TW343426B - Process for producing a circuit board at least having a metal layer, circuit board thereof and its use - Google Patents

Process for producing a circuit board at least having a metal layer, circuit board thereof and its use

Info

Publication number
TW343426B
TW343426B TW086108309A TW86108309A TW343426B TW 343426 B TW343426 B TW 343426B TW 086108309 A TW086108309 A TW 086108309A TW 86108309 A TW86108309 A TW 86108309A TW 343426 B TW343426 B TW 343426B
Authority
TW
Taiwan
Prior art keywords
circuit board
connection range
producing
metal layer
connection
Prior art date
Application number
TW086108309A
Other languages
English (en)
Inventor
Karlheinz Wienand Dr
Muziol Matthias
Original Assignee
Heraeus Sensor Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Sensor Gmbh filed Critical Heraeus Sensor Gmbh
Application granted granted Critical
Publication of TW343426B publication Critical patent/TW343426B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49794—Dividing on common outline
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53796—Puller or pusher means, contained force multiplying operator
    • Y10T29/53848—Puller or pusher means, contained force multiplying operator having screw operator
    • Y10T29/53852—C-frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
TW086108309A 1996-08-20 1997-06-16 Process for producing a circuit board at least having a metal layer, circuit board thereof and its use TW343426B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19633486A DE19633486C1 (de) 1996-08-20 1996-08-20 Verfahren zur Herstellung einer Leiterplatte mit dünnen Leiterbahnen und Anschluß-Kontaktierungsbereichen sowie deren Verwendung

Publications (1)

Publication Number Publication Date
TW343426B true TW343426B (en) 1998-10-21

Family

ID=7803090

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086108309A TW343426B (en) 1996-08-20 1997-06-16 Process for producing a circuit board at least having a metal layer, circuit board thereof and its use

Country Status (5)

Country Link
US (2) US6226864B1 (zh)
JP (1) JPH10117063A (zh)
KR (1) KR19980018524A (zh)
DE (1) DE19633486C1 (zh)
TW (1) TW343426B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI706142B (zh) * 2017-08-07 2020-10-01 聯華電子股份有限公司 電性測試結構

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60318032T2 (de) * 2002-04-04 2008-11-20 Monsanto Technology Llc Automatisiertes system zum aufnehmen, wägen und sortieren von teilchenförmigem material
US6936793B1 (en) 2002-04-17 2005-08-30 Novastar Technologiesm Inc. Oven apparatus and method of use thereof
DE102005001727B4 (de) * 2005-01-13 2018-01-18 Seuffer gmbH & Co. KG Elektrischer Bauelementträger
TWI387191B (zh) * 2009-06-02 2013-02-21 Richtek Technology Corp 電壓模式切換式電源供應電路、及其控制電路與方法
TWI381170B (zh) * 2009-09-17 2013-01-01 Cyntec Co Ltd 電流感測用電阻裝置與製造方法
AT12722U1 (de) * 2010-03-16 2012-10-15 Austria Tech & System Tech Verfahren und verbund zum bearbeiten bzw. behandeln einer mehrzahl von leiterplatten sowie verwendung hiefür
US9305687B2 (en) * 2010-05-13 2016-04-05 Cyntec Co., Ltd. Current sensing resistor
CN105430918A (zh) * 2015-12-07 2016-03-23 惠州Tcl移动通信有限公司 Pcb板的制作方法
CN108323007A (zh) * 2018-01-29 2018-07-24 上海康斐信息技术有限公司 一种印制电路板拼接结构及其拼接方法

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US3332912A (en) * 1963-12-18 1967-07-25 Ibm Component with standoff and method of making same
US3882059A (en) * 1973-05-11 1975-05-06 Technical Ceramics Inc Method of making ceramic capacitor
DE2410849B2 (de) * 1974-03-07 1979-12-06 Blaupunkt-Werke Gmbh, 3200 Hildesheim Verfahren zum Auflöten von Miniatur-Bauelementen
US3916515A (en) * 1974-09-26 1975-11-04 Northern Electric Co Method of producing printed circuit board in multiple units
US4312896A (en) * 1978-08-07 1982-01-26 Graham Magnetics, Inc. Novel soldering process comprising coating a dielectric substrate with electroconductive metal protected by nickel carbide
DE3002112A1 (de) * 1980-01-22 1981-07-23 Robert Bosch Gmbh, 7000 Stuttgart Paste mit vorgebbarer elektrischer leitfaehigkeit
DE8003431U1 (de) * 1980-02-09 1980-05-14 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Messwiderstand fuer widerstandsthermometer
US4434134A (en) * 1981-04-10 1984-02-28 International Business Machines Corporation Pinned ceramic substrate
DE3345219C1 (de) 1983-12-14 1985-03-21 Daimler-Benz Ag, 7000 Stuttgart Lötfolie zur spannungsfreien Verbindung von Keramikkörpern mit Metall
US4525644A (en) * 1984-04-09 1985-06-25 Sigurd Frohlich Piezoelectric-enhanced circuit connection means
US4759490A (en) * 1986-10-23 1988-07-26 Fujitsu Limited Method for soldering electronic components onto a printed wiring board using a solder paste
DE3838968A1 (de) * 1988-01-22 1989-07-27 Asea Brown Boveri Verbundwerkstoff auf der basis von kohlenstoff-fasern als bewehrungsgeruest und einer metallischen matrix als fuellstoff und verfahren zu dessen herstellung
KR970004752B1 (ko) * 1989-03-07 1997-04-03 로-무 가부시기가이샤 전자장치의 제조방법 및 그 제조에 사용되는 소재기판 및 이 소재기판으로부터의 프린트기판의 절단장치
JP3011433B2 (ja) * 1990-05-25 2000-02-21 株式会社東芝 セラミックス回路基板の製造方法
US5242225A (en) * 1990-06-11 1993-09-07 Murata Manufacturing Co., Ltd. Temperature sensor
DE4020383C2 (de) * 1990-06-27 1999-04-01 Bosch Gmbh Robert Verfahren zum Schutz von Katalysatoren für die Abgasreinigung sowie Wärmetönungssensor zur Durchführung des Verfahrens
DE4025715C1 (zh) * 1990-08-14 1992-04-02 Robert Bosch Gmbh, 7000 Stuttgart, De
US5573692A (en) * 1991-03-11 1996-11-12 Philip Morris Incorporated Platinum heater for electrical smoking article having ohmic contact
DE4113335C1 (zh) * 1991-04-24 1992-11-05 Dr. Johannes Heidenhain Gmbh, 8225 Traunreut, De
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US5661086A (en) * 1995-03-28 1997-08-26 Mitsui High-Tec, Inc. Process for manufacturing a plurality of strip lead frame semiconductor devices
DE19540194C1 (de) * 1995-10-30 1997-02-20 Heraeus Sensor Gmbh Widerstandsthermometer aus einem Metall der Platingruppe
US5778520A (en) * 1996-07-03 1998-07-14 Kim; Jong Tae Method of making an assembly package in an air tight cavity and a product made by the method
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI706142B (zh) * 2017-08-07 2020-10-01 聯華電子股份有限公司 電性測試結構

Also Published As

Publication number Publication date
US6469614B2 (en) 2002-10-22
US20010015287A1 (en) 2001-08-23
DE19633486C1 (de) 1998-01-15
US6226864B1 (en) 2001-05-08
JPH10117063A (ja) 1998-05-06
KR19980018524A (ko) 1998-06-05

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