117T2 (zh)
TW (1) TW365561B (zh)
WO (1) WO1999006182A1 (zh)

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US6749714B1 (en) 1999-03-30 2004-06-15 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
US7717768B2 (en) 2005-05-18 2010-05-18 Sumco Corporation Wafer polishing apparatus and method for polishing wafers
TWI713526B (zh) * 2016-05-20 2020-12-21 智勝科技股份有限公司 基底層、具有基底層的研磨墊及研磨方法
TWI749562B (zh) * 2015-11-06 2021-12-11 美商應用材料股份有限公司 用於結合ｃｍｐ製程之追蹤資料與3d列印之ｃｍｐ耗材的技術

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US6210257B1 (en) * 1998-05-29 2001-04-03 Micron Technology, Inc. Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates
US6585574B1 (en) 1998-06-02 2003-07-01 Brian Lombardo Polishing pad with reduced moisture absorption
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US6402591B1 (en) 2000-03-31 2002-06-11 Lam Research Corporation Planarization system for chemical-mechanical polishing
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TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
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Publication number Priority date Publication date Assignee Title
US6749714B1 (en) 1999-03-30 2004-06-15 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
US7717768B2 (en) 2005-05-18 2010-05-18 Sumco Corporation Wafer polishing apparatus and method for polishing wafers
TWI749562B (zh) * 2015-11-06 2021-12-11 美商應用材料股份有限公司 用於結合ｃｍｐ製程之追蹤資料與3d列印之ｃｍｐ耗材的技術
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TWI713526B (zh) * 2016-05-20 2020-12-21 智勝科技股份有限公司 基底層、具有基底層的研磨墊及研磨方法

Also Published As

Publication number Publication date
DE69810117T2 (de) 2003-11-13
US6971950B2 (en) 2005-12-06
US6736714B2 (en) 2004-05-18
KR100646490B1 (ko) 2006-11-14
US20010034197A1 (en) 2001-10-25
EP0999918B1 (en) 2002-12-11
KR20010022464A (ko) 2001-03-15
JP2001512057A (ja) 2001-08-21
US20040087262A1 (en) 2004-05-06
WO1999006182A1 (en) 1999-02-11
US20030087594A1 (en) 2003-05-08
EP0999918A1 (en) 2000-05-17
AU8453298A (en) 1999-02-22
DE69810117D1 (de) 2003-01-23

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