MY135561A - Adhesive-coated copper foil - Google Patents
Adhesive-coated copper foilInfo
- Publication number
- MY135561A MY135561A MYPI9400142A MY135561A MY 135561 A MY135561 A MY 135561A MY PI9400142 A MYPI9400142 A MY PI9400142A MY 135561 A MY135561 A MY 135561A
- Authority
- MY
- Malaysia
- Prior art keywords
- adhesive
- copper foil
- resin
- weight
- parts
- Prior art date
Links
Abstract
ADHESIVE-COATED COPPER FOIL CHARACTERIZED BY THAT THE ADHESIVE CONTAINS A RESIN CONTAINING ISOCYANURATE RINGS DEFINED AS WHERE R REPRESENTS ONE OF THE FOLLOWING SUBSTITUENTS A TO F: AND DOES NOT CONTAIN MELAMINE RESIN. SPECIFICALLY, THE ADHESIVE COMPRISES 5 TO 50 PARTS BY WEIGHT OF A RESIN CONTAINING ISOCYANURATE RINGS, 10 TO 50 PARTS BY WEIGHT OF POLY(VINYL ACETAL) RESIN, 5 TO 40 PARTS BY WEIGHT OF EPOXY RESIN, AND 1 TO 50 PARTS BY WEIGHT OF BLOCKED ISOCYANATE RESIN. THIS ADHESIVE HAS BOTH A GOOD ANTI-TRACKING PROPERTY AND A HIGH ACID RESISTANCE. THE ADHESIVE-COATED COPPER FOIL OF THIS INVENTION IS PREPARED BY FORMING AN ADHESIVE LAYER ON COPPER FOIL. COPPER-CLAD LAMINATE MANUFACTURED USING THIS COPPER FOIL IS SUITED TO CIRCUIT BOARDSF6R HIGH VOLTAGE CIRCUITS AND CAN SOLVE PROBLEMS CAUSED BY A LOW ETCHANT RESISTANCE.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26826993A JP3326448B2 (en) | 1993-09-30 | 1993-09-30 | Copper foil with adhesive layer |
Publications (1)
Publication Number | Publication Date |
---|---|
MY135561A true MY135561A (en) | 2008-05-30 |
Family
ID=17456225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI9400142 MY135561A (en) | 1993-09-30 | 1994-01-19 | Adhesive-coated copper foil |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3326448B2 (en) |
CN (1) | CN1089791C (en) |
MY (1) | MY135561A (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3362804B2 (en) * | 1993-10-25 | 2003-01-07 | 日立化成工業株式会社 | Method for producing copper foil with adhesive and copper-clad laminate for multilayer printed wiring board using this copper foil with adhesive |
WO1997002728A1 (en) * | 1995-07-04 | 1997-01-23 | Mitsui Mining & Smelting Co., Ltd. | Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil |
JP5265844B2 (en) * | 2004-11-16 | 2013-08-14 | 日立化成株式会社 | Thermosetting resin composition, prepreg, laminate and printed wiring board |
US8318292B2 (en) * | 2008-03-26 | 2012-11-27 | Sumitomo Bakelite Co., Ltd. | Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device |
CN102786664B (en) * | 2012-07-17 | 2014-07-23 | 常州大学 | Low dielectric and high heat-resistant epoxy resin composition and its preparation method |
CN110437402A (en) * | 2019-08-09 | 2019-11-12 | 中国科学院兰州化学物理研究所 | A kind of preparation method of the interpenetrating net polymer with shape-memory properties |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6270473A (en) * | 1985-09-24 | 1987-03-31 | Denki Kagaku Kogyo Kk | Flexible printed board |
DE4036802A1 (en) * | 1990-11-19 | 1992-05-21 | Huels Troisdorf | METHOD FOR PRODUCING COPPER-COATED BASE MATERIAL PANELS |
-
1993
- 1993-09-30 JP JP26826993A patent/JP3326448B2/en not_active Expired - Fee Related
-
1994
- 1994-01-19 MY MYPI9400142 patent/MY135561A/en unknown
- 1994-09-29 CN CN94115385A patent/CN1089791C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07106752A (en) | 1995-04-21 |
CN1104669A (en) | 1995-07-05 |
JP3326448B2 (en) | 2002-09-24 |
CN1089791C (en) | 2002-08-28 |
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