TW358955B - Method for fabricating a field emission device having reduced row-to-column leakage - Google Patents
Method for fabricating a field emission device having reduced row-to-column leakageInfo
- Publication number
- TW358955B TW358955B TW086116687A TW86116687A TW358955B TW 358955 B TW358955 B TW 358955B TW 086116687 A TW086116687 A TW 086116687A TW 86116687 A TW86116687 A TW 86116687A TW 358955 B TW358955 B TW 358955B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- forming
- defining
- corresponding edge
- line guide
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000000059 patterning Methods 0.000 abstract 4
- 238000005530 etching Methods 0.000 abstract 3
- 230000005540 biological transmission Effects 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 230000005855 radiation Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/022—Manufacture of electrodes or electrode systems of cold cathodes
- H01J9/025—Manufacture of electrodes or electrode systems of cold cathodes of field emission cathodes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cold Cathode And The Manufacture (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/767,246 US5696385A (en) | 1996-12-13 | 1996-12-13 | Field emission device having reduced row-to-column leakage |
Publications (1)
Publication Number | Publication Date |
---|---|
TW358955B true TW358955B (en) | 1999-05-21 |
Family
ID=25078929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086116687A TW358955B (en) | 1996-12-13 | 1997-11-08 | Method for fabricating a field emission device having reduced row-to-column leakage |
Country Status (7)
Country | Link |
---|---|
US (2) | US5696385A (zh) |
EP (1) | EP0848406B1 (zh) |
JP (1) | JP3954710B2 (zh) |
KR (1) | KR100441184B1 (zh) |
CN (1) | CN1155979C (zh) |
DE (1) | DE69714392T2 (zh) |
TW (1) | TW358955B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9907020B2 (en) | 2014-06-10 | 2018-02-27 | Hewlett Packard Enterprise Development Lp | Wake up message transmission rate |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5908699A (en) * | 1996-10-11 | 1999-06-01 | Skion Corporation | Cold cathode electron emitter and display structure |
US6310432B1 (en) * | 1997-05-21 | 2001-10-30 | Si Diamond Technology, Inc. | Surface treatment process used in growing a carbon film |
US7070651B1 (en) * | 1997-05-21 | 2006-07-04 | Si Diamond Technology, Inc. | Process for growing a carbon film |
US6181056B1 (en) * | 1997-10-21 | 2001-01-30 | Si Diamond Technology, Inc. | Cold cathode carbon film |
GB2330687B (en) * | 1997-10-22 | 1999-09-29 | Printable Field Emitters Ltd | Field emission devices |
US6204597B1 (en) | 1999-02-05 | 2001-03-20 | Motorola, Inc. | Field emission device having dielectric focusing layers |
US6197607B1 (en) | 1999-03-01 | 2001-03-06 | Micron Technology, Inc. | Method of fabricating field emission arrays to optimize the size of grid openings and to minimize the occurrence of electrical shorts |
US6017772A (en) | 1999-03-01 | 2000-01-25 | Micron Technology, Inc. | Field emission arrays and method of fabricating emitter tips and corresponding resistors thereof with a single mask |
US6059625A (en) | 1999-03-01 | 2000-05-09 | Micron Technology, Inc. | Method of fabricating field emission arrays employing a hard mask to define column lines |
US6359383B1 (en) * | 1999-08-19 | 2002-03-19 | Industrial Technology Research Institute | Field emission display device equipped with nanotube emitters and method for fabricating |
JP3874396B2 (ja) | 2000-01-13 | 2007-01-31 | パイオニア株式会社 | 電子放出素子及びその製造方法並びに電子放出素子を用いた表示装置 |
US6753544B2 (en) * | 2001-04-30 | 2004-06-22 | Hewlett-Packard Development Company, L.P. | Silicon-based dielectric tunneling emitter |
