TW353158B - Aqueous photoresist composition, method for preparing the same and circuit board comprising thereof - Google Patents
Aqueous photoresist composition, method for preparing the same and circuit board comprising thereofInfo
- Publication number
- TW353158B TW353158B TW084101683A TW84101683A TW353158B TW 353158 B TW353158 B TW 353158B TW 084101683 A TW084101683 A TW 084101683A TW 84101683 A TW84101683 A TW 84101683A TW 353158 B TW353158 B TW 353158B
- Authority
- TW
- Taiwan
- Prior art keywords
- photoresist composition
- preparing
- circuit board
- same
- aqueous
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 5
- 229920002120 photoresistant polymer Polymers 0.000 title abstract 3
- -1 acrylate ester Chemical class 0.000 abstract 2
- 239000002585 base Substances 0.000 abstract 2
- 239000000839 emulsion Substances 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 abstract 1
- 229910052783 alkali metal Inorganic materials 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 229940117927 ethylene oxide Drugs 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 150000004965 peroxy acids Chemical class 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Materials For Photolithography (AREA)
- Paints Or Removers (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Polymerisation Methods In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20854694A | 1994-03-09 | 1994-03-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW353158B true TW353158B (en) | 1999-02-21 |
Family
ID=22774986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084101683A TW353158B (en) | 1994-03-09 | 1995-02-23 | Aqueous photoresist composition, method for preparing the same and circuit board comprising thereof |
Country Status (12)
Country | Link |
---|---|
US (1) | US5981147A (zh) |
EP (1) | EP0749594B1 (zh) |
JP (1) | JP3498147B2 (zh) |
KR (1) | KR970701874A (zh) |
CN (1) | CN1079958C (zh) |
AT (1) | ATE191799T1 (zh) |
AU (1) | AU1882595A (zh) |
CA (1) | CA2185028A1 (zh) |
DE (1) | DE69516275T2 (zh) |
ES (1) | ES2145907T3 (zh) |
TW (1) | TW353158B (zh) |
WO (1) | WO1995024674A1 (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU709577B2 (en) * | 1995-06-07 | 1999-09-02 | E.I. Du Pont De Nemours And Company | Process for using photoimageable films prepared from aqueous photoimageable liquid emulsions |
US5925499A (en) * | 1995-08-01 | 1999-07-20 | Morton International, Inc. | Epoxy-containing waterborne photoimageable composition |
US6576139B1 (en) * | 1996-07-30 | 2003-06-10 | Kenneth C. Hou | Process for purifying photoresist composition employing a filter sheet |
KR100533364B1 (ko) * | 1999-11-02 | 2005-12-06 | 주식회사 하이닉스반도체 | 레지스트 플로우 공정용 포토레지스트 조성물 및 이를이용한 콘택홀의 형성방법 |
JP2002322391A (ja) * | 2001-04-26 | 2002-11-08 | Jsr Corp | 水性被覆剤組成物および床用艶出し剤組成物 |
JP3850781B2 (ja) * | 2002-09-30 | 2006-11-29 | 富士通株式会社 | レジストパターン厚肉化材料、レジストパターンの形成方法、及び半導体装置の製造方法 |
JP3895269B2 (ja) * | 2002-12-09 | 2007-03-22 | 富士通株式会社 | レジストパターンの形成方法並びに半導体装置及びその製造方法 |
US7078157B2 (en) | 2003-02-27 | 2006-07-18 | Az Electronic Materials Usa Corp. | Photosensitive composition and use thereof |
KR101117939B1 (ko) | 2003-10-28 | 2012-02-29 | 사켐,인코포레이티드 | 세척액 및 에칭제 및 이의 사용 방법 |
EP1706041B1 (en) | 2003-12-18 | 2015-11-18 | DePuy Spine, Inc. | Surgical retractor systems, illuminated cannulas, and methods of use |
KR20050101458A (ko) * | 2004-04-19 | 2005-10-24 | 주식회사 하이닉스반도체 | 포토레지스트 세정액 조성물 및 이를 이용한 패턴 형성방법 |
US7981031B2 (en) | 2006-01-04 | 2011-07-19 | Depuy Spine, Inc. | Surgical access devices and methods of minimally invasive surgery |
US7918792B2 (en) | 2006-01-04 | 2011-04-05 | Depuy Spine, Inc. | Surgical retractor for use with minimally invasive spinal stabilization systems and methods of minimally invasive surgery |
US7758501B2 (en) | 2006-01-04 | 2010-07-20 | Depuy Spine, Inc. | Surgical reactors and methods of minimally invasive surgery |
US7955257B2 (en) * | 2006-01-05 | 2011-06-07 | Depuy Spine, Inc. | Non-rigid surgical retractor |
US8080587B2 (en) * | 2006-05-01 | 2011-12-20 | Fujifilm Corporation | Oil-in-water (O/W) emulsion coating compositing, laminate, polarizing plate, image display device and production method of the laminate |
KR101264688B1 (ko) * | 2006-06-23 | 2013-05-16 | 엘지디스플레이 주식회사 | 박막 패턴의 제조장치 및 방법 |
JP5465989B2 (ja) * | 2009-11-25 | 2014-04-09 | 株式会社パイロットコーポレーション | チャコ用焼成鉛筆芯 |
JP5484878B2 (ja) * | 2009-12-10 | 2014-05-07 | 日本乳化剤株式会社 | アルカノールアミンを含む水性樹脂組成物 |
CN103497325B (zh) * | 2013-08-20 | 2015-07-22 | 京东方科技集团股份有限公司 | 一种聚醚类化合物、其制备方法及光刻胶组合物 |
CN105884949A (zh) * | 2014-12-02 | 2016-08-24 | 苏州瑞红电子化学品有限公司 | 一种以支化型光敏聚苯乙烯马来酸酐为基体树脂的光刻胶组合物 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4115328A (en) * | 1977-01-07 | 1978-09-19 | Ciba-Geigy Corporation | Process for making stable solvent-free, aqueous epoxy resin dispersions |
US4293476A (en) * | 1979-08-02 | 1981-10-06 | The Dow Chemical Company | Interfacial cross-linking of latex films |
US4361640A (en) * | 1981-10-02 | 1982-11-30 | E. I. Du Pont De Nemours And Company | Aqueous developable photopolymer compositions containing terpolymer binder |
US4755446A (en) * | 1987-01-12 | 1988-07-05 | E. I. Du Pont De Nemours And Company | Photosensitive compositions containing microcapsules concentrated in surface layer |
FR2619570B1 (fr) * | 1987-08-20 | 1992-02-14 | Charbonnages Ste Chimique | Procede de fabrication d'une resine thermoplastique resistante au choc, comportant une etape de transfert des particules d'un latex de renforcement dans les monomeres de la matrice, par formation de complexes interpolymeres destabilisant le latex |
US5045435A (en) * | 1988-11-25 | 1991-09-03 | Armstrong World Industries, Inc. | Water-borne, alkali-developable, photoresist coating compositions and their preparation |
US5439766A (en) * | 1988-12-30 | 1995-08-08 | International Business Machines Corporation | Composition for photo imaging |
US5232815A (en) * | 1989-12-15 | 1993-08-03 | W. R. Grace & Co.-Conn. | Autodeposition emulsion and methods of using thereof to selectively protect metallic surfaces |
AU631719B2 (en) * | 1989-12-15 | 1992-12-03 | W.R. Grace & Co.-Conn. | Autodeposition emulsion for selectively protecting metallic surfaces |
CA2067921A1 (en) * | 1991-06-12 | 1992-12-13 | Alan Frederick Becknell | Method of making electrical circuit traces |
NZ244718A (en) * | 1991-11-19 | 1995-04-27 | Grace W R & Co | Photosensitive composition comprising an aba triblock polymer, a photosensitive initiator and a photosensitive unsaturated compound; use in a flexographic printing plate |
US5364737A (en) * | 1994-01-25 | 1994-11-15 | Morton International, Inc. | Waterbone photoresists having associate thickeners |
US5576145A (en) * | 1995-02-10 | 1996-11-19 | Morton International, Inc. | Esterified styrene/maleic anhydride polymer and polymer-containing photoimageable composition having improved alkaline process resistance |
US5609991A (en) * | 1995-02-10 | 1997-03-11 | Morton International, Inc. | Photoimageable composition having improved alkaline process resistance and tack-free surface for contact imaging |
-
1995
- 1995-02-23 TW TW084101683A patent/TW353158B/zh active
- 1995-02-24 CN CN95192017A patent/CN1079958C/zh not_active Expired - Lifetime
- 1995-02-24 AT AT95911101T patent/ATE191799T1/de active
- 1995-02-24 JP JP52348795A patent/JP3498147B2/ja not_active Expired - Lifetime
- 1995-02-24 AU AU18825/95A patent/AU1882595A/en not_active Abandoned
- 1995-02-24 WO PCT/US1995/002331 patent/WO1995024674A1/en active IP Right Grant
- 1995-02-24 EP EP95911101A patent/EP0749594B1/en not_active Expired - Lifetime
- 1995-02-24 KR KR1019960704951A patent/KR970701874A/ko not_active Application Discontinuation
- 1995-02-24 DE DE69516275T patent/DE69516275T2/de not_active Expired - Lifetime
- 1995-02-24 ES ES95911101T patent/ES2145907T3/es not_active Expired - Lifetime
- 1995-02-24 CA CA002185028A patent/CA2185028A1/en not_active Abandoned
-
1997
- 1997-04-08 US US08/835,873 patent/US5981147A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1079958C (zh) | 2002-02-27 |
CN1143418A (zh) | 1997-02-19 |
ES2145907T3 (es) | 2000-07-16 |
EP0749594A1 (en) | 1996-12-27 |
EP0749594B1 (en) | 2000-04-12 |
JP3498147B2 (ja) | 2004-02-16 |
AU1882595A (en) | 1995-09-25 |
EP0749594A4 (en) | 1997-07-23 |
KR970701874A (ko) | 1997-04-12 |
WO1995024674A1 (en) | 1995-09-14 |
DE69516275D1 (de) | 2000-05-18 |
US5981147A (en) | 1999-11-09 |
CA2185028A1 (en) | 1995-09-14 |
ATE191799T1 (de) | 2000-04-15 |
JPH09510027A (ja) | 1997-10-07 |
DE69516275T2 (de) | 2000-08-10 |
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