TW347597B - Method of forming a groove in a semiconductor laser diode and a semiconductor laser diode - Google Patents
Method of forming a groove in a semiconductor laser diode and a semiconductor laser diodeInfo
- Publication number
- TW347597B TW347597B TW084100840A TW84100840A TW347597B TW 347597 B TW347597 B TW 347597B TW 084100840 A TW084100840 A TW 084100840A TW 84100840 A TW84100840 A TW 84100840A TW 347597 B TW347597 B TW 347597B
- Authority
- TW
- Taiwan
- Prior art keywords
- etching
- semiconductor laser
- laser diode
- forming
- procedure
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 6
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000005530 etching Methods 0.000 abstract 7
- 239000010410 layer Substances 0.000 abstract 4
- 239000013078 crystal Substances 0.000 abstract 3
- 239000012792 core layer Substances 0.000 abstract 2
- 230000000737 periodic effect Effects 0.000 abstract 2
- 238000000206 photolithography Methods 0.000 abstract 1
- 238000001039 wet etching Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2081—Methods of obtaining the confinement using special etching techniques
- H01S5/209—Methods of obtaining the confinement using special etching techniques special etch stop layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2206—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on III-V materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2206—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on III-V materials
- H01S5/2209—GaInP based
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
- H01S5/2275—Buried mesa structure ; Striped active layer mesa created by etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Geometry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP02736894A JP3795931B2 (ja) | 1994-01-31 | 1994-01-31 | 半導体発光素子 |
JP2737094A JPH07221345A (ja) | 1994-01-31 | 1994-01-31 | 半導体発光素子構造におけるグルーブの形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW347597B true TW347597B (en) | 1998-12-11 |
Family
ID=26365283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084100840A TW347597B (en) | 1994-01-31 | 1995-01-28 | Method of forming a groove in a semiconductor laser diode and a semiconductor laser diode |
Country Status (4)
Country | Link |
---|---|
US (2) | US5566198A (zh) |
EP (1) | EP0666625B1 (zh) |
DE (1) | DE69502211T2 (zh) |
TW (1) | TW347597B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0964452A (ja) * | 1995-08-18 | 1997-03-07 | Mitsubishi Electric Corp | 半導体レーザ装置,及びその製造方法 |
JPH09116222A (ja) * | 1995-10-17 | 1997-05-02 | Mitsubishi Electric Corp | 半導体レーザの製造方法,及び半導体レーザ |
US6172998B1 (en) * | 1996-11-18 | 2001-01-09 | Mitsubishi Chemical Corporation | Semiconductor laser diode |
US6074960A (en) * | 1997-08-20 | 2000-06-13 | Micron Technology, Inc. | Method and composition for selectively etching against cobalt silicide |
JP3607061B2 (ja) * | 1997-10-29 | 2005-01-05 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
GB2346735B (en) * | 1999-02-13 | 2004-03-31 | Sharp Kk | A semiconductor laser device |
US6304587B1 (en) | 1999-06-14 | 2001-10-16 | Corning Incorporated | Buried ridge semiconductor laser with aluminum-free confinement layer |
US6400743B1 (en) * | 1999-08-05 | 2002-06-04 | Fuji Photo Film Co., Ltd. | High-power semiconductor laser device having current confinement structure and index-guided structure |
WO2001022545A1 (fr) * | 1999-09-22 | 2001-03-29 | Mitsubishi Chemical Corporation | Element lumineux et module d'element lumineux |
US6888867B2 (en) * | 2001-08-08 | 2005-05-03 | Nobuhiko Sawaki | Semiconductor laser device and fabrication method thereof |
CN1259760C (zh) * | 2001-08-31 | 2006-06-14 | 三井化学株式会社 | 半导体激光元件 |
JP2003273467A (ja) * | 2002-03-15 | 2003-09-26 | Toshiba Corp | 半導体レーザおよびその製造方法 |
US8324010B2 (en) | 2010-06-29 | 2012-12-04 | Himax Imaging, Inc. | Light pipe etch control for CMOS fabrication |
US20120018831A1 (en) * | 2010-07-20 | 2012-01-26 | Himax Imaging, Inc. | Light pipe fabrication with improved sensitivity |
KR102440071B1 (ko) * | 2020-10-16 | 2022-09-05 | (주)큐에스아이 | 반도체 레이저 다이오드 소자 및 그 제조 방법 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58175886A (ja) * | 1982-04-07 | 1983-10-15 | Mitsubishi Electric Corp | 半導体レ−ザ |
JPS599990A (ja) * | 1982-07-07 | 1984-01-19 | Mitsubishi Electric Corp | 半導体レ−ザの製造方法 |
US4613387A (en) * | 1983-02-28 | 1986-09-23 | Itt Industries Inc. | Injection laser manufacture |
US4661961A (en) * | 1983-06-20 | 1987-04-28 | American Telephone And Telegraph Company, At&T Bell Laboratories | Buried heterostructure devices with unique contact-facilitating layers |
JPS60154689A (ja) * | 1984-01-25 | 1985-08-14 | Hitachi Ltd | 発光素子およびこれを用いた光通信装置 |
GB2160823B (en) * | 1984-06-28 | 1987-05-28 | Stc Plc | Semiconductor devices and their fabrication |
GB2175442B (en) * | 1985-05-15 | 1989-05-24 | Stc Plc | Laser manufacture |
GB8622767D0 (en) * | 1986-09-22 | 1986-10-29 | British Telecomm | Semiconductor structures |
JP2561163B2 (ja) * | 1990-02-28 | 1996-12-04 | 富士通株式会社 | メサ埋め込み型光半導体装置の製造方法 |
JPH0485503A (ja) * | 1990-07-30 | 1992-03-18 | Nippon Telegr & Teleph Corp <Ntt> | 半導体光入出力回路の製造方法 |
KR940005764B1 (ko) * | 1991-02-06 | 1994-06-23 | 삼성전자 주식회사 | 레이저 다이오드 어레이 및 그 제조방법 |
US5212704A (en) * | 1991-11-27 | 1993-05-18 | At&T Bell Laboratories | Article comprising a strained layer quantum well laser |
US5257276A (en) * | 1992-04-03 | 1993-10-26 | California Institute Of Technology | Strained layer InP/InGaAs quantum well laser |
JP2823476B2 (ja) * | 1992-05-14 | 1998-11-11 | 三菱電機株式会社 | 半導体レーザおよびその製造方法 |
NL9301656A (nl) * | 1993-09-24 | 1995-04-18 | Nederland Ptt | Geintegreerde optische polarisatie-omzetter met versterkte periodieke koppeling. |
KR100357787B1 (ko) * | 1994-01-31 | 2003-01-24 | 가부시끼가이샤 히다치 세이사꾸쇼 | 도파로형광소자의제조방법 |
US5665614A (en) * | 1995-06-06 | 1997-09-09 | Hughes Electronics | Method for making fully self-aligned submicron heterojunction bipolar transistor |
-
1995
- 1995-01-28 TW TW084100840A patent/TW347597B/zh active
- 1995-01-30 DE DE69502211T patent/DE69502211T2/de not_active Expired - Fee Related
- 1995-01-30 US US08/380,836 patent/US5566198A/en not_active Expired - Fee Related
- 1995-01-30 EP EP95300557A patent/EP0666625B1/en not_active Expired - Lifetime
-
1996
- 1996-07-22 US US08/681,017 patent/US5920767A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69502211D1 (de) | 1998-06-04 |
EP0666625A1 (en) | 1995-08-09 |
US5566198A (en) | 1996-10-15 |
DE69502211T2 (de) | 1998-09-17 |
US5920767A (en) | 1999-07-06 |
EP0666625B1 (en) | 1998-04-29 |
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