KR970706601A - APPARATUS AND METHOD FOR BONDING TAPE - Google Patents

APPARATUS AND METHOD FOR BONDING TAPE

Info

Publication number
KR970706601A
KR970706601A KR1019970702108A KR19970702108A KR970706601A KR 970706601 A KR970706601 A KR 970706601A KR 1019970702108 A KR1019970702108 A KR 1019970702108A KR 19970702108 A KR19970702108 A KR 19970702108A KR 970706601 A KR970706601 A KR 970706601A
Authority
KR
South Korea
Prior art keywords
length
tape
conductive tape
anisotropic conductive
segment
Prior art date
Application number
KR1019970702108A
Other languages
Korean (ko)
Other versions
KR100285171B1 (en
Inventor
히로아키 사카이
Original Assignee
모리시타 요이찌
마쓰시타 덴키 산교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6236892A external-priority patent/JP3060850B2/en
Priority claimed from JP24279094A external-priority patent/JP3206331B2/en
Application filed by 모리시타 요이찌, 마쓰시타 덴키 산교 가부시키가이샤 filed Critical 모리시타 요이찌
Publication of KR970706601A publication Critical patent/KR970706601A/en
Application granted granted Critical
Publication of KR100285171B1 publication Critical patent/KR100285171B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)

Abstract

기판(4)에 이방성 전기전도 테이프(2)를 접착하는 장치는 대향면중 하나에 접착된 비등성 전기전도 테이프(2)의 길이를 지닌 리더 테이프(1)의 길이를 공급하는 테이프 공급유닛(21); 이송방향(M)으로 공급된 리더 테이프(1)의 길이를 이송하는 테이프 이송유닛(22); 소정의 길이의 이방성 전기전도 테이프 새그먼트(107)을 제공하기 위해 이방성 전기전도 테이프(2) 길이만을 절단하는 절단 유닛(23); 이방성 전기전도 테이프 새그먼트(107)가 접착되는 기판(4)을 위치시키는 기판위치 조절유닛(10); 및 기판(4)에 대해 이방성 전기전도 테이프 새그먼트(107)을 프레싱하여 상기 새그먼트를 기판에 접착시키는 테이프 적용 유닛(19);을 구비하고 있다. 절단유닛(23)은 이방성 전기전도 테이프의 길이를 이방성 전기전도 테이프 새그먼트(2)와 나머지 이방성 전기전도 테이프로 분할하는 분리공간(95)을 남기도록 절단사이에 접착된 이방성 전기전도 테이프(2)의 조각을 제거하는데 이용되는 접착테이프의 길이와 이방성 전기전도 테이프(2)의 길이에 각각의 절단을 형성하는 두개의 컷터 브레이드(93,94)을 포함한다.The apparatus for bonding the anisotropic conductive tape 2 to the substrate 4 includes a tape feeding unit (not shown) for feeding the length of the leader tape 1 having the length of the non-conforming electrically conductive tape 2 bonded to one of the opposing surfaces 21); A tape conveying unit (22) for conveying the length of the leader tape (1) supplied in the conveying direction (M); A cutting unit (23) for cutting only the length of the anisotropic conductive tape (2) to provide an anisotropic conductive tape segment (107) of a predetermined length; A substrate position adjusting unit (10) for positioning a substrate (4) to which an anisotropic conductive tape segment (107) is adhered; And a tape applying unit (19) for pressing the anisotropic conductive tape segment (107) against the substrate (4) to adhere the segment to the substrate. The cutting unit 23 has an anisotropic electrically conductive tape 2 bonded between the cuts so as to leave a separation space 95 for dividing the length of the anisotropic electrically conductive tape into the anisotropic electrically conductive tape segment 2 and the remaining anisotropic electrically conductive tape. And two cutter blades 93 and 94 forming respective cuts in the length of the anisotropic conductive tape 2 and the length of the adhesive tape used to remove the pieces of the anisotropic conductive tape 2.

Description

테이프 접착장치 및 방법(APPARATUS AND METHOD DOR BONDING TAPE)APPARATUS AND METHOD DOR BONDING TAPE

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제27도는 상이한 작동위치에 유지된 여러 부품을 지닌 본 발명의 테이프 접착 장치의 작동의 순서를 도시한 개략도.FIG. 27 is a schematic view showing the sequence of operation of a tape bonding apparatus of the present invention having various components held in different operating positions; FIG.

Claims (3)

