WO2002101804A1 - Dispositif d'exposition, procede de fabrication et element de passage de flux de stabilisation de temperature - Google Patents

Dispositif d'exposition, procede de fabrication et element de passage de flux de stabilisation de temperature Download PDF

Info

Publication number
WO2002101804A1
WO2002101804A1 PCT/JP2002/005763 JP0205763W WO02101804A1 WO 2002101804 A1 WO2002101804 A1 WO 2002101804A1 JP 0205763 W JP0205763 W JP 0205763W WO 02101804 A1 WO02101804 A1 WO 02101804A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
gas
exposure
flow passage
exposure chamber
Prior art date
Application number
PCT/JP2002/005763
Other languages
English (en)
Japanese (ja)
Inventor
Yuzo Kato
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2003504451A priority Critical patent/JPWO2002101804A1/ja
Publication of WO2002101804A1 publication Critical patent/WO2002101804A1/fr

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

L'invention concerne un dispositif d'exposition (10) comportant des éléments de passage de flux de stabilisation de température (100A, 100B) constituant une partie des passages de flux pour le gaz alimenté par un élément d'alimentation (52, 56, 58, 62, 64). Après suppression d'une variation de température du gaz entrant, lesdits éléments de passage permettent au gaz de s'écouler dans une zone située à l'intérieur d'une chambre d'exposition (16), par exemple dans une zone mobile d'un étage de plaquette (WST) à l'intérieur d'une colonne principale (34), au travers d'unités de projection (102A, 102B). Par ailleurs, le gaz dont la température a été stabilisée peut être alimenté dans la chambre d'exposition et la faculté de commande de température peut être améliorée dans la chambre d'exposition par suppression d'une variation de température du gaz dans au moins une partie de l'intérieur de la chambre d'exposition.
PCT/JP2002/005763 2001-06-11 2002-06-11 Dispositif d'exposition, procede de fabrication et element de passage de flux de stabilisation de temperature WO2002101804A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003504451A JPWO2002101804A1 (ja) 2001-06-11 2002-06-11 露光装置及びデバイス製造方法、並びに温度安定化流路装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-176149 2001-06-11
JP2001176149 2001-06-11

Publications (1)

Publication Number Publication Date
WO2002101804A1 true WO2002101804A1 (fr) 2002-12-19

Family

ID=19017182

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/005763 WO2002101804A1 (fr) 2001-06-11 2002-06-11 Dispositif d'exposition, procede de fabrication et element de passage de flux de stabilisation de temperature

Country Status (2)

Country Link
JP (1) JPWO2002101804A1 (fr)
WO (1) WO2002101804A1 (fr)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005062462A (ja) * 2003-08-12 2005-03-10 Hoya Corp マスクブランクスの収納方法、マスクブランクス収納体及びマスクブランクスの製造方法
WO2006028188A1 (fr) * 2004-09-10 2006-03-16 Nikon Corporation Appareil à étage et appareil d’exposition
JP2006287160A (ja) * 2005-04-05 2006-10-19 Nikon Corp 露光装置及びデバイスの製造方法
JP2007158305A (ja) * 2005-10-21 2007-06-21 Asml Netherlands Bv ガスシャワー、リソグラフィ装置、及びガスシャワーの使用方法
JP2007184576A (ja) * 2005-12-21 2007-07-19 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
US7838182B2 (en) 2003-07-08 2010-11-23 Hoya Corporation Container for housing a mask blank, method of housing a mask blank, and mask blank package
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US8446579B2 (en) 2008-05-28 2013-05-21 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US8462317B2 (en) 2007-10-16 2013-06-11 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8520291B2 (en) 2007-10-16 2013-08-27 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US8675177B2 (en) 2003-04-09 2014-03-18 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in first and second pairs of areas
US8854601B2 (en) 2005-05-12 2014-10-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9097981B2 (en) 2007-10-12 2015-08-04 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9140993B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9164209B2 (en) 2003-11-20 2015-10-20 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power having different thicknesses to rotate linear polarization direction
CN113204175A (zh) * 2021-04-25 2021-08-03 华虹半导体(无锡)有限公司 浸润式光刻机曝光方法
CN113406864A (zh) * 2021-05-24 2021-09-17 上海顺灏新材料科技股份有限公司 光刻机外围设备集成监测系统及监测方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6660179B2 (ja) * 2015-12-28 2020-03-11 キヤノン株式会社 露光装置、および物品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6418002A (en) * 1987-07-14 1989-01-20 Nikon Corp Measuring apparatus
EP0838728A2 (fr) * 1996-10-24 1998-04-29 Nikon Corporation Système interférométriqeu avec manche à air pour dispositif porte-objet de précision
JPH1126363A (ja) * 1997-06-30 1999-01-29 Nikon Corp 露光装置
JP2000243684A (ja) * 1999-02-18 2000-09-08 Canon Inc 露光装置およびデバイス製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6418002A (en) * 1987-07-14 1989-01-20 Nikon Corp Measuring apparatus
EP0838728A2 (fr) * 1996-10-24 1998-04-29 Nikon Corporation Système interférométriqeu avec manche à air pour dispositif porte-objet de précision
JPH1126363A (ja) * 1997-06-30 1999-01-29 Nikon Corp 露光装置
JP2000243684A (ja) * 1999-02-18 2000-09-08 Canon Inc 露光装置およびデバイス製造方法