US6911768B2 (en) * | 2001-04-30 | 2005-06-28 | Hewlett-Packard Development Company, L.P. | Tunneling emitter with nanohole openings |
US6542397B2 (en) | 2001-06-25 | 2003-04-01 | Lucent Technologies Inc. | Read only memory structure |
US6458676B1 (en) | 2001-06-25 | 2002-10-01 | Lucent Technologies Inc. | Method of varying the resistance along a conductive layer |
US20030073302A1 (en) * | 2001-10-12 | 2003-04-17 | Reflectivity, Inc., A California Corporation | Methods for formation of air gap interconnects |
US6558968B1 (en) * | 2001-10-31 | 2003-05-06 | Hewlett-Packard Development Company | Method of making an emitter with variable density photoresist layer |
KR100474271B1 (ko) * | 2002-08-16 | 2005-03-10 | 엘지전자 주식회사 | 전계방출소자 및 그 제조방법 |
KR100474272B1 (ko) * | 2002-08-16 | 2005-03-10 | 엘지전자 주식회사 | 평면형 전계방출소자 및 그 제조방법 |
KR20050096534A (ko) * | 2004-03-31 | 2005-10-06 | 삼성에스디아이 주식회사 | 전자 방출 표시 장치의 캐소드 기판 및 그 제조 방법 |
KR20050113045A (ko) * | 2004-05-28 | 2005-12-01 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 소자 및 그 제조방법 |
US7429820B2 (en) * | 2004-12-07 | 2008-09-30 | Motorola, Inc. | Field emission display with electron trajectory field shaping |
TWI329882B (en) * | 2005-08-25 | 2010-09-01 | Ind Tech Res Inst | Method of fabricating field emission display device and cathode plate thereof |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4040080A (en) * | 1976-03-22 | 1977-08-02 | Hamamatsu Terebi Kabushiki Kaisha | Semiconductor cold electron emission device |
JP2503621B2 (ja) * | 1989-01-23 | 1996-06-05 | 日本電気株式会社 | 半導体装置の製造方法 |
US5144191A (en) * | 1991-06-12 | 1992-09-01 | Mcnc | Horizontal microelectronic field emission devices |
US5397428A (en) * | 1991-12-20 | 1995-03-14 | The University Of North Carolina At Chapel Hill | Nucleation enhancement for chemical vapor deposition of diamond |
US5473218A (en) * | 1994-05-31 | 1995-12-05 | Motorola, Inc. | Diamond cold cathode using patterned metal for electron emission control |
DE69513581T2 (de) * | 1994-08-01 | 2000-09-07 | Motorola, Inc. | Bogen-Unterdrückungsvorrichtung für eine Feldemissionsvorrichtung |
US5826160A (en) * | 1995-08-14 | 1998-10-20 | The United States Of America As Represented By The Secretary Of The Army | Hot explosive consolidation of refractory metal and alloys |
US5719406A (en) * | 1996-10-08 | 1998-02-17 | Motorola, Inc. | Field emission device having a charge bleed-off barrier |
-
1996
- 1996-12-13 US US08/767,246 patent/US5696385A/en not_active Expired - Lifetime
-
1997
- 1997-08-18 US US08/912,612 patent/US5821132A/en not_active Expired - Fee Related
- 1997-10-24 KR KR1019970054933A patent/KR100441184B1/ko not_active IP Right Cessation
- 1997-11-08 TW TW086116687A patent/TW358955B/zh not_active IP Right Cessation
- 1997-11-26 DE DE69714392T patent/DE69714392T2/de not_active Expired - Fee Related
- 1997-11-26 EP EP97120736A patent/EP0848406B1/en not_active Expired - Lifetime
- 1997-12-10 JP JP36191997A patent/JP3954710B2/ja not_active Expired - Fee Related
- 1997-12-11 CN CNB971254540A patent/CN1155979C/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9907020B2 (en) | 2014-06-10 | 2018-02-27 | Hewlett Packard Enterprise Development Lp | Wake up message transmission rate |
Also Published As
Publication number | Publication date |
---|---|
EP0848406A3 (en) | 1998-08-12 |
DE69714392T2 (de) | 2003-01-16 |
KR19980063544A (ko) | 1998-10-07 |
EP0848406B1 (en) | 2002-07-31 |
JPH10177838A (ja) | 1998-06-30 |
JP3954710B2 (ja) | 2007-08-08 |
EP0848406A2 (en) | 1998-06-17 |
US5696385A (en) | 1997-12-09 |
US5821132A (en) | 1998-10-13 |
KR100441184B1 (ko) | 2004-12-29 |
DE69714392D1 (de) | 2002-09-05 |
CN1193834A (zh) | 1998-09-23 |
CN1155979C (zh) | 2004-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |