JPS57200588A - Nickel plating solution - Google Patents

Nickel plating solution

Info

Publication number
JPS57200588A
JPS57200588A JP8620281A JP8620281A JPS57200588A JP S57200588 A JPS57200588 A JP S57200588A JP 8620281 A JP8620281 A JP 8620281A JP 8620281 A JP8620281 A JP 8620281A JP S57200588 A JPS57200588 A JP S57200588A
Authority
JP
Japan
Prior art keywords
plating solution
fluorocarbon surfactant
film
plated
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8620281A
Other languages
Japanese (ja)
Inventor
Junji Ichimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8620281A priority Critical patent/JPS57200588A/en
Publication of JPS57200588A publication Critical patent/JPS57200588A/en
Pending legal-status Critical Current

Links

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To obtain a plating solution that improves the adhesion of a plated Ni film, and in particular is used as Ni plating for an electronic part sealed in an airtight fashion wherein the Ni film should not be peeled off when coaking is carried out, by adding a fluorocarbon surfactant to a Ni plating solution.
CONSTITUTION: In the above-mentioned plating solution, a fluorocarbon surfactant in an amount ranging 0.05W1.0% is added to a usual composition, for example, comprising a system of sulfuric acid, nickel chloride and boric acid with or without a brightner when the plating solution is prepared. Since the resulting plating solution contains the fluorocarbon surfactant in addition to the usual Ni plating solution composition, the adhesion of the plated Ni film is improved thereby a high quality electronic part can be obtained. As said fluorocarbon surfactant use is made of a commerically available one.
COPYRIGHT: (C)1982,JPO&Japio
JP8620281A 1981-06-04 1981-06-04 Nickel plating solution Pending JPS57200588A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8620281A JPS57200588A (en) 1981-06-04 1981-06-04 Nickel plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8620281A JPS57200588A (en) 1981-06-04 1981-06-04 Nickel plating solution

Publications (1)

Publication Number Publication Date
JPS57200588A true JPS57200588A (en) 1982-12-08

Family

ID=13880189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8620281A Pending JPS57200588A (en) 1981-06-04 1981-06-04 Nickel plating solution

Country Status (1)

Country Link
JP (1) JPS57200588A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6379991A (en) * 1986-09-20 1988-04-09 Shinko Electric Ind Co Ltd Nickel electroplating bath and plating method using the same
WO2015156390A1 (en) * 2014-04-11 2015-10-15 東洋鋼鈑株式会社 Surface-treated base

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6379991A (en) * 1986-09-20 1988-04-09 Shinko Electric Ind Co Ltd Nickel electroplating bath and plating method using the same
WO2015156390A1 (en) * 2014-04-11 2015-10-15 東洋鋼鈑株式会社 Surface-treated base
JP2015203123A (en) * 2014-04-11 2015-11-16 東洋鋼鈑株式会社 Surface treatment substrate
CN106103802A (en) * 2014-04-11 2016-11-09 东洋钢钣株式会社 Surface treatment base material
CN106103802B (en) * 2014-04-11 2019-06-04 东洋钢钣株式会社 It is surface-treated substrate

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