TW352352B - Laser beam cutting machine, focusing jig and laser beam focusing diameter measuring device - Google Patents

Laser beam cutting machine, focusing jig and laser beam focusing diameter measuring device

Info

Publication number
TW352352B
TW352352B TW087101166A TW87101166A TW352352B TW 352352 B TW352352 B TW 352352B TW 087101166 A TW087101166 A TW 087101166A TW 87101166 A TW87101166 A TW 87101166A TW 352352 B TW352352 B TW 352352B
Authority
TW
Taiwan
Prior art keywords
laser beam
focusing
laser
cutting machine
measuring device
Prior art date
Application number
TW087101166A
Other languages
English (en)
Inventor
Akaru Usui
Shinji Sato
Hisao Tanaka
Hirokazu Miyakawa
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW352352B publication Critical patent/TW352352B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035Aligning the laser beam
    • B23K26/037Aligning the laser beam by pressing on the workpiece, e.g. pressing roller foot
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462Nozzles; Features related to nozzles
    • B23K26/1464Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476Features inside the nozzle for feeding the fluid stream through the nozzle
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW087101166A 1997-06-05 1998-02-02 Laser beam cutting machine, focusing jig and laser beam focusing diameter measuring device TW352352B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9148342A JPH10328867A (ja) 1997-06-05 1997-06-05 レーザビーム加工装置およびレーザビーム加工装置用の焦点位置決め治具およびレーザビーム集光直径測定治具

Publications (1)

Publication Number Publication Date
TW352352B true TW352352B (en) 1999-02-11

Family

ID=15450634

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087101166A TW352352B (en) 1997-06-05 1998-02-02 Laser beam cutting machine, focusing jig and laser beam focusing diameter measuring device

Country Status (6)

Country Link
US (1) US5948292A (zh)
JP (1) JPH10328867A (zh)
CA (1) CA2228192C (zh)
DE (1) DE19803795A1 (zh)
FR (1) FR2764222A1 (zh)
TW (1) TW352352B (zh)