대항면중 하나에 접착된 이방성 전기전도 테이프의 길이를 갖는 리더 테이프의 길이를 공급하는 리더 테이프공급 메카니즘과; 소정의 길이의 이방성을 전기전도 테이프 새그먼트를 제공하기 위해 리더 테이프 공급유닛으로부터 공급된 이방성 전기전도 테이프의 길이만을 절단하는 컷터와; 리더 테이프의 길이를 통해 이방성 전기전도 테이프 새그먼트를 프레싱하여 이를 기판에 접착하는 압력적용 공구와; 기판에 대해 압력적용 공구를 프레싱하는 프레싱 메카니즘과; 이방성 전기전도 테이프 새그먼트로부터 리더 테이프의 길이의 부분벗기는 리더 테이프 벗김 메카니즘을 구비한 기판에 이방성 전기전도 테이프를 접착하는 장치에 있어서, 이러한 이방성 전기전도 테이프 새그먼트가 기판에 접착되도록 프레스되기전에 이송방향의 압력 적용공구 하류의 일단이 이송방향에 대해 이방성 전기전도 테이프 새그먼트의 종단과 일치하는 것을 특징으로 하는 접착장치.A leader tape feeding mechanism for feeding the length of the leader tape having the length of the anisotropic electrically conductive tape bonded to one of the opposing faces; A cutter for cutting only the length of the anisotropic conductive tape supplied from the leader tape supply unit to provide the anisotropic property of the predetermined length to the conductive tape segment; A pressure applying tool pressing the anisotropic conductive tape segment through the length of the leader tape and bonding it to the substrate; A pressing mechanism for pressing the pressure applying tool against the substrate; An apparatus for adhering an anisotropic conductive tape to a substrate having a leader tape peeling mechanism for stripping a portion of the length of the leader tape from the anisotropic conductive tape segment, Wherein one end of the downstream side of the pressure application tool coincides with the end of the anisotropic conductive tape segment with respect to the transport direction. 청구항1에 있어서, 이송방향 상류의 압력적용 공구의 상기단은 리더 테이프공급 메카니즘에 의해 이송방향 리더 테이프의 길이를 공급함으로써 서로 일치하는 것을 특징으로 하는 접착장치.The bonding apparatus according to claim 1, wherein said end of the pressure application tool upstream in the transport direction coincides with each other by supplying a length of the transport direction leader tape by a leader tape supply mechanism. 소정의 이송방향으로 리더 테이프 공급 메타니즘으로부터 리더 테이프의 길이를 끌어 당기는 단계와; 소정의 길이의 이방성 전기전도 테이프 새그먼트를 제공하기 위해 리더 테이프의 길이에 접착되어서 리더 테이프 공급 메카니즘으로부터 끌어당겨진 이방성; 전기전도 테이프를 절단하는 단계와; 이방성 전기전도 테이프 새그먼트의 길이보다 큰 길이의 압력 적용면을 지닌 압력적용공구와 일단으로부터 대향단으로 리더 테이프의 길이를 이송하고 또한 이송방향에 대한 이방성 전기전도 테이프의 종단을 압력적용공구의 상기일단과 일치시키는 단계와; 상기 이방성 전기전도 테이프 새그먼트를 기판에 접착하기 위해 압력적용면에 의해 기판에 대해 이방성 전기전도 테이프 새그먼트를 리더 테이프의 길이를 통해 프레싱하는 단계와; 기판에 접착된 이방성 전기전도 테이프 새그먼트로부터 리더 테이프의 길이를 벗기는 단계를 구비한 것을 특징으로 하는 기판에 접착하기 위해 리더 테이프의 길이의 대향면중한에 접착된 이방성 전기전도 테이프를 프레싱하는 방법.Pulling the length of the leader tape from the leader tape supply mechanism in a predetermined transport direction; Anisotropy bonded to the length of the leader tape to provide a length of anisotropic conductive tape segment and pulled from the leader tape supply mechanism; Cutting the electrically conductive tape; The pressure application tool having a pressure application surface of a length greater than the length of the anisotropic conductive tape segment and the length of the leader tape from one end to the opposite end and also the end of the anisotropic conductive tape with respect to the transport direction, A step of matching with one end; Pressing an anisotropic conductive tape segment through the length of the leader tape against the substrate by a pressure application surface to bond the anisotropic conductive tape segment to the substrate; And removing the length of the leader tape from the anisotropic conductive tape segment bonded to the substrate. 6. A method for pressing an anisotropic conductive tape adhered to an opposing face of a length of a leader tape for bonding to a substrate. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019970702108A 1994-09-30 1995-09-28 Tape Adhesive Device and Method KR100285171B1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP94-236892 1994-09-30
JP6236892A JP3060850B2 (en) 1994-09-30 1994-09-30 Crimping method of anisotropic conductive tape
JP24279094A JP3206331B2 (en) 1994-10-06 1994-10-06 Apparatus for attaching anisotropic conductive tape and method for attaching anisotropic conductive tape
JP94-242790 1994-10-06
PCT/JP1995/001964 WO1996010838A1 (en) 1994-09-30 1995-09-28 Apparatus and method for bonding tape

Publications (2)

Publication Number Publication Date
KR970706601A true KR970706601A (en) 1997-11-03
KR100285171B1 KR100285171B1 (en) 2001-03-15

Family

ID=26532926

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970702108A KR100285171B1 (en) 1994-09-30 1995-09-28 Tape Adhesive Device and Method

Country Status (3)

Country Link
KR (1) KR100285171B1 (en)
TW (1) TW347482B (en)
WO (1) WO1996010838A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5698443A (en) * 1995-06-27 1997-12-16 Calydon, Inc. Tissue specific viral vectors
US6676935B2 (en) 1995-06-27 2004-01-13 Cell Genesys, Inc. Tissue specific adenoviral vectors
JP3704502B2 (en) * 2002-01-15 2005-10-12 松下電器産業株式会社 A pressure-sensitive adhesive sheet sticking apparatus, a pressure-sensitive adhesive sheet sticking method, a component mounting machine, and a display panel manufacturing method.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02293721A (en) * 1989-05-08 1990-12-04 Sharp Corp Method for sticking anisotropic conductive film
JP3045427B2 (en) * 1992-06-22 2000-05-29 ソニー株式会社 Method and apparatus for attaching anisotropic conductive film
JP2769263B2 (en) * 1992-06-22 1998-06-25 ケル株式会社 Method and apparatus for producing anisotropic adhesive tape for transfer

Also Published As

Publication number Publication date
WO1996010838A1 (en) 1996-04-11
TW347482B (en) 1998-12-11
KR100285171B1 (en) 2001-03-15

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