TW338760B - Carrier tape and die apparatus for forming the same - Google Patents

Carrier tape and die apparatus for forming the same

Info

Publication number
TW338760B
TW338760B TW086115203A TW86115203A TW338760B TW 338760 B TW338760 B TW 338760B TW 086115203 A TW086115203 A TW 086115203A TW 86115203 A TW86115203 A TW 86115203A TW 338760 B TW338760 B TW 338760B
Authority
TW
Taiwan
Prior art keywords
carrier tape
sections
receiving
semiconductor package
positioning
Prior art date
Application number
TW086115203A
Other languages
English (en)
Inventor
Hiroshi Kato
Tomoyasu Kato
Yasuyuki Takao
Original Assignee
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Polymer Co filed Critical Shinetsu Polymer Co
Application granted granted Critical
Publication of TW338760B publication Critical patent/TW338760B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00Packages comprising articles attached to cards, sheets or webs
    • B65D73/02Articles, e.g. small electrical components, attached to webs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/26Component parts, details or accessories; Auxiliary operations
    • B29C51/30Moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04Attaching a series of articles, e.g. small electrical components, to a continuous web
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
TW086115203A 1996-10-18 1997-10-16 Carrier tape and die apparatus for forming the same TW338760B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8295864A JP2933130B2 (ja) 1996-10-18 1996-10-18 キャリアテープおよびキャリアテープ成形用金型装置

Publications (1)

Publication Number Publication Date
TW338760B true TW338760B (en) 1998-08-21

Family

ID=17826182

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086115203A TW338760B (en) 1996-10-18 1997-10-16 Carrier tape and die apparatus for forming the same

Country Status (5)

Country Link
US (1) US6179127B1 (zh)
JP (1) JP2933130B2 (zh)
KR (1) KR100323269B1 (zh)
MY (1) MY126728A (zh)
TW (1) TW338760B (zh)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69827927T2 (de) * 1997-09-10 2006-03-02 Yayoi Corp. Verpackung für bandförmige Artikel, Verpackungsvorrichtung für Artikel und Verschlüsse
JP3133303B2 (ja) * 1999-05-01 2001-02-05 ミラエ・コーポレーション マイクロbga型素子用キャリヤーモジュール
JP3247662B2 (ja) * 1999-05-17 2002-01-21 信越ポリマー株式会社 キャリアテープ
US6975021B1 (en) 1999-09-03 2005-12-13 Micron Technology, Inc. Carrier for substrate film
US6329220B1 (en) * 1999-11-23 2001-12-11 Micron Technology, Inc. Packages for semiconductor die
JP2002019832A (ja) * 2000-07-11 2002-01-23 Oki Electric Ind Co Ltd エンボスキャリアテープ
JP3507012B2 (ja) * 2000-07-11 2004-03-15 沖電気工業株式会社 エンボスキャリアテープ
US6559537B1 (en) * 2000-08-31 2003-05-06 Micron Technology, Inc. Ball grid array packages with thermally conductive containers
SG143929A1 (en) 2000-12-07 2008-07-29 Sumitomo Bakelite Co Method and mold for producing thermoplastic resin container
US6557707B1 (en) * 2001-11-05 2003-05-06 Ultra -Pak Industries Co., Ltd. Electronic component packaging strip
US6608370B1 (en) * 2002-01-28 2003-08-19 Motorola, Inc. Semiconductor wafer having a thin die and tethers and methods of making the same
US6809936B2 (en) * 2002-02-07 2004-10-26 E.Pak International, Inc. Integrated circuit component carrier with angled supporting and retaining surfaces
AU2003234441A1 (en) * 2002-05-01 2003-11-17 Entegris, Inc. Carrier tape for electronic components
TW557913U (en) * 2002-07-26 2003-10-11 Hon Hai Prec Ind Co Ltd Packing device of electrical connector
DE10309210B4 (de) * 2003-02-28 2006-04-27 Leica Mikrosysteme Gmbh Verwendung eines Transportbehälters für Objektträger zur immunologischen Markierung für Gewebedünnschnitte
JP2005047565A (ja) * 2003-07-29 2005-02-24 Sumitomo Bakelite Co Ltd 電子部品の収納されたエンボスキャリアテープ
US7874434B2 (en) * 2003-11-06 2011-01-25 Sharp Kabushiki Kaisha Substrate carrying tray
US20070074996A1 (en) * 2005-10-05 2007-04-05 Nice Travis S Carrier tape and heat shrinking cover tape for integrated circuit devices
US20080000804A1 (en) * 2006-06-29 2008-01-03 Carey David A Carrier tape with integrated cover tape
US7442045B1 (en) 2007-08-17 2008-10-28 Centipede Systems, Inc. Miniature electrical ball and tube socket with self-capturing multiple-contact-point coupling
US8485511B2 (en) 2009-03-11 2013-07-16 Centipede Systems, Inc. Method and apparatus for holding microelectronic devices
WO2011038295A1 (en) * 2009-09-26 2011-03-31 Centipede Systems, Inc. Carrier for holding microelectronic devices
WO2011038297A1 (en) * 2009-09-26 2011-03-31 Centipede Systems, Inc. Apparatus for holding microelectronic devices
US20110089079A1 (en) * 2009-10-18 2011-04-21 Yu-Nan Lo Chip Carrying Tray
CN201793171U (zh) * 2010-05-07 2011-04-13 富士康(昆山)电脑接插件有限公司 连接器包装盒
TW201225200A (en) * 2010-12-07 2012-06-16 Powertech Technology Inc Tape
US9346151B2 (en) 2010-12-07 2016-05-24 Centipede Systems, Inc. Precision carrier for microelectronic devices
US8683674B2 (en) 2010-12-07 2014-04-01 Centipede Systems, Inc. Method for stacking microelectronic devices
CN102569123A (zh) * 2010-12-17 2012-07-11 力成科技股份有限公司 卷带
TWI482725B (zh) * 2011-05-06 2015-05-01 Lextar Electronics Corp 封合帶改良結構
US8453843B1 (en) 2012-07-27 2013-06-04 International Business Machines Corporation Tray for transporting semiconductor devices of a BGA type
JP6543256B2 (ja) * 2014-07-29 2019-07-10 積水化学工業株式会社 フィルム成形体及びそれを用いたフィルム包装体、フィルム成形体の製造方法及びフィルム包装体の製造方法
JP2023132205A (ja) * 2022-03-10 2023-09-22 株式会社村田製作所 電子部品包装体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2821307A (en) * 1955-01-18 1958-01-28 Linsley Inc Holder for fuses and other articles
JPH0258573A (ja) * 1988-08-24 1990-02-27 Hodogaya Chem Co Ltd ロイコトリアリールメタン化合物
GB8825154D0 (en) 1988-10-27 1988-11-30 Reel Service Ltd Tape for storage of electronic components
US5361901A (en) * 1991-02-12 1994-11-08 Minnesota Mining And Manufacturing Company Carrier tape
US5152393A (en) * 1991-07-08 1992-10-06 Advantek, Inc. Microchip storage tape
JP2862203B2 (ja) 1994-06-28 1999-03-03 信越ポリマー株式会社 Bgaパッケージ用キャリアテープ

Also Published As

Publication number Publication date
KR100323269B1 (ko) 2002-08-22
KR19980032955A (ko) 1998-07-25
US6179127B1 (en) 2001-01-30
JPH10120077A (ja) 1998-05-12
JP2933130B2 (ja) 1999-08-09
MY126728A (en) 2006-10-31

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Legal Events

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