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JP3745899B2 (ja) * 1998-04-13 2006-02-15 ヤマザキマザック株式会社 レーザ加工機
KR100370553B1 (ko) * 2000-02-29 2003-01-29 주식회사 이오테크닉스 평면 부재를 가공하는 방법 및 그 장치
JP4277429B2 (ja) * 2000-07-27 2009-06-10 株式会社デンソー 高密度エネルギビーム加工方法およびその装置
US6423928B1 (en) * 2000-10-12 2002-07-23 Ase Americas, Inc. Gas assisted laser cutting of thin and fragile materials
JP3383832B2 (ja) 2000-12-25 2003-03-10 川崎重工業株式会社 レーザ照射装置
US6713718B1 (en) * 2001-11-27 2004-03-30 Vi Engineering, Inc. Scoring process and apparatus with confocal optical measurement
US20030227614A1 (en) * 2002-06-05 2003-12-11 Taminiau August A. Laser machining apparatus with automatic focusing
DE10336861B3 (de) * 2003-08-11 2004-12-09 Siemens Ag Verfahren zur Bestimmung der Oberflächenposition eines Werkstückes innerhalb einer Laserbearbeitungsmaschine
WO2007062130A1 (en) * 2005-11-22 2007-05-31 J.P. Sercel Associates Inc. System and method for laser machining of three-dimensional structures
EP2062676B1 (de) * 2007-11-26 2012-01-25 Bystronic Laser AG Wechsel-Modul für einen modularen Bearbeitungskopf einer Laserbearbeitungsmaschine ; entsprechende modularen Bearbeitungskopf und Laserbearbeitungsmaschine
EP2062679B1 (de) * 2007-11-26 2015-01-07 Bystronic Laser AG Bearbeitungskopf einer Laserbearbeitungsmaschine mit einer Zuführung von Gas und einer Kompensationseinrichtung zur Kompensation der von zugeführtem Gas übertragenen Kräfte
DE102008010981A1 (de) 2008-02-25 2009-08-27 Mtu Aero Engines Gmbh Verfahren und Vorrichtung zur automatischen Laserfokussierung
JP4778031B2 (ja) * 2008-09-26 2011-09-21 日立ビアメカニクス株式会社 レーザ加工機
CN101780649B (zh) * 2009-01-16 2012-10-10 鸿富锦精密工业(深圳)有限公司 刀具检测系统及方法
JP5611609B2 (ja) * 2010-02-10 2014-10-22 日本車輌製造株式会社 レーザ加工機
US8967298B2 (en) * 2010-02-24 2015-03-03 Gas Technology Institute Transmission of light through light absorbing medium
EP2468449B1 (de) * 2010-12-21 2015-01-28 TRUMPF Werkzeugmaschinen GmbH + Co. KG Vorrichtung und Verfahren zur Abschirmung eines Laserstrahls an einer Laserbearbeitungsmaschine zum Bearbeiten von Werkstücken mit Mittels zur Erfassung der Ausrichtung der Stirnfläche des Abschirmungsorgans
US8829388B2 (en) * 2011-07-29 2014-09-09 Ipg Photonics Corporation Method for contactless laser welding and apparatus
CN103212789A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 一种接触式稳定焦点位置的切割头
CN103894733B (zh) * 2014-04-10 2016-06-01 西安航空动力股份有限公司 一种涡轮导向叶片气膜孔的激光加工夹具
EP2957378A1 (de) * 2014-06-16 2015-12-23 Synova SA Bearbeitungskopf zum Einkopplen eines Laserstrahles in einem Flüssigkeitsstrahl mit einer Flüssigkeitschnittstelle
EP3219429B1 (de) * 2016-03-17 2019-07-31 TRUMPF Werkzeugmaschinen GmbH + Co. KG Werkzeugmaschine mit einer stanzvorrichtung und einer laserbearbeitungsvorrichtung sowie verfahren zum bearbeiten von werkstücken mittels einer derartigen werkzeugmaschine
JP6363660B2 (ja) * 2016-07-13 2018-07-25 ファナック株式会社 レーザ加工装置及びレーザ加工システム
JP6382901B2 (ja) * 2016-09-29 2018-08-29 ファナック株式会社 レーザー加工システム
CN109922919A (zh) * 2016-11-03 2019-06-21 株式会社半导体能源研究所 激光加工装置、叠层体加工装置及激光加工方法
CN107979028B (zh) * 2017-10-24 2024-03-22 汉得利(常州)电子股份有限公司 激光剥线机和激光剥线机的剥线方法
BR112020009263B1 (pt) * 2017-12-04 2023-01-10 Nippon Steel Corporation Bico de acompanhamento de superfície, dispositivo de observação para superfície de objeto em movimento e método de observação para superfície de objeto de movimento
KR102395306B1 (ko) * 2017-12-15 2022-05-09 현대자동차주식회사 레이저 융착 장치
FR3077749B1 (fr) * 2018-02-14 2020-01-24 Psa Automobiles Sa Dispositif pour la mesure de puissance d’un faisceau laser d’une tete de soudage laser par tiret
KR102454256B1 (ko) * 2018-02-22 2022-10-17 삼성디스플레이 주식회사 기판 절단 장치
CN109967897B (zh) * 2019-04-01 2024-05-03 浙江华工光润智能装备技术有限公司 一种适用于激光打孔的定位夹紧装置
CN110142507A (zh) * 2019-05-13 2019-08-20 大族激光科技产业集团股份有限公司 一种金属板的激光焊接系统和方法
JP7496711B2 (ja) * 2020-05-12 2024-06-07 株式会社ディスコ レーザー加工装置
TR202011860A2 (tr) * 2020-07-27 2020-10-21 Isse Uluslararasi Ticaret Ve Lazer Teknolojileri Sanayi Ltd Sirketi Lazer kesi̇m maki̇neleri̇ i̇çi̇n sac baski aparati

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US4031351A (en) * 1972-10-25 1977-06-21 Groupement Atomique Alsacienne Atlantique High energy laser beam cutting method and apparatus
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Also Published As

Publication number Publication date
CA2228192A1 (en) 1998-12-05
FR2764222A1 (fr) 1998-12-11
US5948292A (en) 1999-09-07
CA2228192C (en) 2001-03-06
DE19803795A1 (de) 1998-12-10
JPH10328867A (ja) 1998-12-15

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