Cited By (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9678437B2 (en) 2003-04-09 2017-06-13 Nikon Corporation Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction
US9146474B2 (en) 2003-04-09 2015-09-29 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger and different linear polarization states in an on-axis area and a plurality of off-axis areas
US9164393B2 (en) 2003-04-09 2015-10-20 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in four areas
US9885959B2 (en) 2003-04-09 2018-02-06 Nikon Corporation Illumination optical apparatus having deflecting member, lens, polarization member to set polarization in circumference direction, and optical integrator
US8675177B2 (en) 2003-04-09 2014-03-18 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in first and second pairs of areas
US7838182B2 (en) 2003-07-08 2010-11-23 Hoya Corporation Container for housing a mask blank, method of housing a mask blank, and mask blank package
JP2005062462A (ja) * 2003-08-12 2005-03-10 Hoya Corp マスクブランクスの収納方法、マスクブランクス収納体及びマスクブランクスの製造方法
US9423697B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9760014B2 (en) 2003-10-28 2017-09-12 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9423698B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9244359B2 (en) 2003-10-28 2016-01-26 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9146476B2 (en) 2003-10-28 2015-09-29 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9140992B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9140993B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9164209B2 (en) 2003-11-20 2015-10-20 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power having different thicknesses to rotate linear polarization direction
US9885872B2 (en) 2003-11-20 2018-02-06 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light
US10281632B2 (en) 2003-11-20 2019-05-07 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power to rotate linear polarization direction
US9429848B2 (en) 2004-02-06 2016-08-30 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9423694B2 (en) 2004-02-06 2016-08-23 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10241417B2 (en) 2004-02-06 2019-03-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10234770B2 (en) 2004-02-06 2019-03-19 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10007194B2 (en) 2004-02-06 2018-06-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9140990B2 (en) 2004-02-06 2015-09-22 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
WO2006028188A1 (fr) * 2004-09-10 2006-03-16 Nikon Corporation Appareil à étage et appareil d’exposition
JPWO2006028188A1 (ja) * 2004-09-10 2008-05-08 株式会社ニコン ステージ装置及び露光装置
JP2006287160A (ja) * 2005-04-05 2006-10-19 Nikon Corp 露光装置及びデバイスの製造方法
US9429851B2 (en) 2005-05-12 2016-08-30 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9891539B2 (en) 2005-05-12 2018-02-13 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9310696B2 (en) 2005-05-12 2016-04-12 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US8854601B2 (en) 2005-05-12 2014-10-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9360763B2 (en) 2005-05-12 2016-06-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
JP2007158305A (ja) * 2005-10-21 2007-06-21 Asml Netherlands Bv ガスシャワー、リソグラフィ装置、及びガスシャワーの使用方法
JP4568710B2 (ja) * 2005-10-21 2010-10-27 エーエスエムエル ネザーランズ ビー．ブイ． ガスシャワー
JP2007184576A (ja) * 2005-12-21 2007-07-19 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
JP4576373B2 (ja) * 2005-12-21 2010-11-04 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置およびデバイス製造方法
US9057963B2 (en) 2007-09-14 2015-06-16 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US9366970B2 (en) 2007-09-14 2016-06-14 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US10101666B2 (en) 2007-10-12 2018-10-16 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9097981B2 (en) 2007-10-12 2015-08-04 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US8462317B2 (en) 2007-10-16 2013-06-11 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8508717B2 (en) 2007-10-16 2013-08-13 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8520291B2 (en) 2007-10-16 2013-08-27 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US9857599B2 (en) 2007-10-24 2018-01-02 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9341954B2 (en) 2007-10-24 2016-05-17 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9057877B2 (en) 2007-10-24 2015-06-16 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9678332B2 (en) 2007-11-06 2017-06-13 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US8446579B2 (en) 2008-05-28 2013-05-21 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
US8456624B2 (en) 2008-05-28 2013-06-04 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
CN113204175A (zh) * 2021-04-25 2021-08-03 华虹半导体(无锡)有限公司 浸润式光刻机曝光方法
CN113204175B (zh) * 2021-04-25 2022-10-28 华虹半导体(无锡)有限公司 浸润式光刻机曝光方法
CN113406864A (zh) * 2021-05-24 2021-09-17 上海顺灏新材料科技股份有限公司 光刻机外围设备集成监测系统及监测方法

