JPS57200588A - Nickel plating solution - Google Patents
Nickel plating solutionInfo
- Publication number
- JPS57200588A JPS57200588A JP8620281A JP8620281A JPS57200588A JP S57200588 A JPS57200588 A JP S57200588A JP 8620281 A JP8620281 A JP 8620281A JP 8620281 A JP8620281 A JP 8620281A JP S57200588 A JPS57200588 A JP S57200588A
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- fluorocarbon surfactant
- film
- plated
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To obtain a plating solution that improves the adhesion of a plated Ni film, and in particular is used as Ni plating for an electronic part sealed in an airtight fashion wherein the Ni film should not be peeled off when coaking is carried out, by adding a fluorocarbon surfactant to a Ni plating solution.
CONSTITUTION: In the above-mentioned plating solution, a fluorocarbon surfactant in an amount ranging 0.05W1.0% is added to a usual composition, for example, comprising a system of sulfuric acid, nickel chloride and boric acid with or without a brightner when the plating solution is prepared. Since the resulting plating solution contains the fluorocarbon surfactant in addition to the usual Ni plating solution composition, the adhesion of the plated Ni film is improved thereby a high quality electronic part can be obtained. As said fluorocarbon surfactant use is made of a commerically available one.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8620281A JPS57200588A (en) | 1981-06-04 | 1981-06-04 | Nickel plating solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8620281A JPS57200588A (en) | 1981-06-04 | 1981-06-04 | Nickel plating solution |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57200588A true JPS57200588A (en) | 1982-12-08 |
Family
ID=13880189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8620281A Pending JPS57200588A (en) | 1981-06-04 | 1981-06-04 | Nickel plating solution |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57200588A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6379991A (en) * | 1986-09-20 | 1988-04-09 | Shinko Electric Ind Co Ltd | Nickel electroplating bath and plating method using the same |
WO2015156390A1 (en) * | 2014-04-11 | 2015-10-15 | 東洋鋼鈑株式会社 | Surface-treated base |
-
1981
- 1981-06-04 JP JP8620281A patent/JPS57200588A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6379991A (en) * | 1986-09-20 | 1988-04-09 | Shinko Electric Ind Co Ltd | Nickel electroplating bath and plating method using the same |
WO2015156390A1 (en) * | 2014-04-11 | 2015-10-15 | 東洋鋼鈑株式会社 | Surface-treated base |
JP2015203123A (en) * | 2014-04-11 | 2015-11-16 | 東洋鋼鈑株式会社 | Surface treatment substrate |
CN106103802A (en) * | 2014-04-11 | 2016-11-09 | 东洋钢钣株式会社 | Surface treatment base material |
CN106103802B (en) * | 2014-04-11 | 2019-06-04 | 东洋钢钣株式会社 | It is surface-treated substrate |
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