TW200713297A - A shuttle mask layout method and a semiconductor element producing method using the same - Google Patents
A shuttle mask layout method and a semiconductor element producing method using the sameInfo
- Publication number
- TW200713297A TW200713297A TW094132255A TW94132255A TW200713297A TW 200713297 A TW200713297 A TW 200713297A TW 094132255 A TW094132255 A TW 094132255A TW 94132255 A TW94132255 A TW 94132255A TW 200713297 A TW200713297 A TW 200713297A
- Authority
- TW
- Taiwan
- Prior art keywords
- mask
- mass
- shuttle
- production
- major
- Prior art date
Links
Landscapes
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
A new shuttle mask layout method and a semiconductor element producing method using the same are provided. Several customers' circuit designs are commonly layout in a mass-production like shuttle mask. A major circuit design, needing many samples much more than those a conventional shuttle provides and possibly directing to mass production, takes more seats in center/major areas of the mask. Other circuit designs, only subject to silicon verification and not directing to mass production as this timeframe, take fewer seats in boundary area on one end of the mask. Then, engineering samples are produced based on the mass-product like shuttle mask. If the verification result of the major circuit design is passed, the boundary area of the mask, corresponding to non-major circuit designs, are blinded out and a mass-production mask with only the major circuit design is made. Then the major circuit design can go mass-production directly with the mass-production mask without re-generating a new full set of masks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094132255A TW200713297A (en) | 2005-09-19 | 2005-09-19 | A shuttle mask layout method and a semiconductor element producing method using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094132255A TW200713297A (en) | 2005-09-19 | 2005-09-19 | A shuttle mask layout method and a semiconductor element producing method using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200713297A true TW200713297A (en) | 2007-04-01 |
| TWI319856B TWI319856B (en) | 2010-01-21 |
Family
ID=45073674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094132255A TW200713297A (en) | 2005-09-19 | 2005-09-19 | A shuttle mask layout method and a semiconductor element producing method using the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200713297A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113497023A (en) * | 2020-03-20 | 2021-10-12 | 研能科技股份有限公司 | Long and narrow ink jet head chip |
| CN113492592A (en) * | 2020-03-20 | 2021-10-12 | 研能科技股份有限公司 | Method for manufacturing long and narrow ink jet head chip |
| US12005711B2 (en) | 2020-03-20 | 2024-06-11 | Microjet Technology Co., Ltd. | Manufacturing method of narrow type inkjet print head chip |
-
2005
- 2005-09-19 TW TW094132255A patent/TW200713297A/en not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113497023A (en) * | 2020-03-20 | 2021-10-12 | 研能科技股份有限公司 | Long and narrow ink jet head chip |
| CN113492592A (en) * | 2020-03-20 | 2021-10-12 | 研能科技股份有限公司 | Method for manufacturing long and narrow ink jet head chip |
| CN113492592B (en) * | 2020-03-20 | 2022-09-20 | 研能科技股份有限公司 | Method for manufacturing long and narrow ink jet head chip |
| CN113497023B (en) * | 2020-03-20 | 2024-02-06 | 研能科技股份有限公司 | Long and narrow type ink jet head chip |
| US12005711B2 (en) | 2020-03-20 | 2024-06-11 | Microjet Technology Co., Ltd. | Manufacturing method of narrow type inkjet print head chip |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI319856B (en) | 2010-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |