TW363997B - Epoxy resin compound for use in laminated sheet - Google Patents
Epoxy resin compound for use in laminated sheetInfo
- Publication number
- TW363997B TW363997B TW085102073A TW85102073A TW363997B TW 363997 B TW363997 B TW 363997B TW 085102073 A TW085102073 A TW 085102073A TW 85102073 A TW85102073 A TW 85102073A TW 363997 B TW363997 B TW 363997B
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- prepregs
- resin compound
- laminated sheet
- per molecule
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
- C08G59/5086—Triazines; Melamines; Guanamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03827495A JP3339240B2 (ja) | 1995-02-27 | 1995-02-27 | プリプレグの製造方法 |
JP7120795A JPH08269173A (ja) | 1995-03-29 | 1995-03-29 | エポキシ樹脂組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW363997B true TW363997B (en) | 1999-07-11 |
Family
ID=26377493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085102073A TW363997B (en) | 1995-02-27 | 1996-02-23 | Epoxy resin compound for use in laminated sheet |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0728789B1 (zh) |
DE (1) | DE69612522T2 (zh) |
TW (1) | TW363997B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11279376A (ja) * | 1998-03-27 | 1999-10-12 | Hitachi Chem Co Ltd | 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板 |
EP1153952A4 (en) * | 1999-12-14 | 2004-04-28 | Mitsui Chemicals Inc | SEALANT FOR LIQUID CRYSTAL DISPLAY CELL, COMPOSITION FOR SEALING LIQUID CRYSTAL DISPLAY CELLS AND LIQUID CRYSTAL DISPLAY ELEMENT |
JP3711842B2 (ja) * | 2000-06-01 | 2005-11-02 | ソニーケミカル株式会社 | 異方性導電接続材料及び接続構造体 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE755863A (fr) * | 1969-09-09 | 1971-03-08 | Ciba Geigy | Compositions durcissables de resines epoxydes |
-
1996
- 1996-02-22 DE DE1996612522 patent/DE69612522T2/de not_active Expired - Lifetime
- 1996-02-22 EP EP19960200451 patent/EP0728789B1/en not_active Expired - Lifetime
- 1996-02-23 TW TW085102073A patent/TW363997B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0728789A2 (en) | 1996-08-28 |
DE69612522D1 (de) | 2001-05-23 |
DE69612522T2 (de) | 2002-03-28 |
EP0728789B1 (en) | 2001-04-18 |
EP0728789A3 (en) | 1997-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |