TW347482B - Apparatus and method for bonding tape - Google Patents

Apparatus and method for bonding tape

Info

Publication number
TW347482B
TW347482B TW084110234A TW84110234A TW347482B TW 347482 B TW347482 B TW 347482B TW 084110234 A TW084110234 A TW 084110234A TW 84110234 A TW84110234 A TW 84110234A TW 347482 B TW347482 B TW 347482B
Authority
TW
Taiwan
Prior art keywords
tape
length
anisotropically electroconductive
anisotropically
substrate
Prior art date
Application number
TW084110234A
Other languages
Chinese (zh)
Inventor
Hiroaki Sakai
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6236892A external-priority patent/JP3060850B2/en
Priority claimed from JP24279094A external-priority patent/JP3206331B2/en
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Application granted granted Critical
Publication of TW347482B publication Critical patent/TW347482B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

An apparatus for bonding an anisotropically electroconductive tape onto a substrate, which includes a tape supply unit for supplying a length of leader tape having a length of anisotropically electroconductive tape bonded to one of opposite surfaces thereof; a tape transport unit for transporting the length of leader tape so supplied in a transport direction; a cutting unit for cutting only the length of anisotropically electroconductive tape to provide an anisotropically electroconductive tape segment of a predetermined length; a substrate positioning unit for positioning the substrate to which the anisotropically electroconductive tape segment is to be bonded; and a tape applicator unit for pressing the anisotropically electronconductive tape segment against the substrate to bond the former to the latter; the cutting unit including two cutter blades for forming respective incisions in the length of anisotropically electroconductive tape and a length of adhesive tape used to remove a piece of anisotropically electroconductive tape bound between the incisions to leave a space of separation driving the length of anisotropically electroconductive tape into the anisotropically electroconductive tape segment and the remaining anisotropically electroconductive tape.
TW084110234A 1994-09-30 1995-09-30 Apparatus and method for bonding tape TW347482B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6236892A JP3060850B2 (en) 1994-09-30 1994-09-30 Crimping method of anisotropic conductive tape
JP24279094A JP3206331B2 (en) 1994-10-06 1994-10-06 Apparatus for attaching anisotropic conductive tape and method for attaching anisotropic conductive tape

Publications (1)

Publication Number Publication Date
TW347482B true TW347482B (en) 1998-12-11

Family

ID=26532926

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084110234A TW347482B (en) 1994-09-30 1995-09-30 Apparatus and method for bonding tape

Country Status (3)

Country Link
KR (1) KR100285171B1 (en)
TW (1) TW347482B (en)
WO (1) WO1996010838A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5698443A (en) * 1995-06-27 1997-12-16 Calydon, Inc. Tissue specific viral vectors
US6676935B2 (en) 1995-06-27 2004-01-13 Cell Genesys, Inc. Tissue specific adenoviral vectors
JP3704502B2 (en) * 2002-01-15 2005-10-12 松下電器産業株式会社 A pressure-sensitive adhesive sheet sticking apparatus, a pressure-sensitive adhesive sheet sticking method, a component mounting machine, and a display panel manufacturing method.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02293721A (en) * 1989-05-08 1990-12-04 Sharp Corp Method for sticking anisotropic conductive film
JP2769263B2 (en) * 1992-06-22 1998-06-25 ケル株式会社 Method and apparatus for producing anisotropic adhesive tape for transfer
JP3045427B2 (en) * 1992-06-22 2000-05-29 ソニー株式会社 Method and apparatus for attaching anisotropic conductive film

Also Published As

Publication number Publication date
WO1996010838A1 (en) 1996-04-11
KR970706601A (en) 1997-11-03
KR100285171B1 (en) 2001-03-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees