TW347482B - Apparatus and method for bonding tape - Google Patents

Apparatus and method for bonding tape

Info

Publication number
TW347482B
TW347482B TW084110234A TW84110234A TW347482B TW 347482 B TW347482 B TW 347482B TW 084110234 A TW084110234 A TW 084110234A TW 84110234 A TW84110234 A TW 84110234A TW 347482 B TW347482 B TW 347482B
Authority
TW
Taiwan
Prior art keywords
tape
length
anisotropically electroconductive
anisotropically
substrate
Prior art date
Application number
TW084110234A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroaki Sakai
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6236892A external-priority patent/JP3060850B2/ja
Priority claimed from JP24279094A external-priority patent/JP3206331B2/ja
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Application granted granted Critical
Publication of TW347482B publication Critical patent/TW347482B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW084110234A 1994-09-30 1995-09-30 Apparatus and method for bonding tape TW347482B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6236892A JP3060850B2 (ja) 1994-09-30 1994-09-30 異方性導電テープの圧着方法
JP24279094A JP3206331B2 (ja) 1994-10-06 1994-10-06 異方性導電テープの貼着装置及び異方性導電テープの貼着方法

Publications (1)

Publication Number Publication Date
TW347482B true TW347482B (en) 1998-12-11

Family

ID=26532926

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084110234A TW347482B (en) 1994-09-30 1995-09-30 Apparatus and method for bonding tape

Country Status (3)

Country Link
KR (1) KR100285171B1 (ko)
TW (1) TW347482B (ko)
WO (1) WO1996010838A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5698443A (en) * 1995-06-27 1997-12-16 Calydon, Inc. Tissue specific viral vectors
US6676935B2 (en) 1995-06-27 2004-01-13 Cell Genesys, Inc. Tissue specific adenoviral vectors
JP3704502B2 (ja) * 2002-01-15 2005-10-12 松下電器産業株式会社 粘着シート貼付装置、粘着シート貼付方法、部品実装機、及びディスププレイパネルの製造方法。

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02293721A (ja) * 1989-05-08 1990-12-04 Sharp Corp 異方性導電膜貼り付け方法
JP2769263B2 (ja) * 1992-06-22 1998-06-25 ケル株式会社 転写用異方性接着剤テープの作成方法および装置
JP3045427B2 (ja) * 1992-06-22 2000-05-29 ソニー株式会社 異方性導電膜の貼付け方法および装置

Also Published As

Publication number Publication date
WO1996010838A1 (en) 1996-04-11
KR970706601A (ko) 1997-11-03
KR100285171B1 (ko) 2001-03-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees