TW365019B - Process flow design at the module effects level through the use of acceptability regions - Google Patents

Process flow design at the module effects level through the use of acceptability regions

Info

Publication number
TW365019B
TW365019B TW086104739A TW86104739A TW365019B TW 365019 B TW365019 B TW 365019B TW 086104739 A TW086104739 A TW 086104739A TW 86104739 A TW86104739 A TW 86104739A TW 365019 B TW365019 B TW 365019B
Authority
TW
Taiwan
Prior art keywords
levels
abstraction
modules
process flow
module
Prior art date
Application number
TW086104739A
Other languages
English (en)
Inventor
Sharad Saxena
Amy J Unruh
Purnendu K Mozumder
Richard G Burch
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW365019B publication Critical patent/TW365019B/zh

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • General Factory Administration (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
TW086104739A 1996-04-16 1997-04-14 Process flow design at the module effects level through the use of acceptability regions TW365019B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1552096P 1996-04-16 1996-04-16

Publications (1)

Publication Number Publication Date
TW365019B true TW365019B (en) 1999-07-21

Family

ID=21771877

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104739A TW365019B (en) 1996-04-16 1997-04-14 Process flow design at the module effects level through the use of acceptability regions

Country Status (4)

Country Link
EP (1) EP0802493A3 (zh)
JP (1) JPH1083943A (zh)
KR (1) KR100473138B1 (zh)
TW (1) TW365019B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002951790A0 (en) 2002-10-02 2002-10-17 Amcor Limited Unified design space
US8086992B2 (en) 2007-02-14 2011-12-27 Microsoft Corporation Enable top-down service design
CN104182637B (zh) * 2014-08-25 2017-02-08 山东九章膜技术有限公司 一种膜元件卷制过程中的胶水用量确定方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02232152A (ja) * 1989-03-03 1990-09-14 Mitsubishi Electric Corp 生産システムシミュレータ生成装置
US5050088A (en) * 1989-03-29 1991-09-17 Eastman Kodak Company Production control system and method
JPH0792808B2 (ja) * 1989-11-17 1995-10-09 三菱電機株式会社 形状シミュレーション方法
US5280425A (en) * 1990-07-26 1994-01-18 Texas Instruments Incorporated Apparatus and method for production planning
US5196997A (en) * 1991-01-22 1993-03-23 International Business Machines Corporation Method and apparatus for quality measure driven process control
US5402367A (en) * 1993-07-19 1995-03-28 Texas Instruments, Incorporated Apparatus and method for model based process control
JP3446256B2 (ja) * 1993-09-03 2003-09-16 株式会社日立製作所 Ｆａシステムの制御方法及び装置
US5408405A (en) * 1993-09-20 1995-04-18 Texas Instruments Incorporated Multi-variable statistical process controller for discrete manufacturing

Also Published As

Publication number Publication date
EP0802493A3 (en) 1999-11-03
KR19980077018A (ko) 1998-11-16
JPH1083943A (ja) 1998-03-31
EP0802493A2 (en) 1997-10-22
KR100473138B1 (ko) 2005-07-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees