MY135561A - Adhesive-coated copper foil - Google Patents

Adhesive-coated copper foil

Info

Publication number
MY135561A
MY135561A MYPI9400142A MY135561A MY 135561 A MY135561 A MY 135561A MY PI9400142 A MYPI9400142 A MY PI9400142A MY 135561 A MY135561 A MY 135561A
Authority
MY
Malaysia
Prior art keywords
adhesive
copper foil
resin
weight
parts
Prior art date
Application number
Inventor
Tetsuro Sato
Yoshinori Kanao
Yuji Tejima
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of MY135561A publication Critical patent/MY135561A/en

Links

Abstract

ADHESIVE-COATED COPPER FOIL CHARACTERIZED BY THAT THE ADHESIVE CONTAINS A RESIN CONTAINING ISOCYANURATE RINGS DEFINED AS WHERE R REPRESENTS ONE OF THE FOLLOWING SUBSTITUENTS A TO F: AND DOES NOT CONTAIN MELAMINE RESIN. SPECIFICALLY, THE ADHESIVE COMPRISES 5 TO 50 PARTS BY WEIGHT OF A RESIN CONTAINING ISOCYANURATE RINGS, 10 TO 50 PARTS BY WEIGHT OF POLY(VINYL ACETAL) RESIN, 5 TO 40 PARTS BY WEIGHT OF EPOXY RESIN, AND 1 TO 50 PARTS BY WEIGHT OF BLOCKED ISOCYANATE RESIN. THIS ADHESIVE HAS BOTH A GOOD ANTI-TRACKING PROPERTY AND A HIGH ACID RESISTANCE. THE ADHESIVE-COATED COPPER FOIL OF THIS INVENTION IS PREPARED BY FORMING AN ADHESIVE LAYER ON COPPER FOIL. COPPER-CLAD LAMINATE MANUFACTURED USING THIS COPPER FOIL IS SUITED TO CIRCUIT BOARDSF6R HIGH VOLTAGE CIRCUITS AND CAN SOLVE PROBLEMS CAUSED BY A LOW ETCHANT RESISTANCE.
MYPI9400142 1993-09-30 1994-01-19 Adhesive-coated copper foil MY135561A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26826993A JP3326448B2 (en) 1993-09-30 1993-09-30 Copper foil with adhesive layer

Publications (1)

Publication Number Publication Date
MY135561A true MY135561A (en) 2008-05-30

Family

ID=17456225

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9400142 MY135561A (en) 1993-09-30 1994-01-19 Adhesive-coated copper foil

Country Status (3)

Country Link
JP (1) JP3326448B2 (en)
CN (1) CN1089791C (en)
MY (1) MY135561A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3362804B2 (en) * 1993-10-25 2003-01-07 日立化成工業株式会社 Method for producing copper foil with adhesive and copper-clad laminate for multilayer printed wiring board using this copper foil with adhesive
WO1997002728A1 (en) * 1995-07-04 1997-01-23 Mitsui Mining & Smelting Co., Ltd. Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil
JP5265844B2 (en) * 2004-11-16 2013-08-14 日立化成株式会社 Thermosetting resin composition, prepreg, laminate and printed wiring board
US8318292B2 (en) * 2008-03-26 2012-11-27 Sumitomo Bakelite Co., Ltd. Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device
CN102786664B (en) * 2012-07-17 2014-07-23 常州大学 Low dielectric and high heat-resistant epoxy resin composition and its preparation method
CN110437402A (en) * 2019-08-09 2019-11-12 中国科学院兰州化学物理研究所 A kind of preparation method of the interpenetrating net polymer with shape-memory properties

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6270473A (en) * 1985-09-24 1987-03-31 Denki Kagaku Kogyo Kk Flexible printed board
DE4036802A1 (en) * 1990-11-19 1992-05-21 Huels Troisdorf METHOD FOR PRODUCING COPPER-COATED BASE MATERIAL PANELS

Also Published As

Publication number Publication date
JPH07106752A (en) 1995-04-21
CN1104669A (en) 1995-07-05
JP3326448B2 (en) 2002-09-24
CN1089791C (en) 2002-08-28

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