Also Published As

Publication number Publication date
JPWO2002101804A1 (ja) 2004-09-30

Similar Documents

Publication Publication Date Title
WO2002101804A1 (fr) Dispositif d'exposition, procede de fabrication et element de passage de flux de stabilisation de temperature
WO2003019634A1 (fr) Procede de purge d'un dispositif de fabrication de semi-conducteurs et procede de fabrication de dispositif a semi-conducteur
AU2001241629A1 (en) Flow control of process gas in semiconductor manufacturing
WO2005124859A3 (fr) Procedes et appareils pour deposer des couches uniformes
WO2003024865A3 (fr) Procede pour la production de composants micro-electromecaniques
EP1304727A3 (fr) Système de manipulation de plaquette semiconductrice et méthode d'utilisation dans un procédé lithographique de formation de motifs
WO2002056350A3 (fr) Dispositif et procedes servant a manipuler des tranches de semi-conducteur
IL151931A0 (en) Narrowing implant
WO2005041804A3 (fr) Procede et appareil de fabrication d'aligneurs dentaires
EP2077577A4 (fr) Structure de silicium à ouverture ayant un rapport hauteur/largeur élevé, procédé, appareil et programme de fabrication de cette structure et procédé de fabrication de masque de gravure pour cette structure de silicium
HK1102367A1 (en) Methods for treatment of disease-induced peripheral neuropathy and related conditions
TW200618112A (en) Semiconductor device manufacturing method and plasma oxidation treatment method
EP1265276A4 (fr) Procede de formation de pellicule dielectrique
GB0211148D0 (en) Method and system for manufacturing 111-V group compound semiconductor and 111-V group compound semiconductor
CA2204939A1 (fr) Dispositif de regulation du debit de fluides
TW200518246A (en) Substrate and method for manufacturing the same
WO2004006278A3 (fr) Fabrication d'une grille couple a un materiau cathodique a emission de champ sur une nanostructure a l'interieur d'un dispositif
WO2005001853A3 (fr) Procede et dispositif de refroidissement pour elements de circuits magnetiques
WO2005083344A3 (fr) Dispositif et procede de transfert d'especes a rapport surface-masse ou a surface ou masse variable
AU4553199A (en) Variable orifice gas lift valve for high flow rates with detachable power sourceand method of using
WO2003003414A3 (fr) Appareil d'injection de gaz dirige destine au traitement de semi-conducteurs
AU2000226927A1 (en) Semiconductor integrated circuit device and method of producing the same, and method of producing masks
WO2001073157A3 (fr) Procede et dispositif destines a reduire les impuretes dans un sas de chargement de plaquettes d'un systeme de traitement de plaquettes a semi-conducteurs
NO20033309L (no) Gasslofteventil med venturi for regulering av injeksjonsgassstromning i oljebronner som produserer ved kontinuerlig gassloft
WO2005034163A3 (fr) Appareil et procede de traitement au plasma d'un substrat

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2003504451

Country of ref document: JP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase