TW302315B - - Google Patents

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Publication number
TW302315B
TW302315B TW085107370A TW85107370A TW302315B TW 302315 B TW302315 B TW 302315B TW 085107370 A TW085107370 A TW 085107370A TW 85107370 A TW85107370 A TW 85107370A TW 302315 B TW302315 B TW 302315B
Authority
TW
Taiwan
Prior art keywords
vibration
ultrasonic
welding
load
vibration amplitude
Prior art date
Application number
TW085107370A
Other languages
English (en)
Chinese (zh)
Inventor
Yukiharu Akiyama
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW302315B publication Critical patent/TW302315B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
TW085107370A 1995-07-26 1996-06-18 TW302315B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07190410A JP3086158B2 (ja) 1995-07-26 1995-07-26 超音波ボンディング方法

Publications (1)

Publication Number Publication Date
TW302315B true TW302315B (https=) 1997-04-11

Family

ID=16257685

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085107370A TW302315B (https=) 1995-07-26 1996-06-18

Country Status (4)

Country Link
US (1) US5884835A (https=)
JP (1) JP3086158B2 (https=)
KR (1) KR100456381B1 (https=)
TW (1) TW302315B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449245B (zh) * 2011-04-07 2014-08-11 Nissan Motor Separator welding device, and the isolation of the welding method

Families Citing this family (31)

* Cited by examiner, † Cited by third party
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US6079607A (en) * 1997-04-29 2000-06-27 Texas Instruments Incorporated Method for high frequency bonding
US6165888A (en) * 1997-10-02 2000-12-26 Motorola, Inc. Two step wire bond process
JPH11330134A (ja) * 1998-05-12 1999-11-30 Hitachi Ltd ワイヤボンディング方法およびその装置並びに半導体装置
JP3942738B2 (ja) * 1998-07-17 2007-07-11 松下電器産業株式会社 バンプ接合装置及び方法、並びに半導体部品製造装置
JP2000278073A (ja) * 1999-03-26 2000-10-06 Asahi Rubber Kk 超音波複合振動を用いた表面実装型振動子等の封止方法
JP3474132B2 (ja) * 1999-09-28 2003-12-08 インターナショナル・ビジネス・マシーンズ・コーポレーション ワイヤボンディング方法および装置
US6814823B1 (en) 1999-09-16 2004-11-09 Solidica, Inc. Object consolidation through sequential material deposition
US6519500B1 (en) 1999-09-16 2003-02-11 Solidica, Inc. Ultrasonic object consolidation
JP3227444B2 (ja) * 1999-11-10 2001-11-12 ソニーケミカル株式会社 多層構造のフレキシブル配線板とその製造方法
US6279810B1 (en) * 2000-02-23 2001-08-28 Asm Assembly Automation Ltd Piezoelectric sensor for measuring bonding parameters
ATE371265T1 (de) * 2000-04-20 2007-09-15 Elwyn Paul Michael Wakefield Verfahren zur herstellung elektrischer/mechanischer verbindungen
US6299052B1 (en) * 2000-06-28 2001-10-09 American Technology, Inc. Anti-slide splice welder
KR20030066344A (ko) * 2002-02-01 2003-08-09 에섹 트레이딩 에스에이 와이어본더로 접합시에 최적의 접합 파라미터들을결정하기 위한 방법
JP3860088B2 (ja) * 2002-07-25 2006-12-20 Ｎｅｃエレクトロニクス株式会社 ボンディング方法及びボンディング装置
US7170181B2 (en) * 2003-11-19 2007-01-30 International Business Machines Corporation Optimum padset for wire bonding RF technologies with high-Q inductors
JP4403955B2 (ja) * 2004-03-05 2010-01-27 セイコーエプソン株式会社 ワイヤボンディング方法
DE102004026826B4 (de) * 2004-05-28 2010-01-14 Schunk Ultraschalltechnik Gmbh Ultraschallschweißvorrichtung und Konverter einer Ultraschallschweißvorrichtung
DE102005044048B4 (de) * 2004-09-30 2007-05-03 Unaxis International Trading Ltd. Wire Bonder
US7597231B2 (en) * 2006-04-10 2009-10-06 Small Precision Tools Inc. Wire bonding capillary tool having multiple outer steps
KR101221928B1 (ko) * 2007-07-24 2013-01-14 스몰 프리시젼 툴즈 인코포레이티드 다수의 외측 단차를 갖는 와이어 본딩용 캐필러리 툴
JP4595018B2 (ja) * 2009-02-23 2010-12-08 株式会社新川 半導体装置の製造方法およびボンディング装置
WO2011019692A2 (en) 2009-08-12 2011-02-17 Kulicke And Soffa Industries, Inc. Ultrasonic transducers for wire bonding and methods for forming wire bonds using ultrasonic transducers
US8129220B2 (en) * 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US8800846B2 (en) * 2012-01-27 2014-08-12 Apple Inc. Ultrasonic bonding
JP6008603B2 (ja) * 2012-06-15 2016-10-19 エスアイアイ・セミコンダクタ株式会社 半導体装置
US8767351B1 (en) * 2013-01-31 2014-07-01 Seagate Technology Llc Ambient temperature ball bond
US9809893B2 (en) * 2015-02-26 2017-11-07 City University Of Hong Kong Surface mechanical attrition treatment (SMAT) methods and systems for modifying nanostructures
EP3341148B1 (en) * 2015-08-26 2025-10-29 Arizona Board of Regents on behalf of Arizona State University Method for additive manufacturing utilizing localized ultrasound-enhanced material flow and fusioning
JP6688725B2 (ja) * 2016-12-26 2020-04-28 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US11517977B2 (en) * 2017-09-15 2022-12-06 Tech-Sonic, Inc. Dual cam servo weld splicer
CN120073439B (zh) * 2025-04-29 2025-08-22 陕西华达科技股份有限公司 一种连接器金丝键合方法及装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2705423B2 (ja) * 1992-01-24 1998-01-28 株式会社日立製作所 超音波接合装置及び品質モニタリング方法
US5360155A (en) * 1993-07-09 1994-11-01 Kabushiki Kaisha Shinkawa Wire bonding apparatus
US5494207A (en) * 1994-05-20 1996-02-27 National Semiconductor Corporation Wire bonder transducer arrangement and method
US5626276A (en) * 1996-03-14 1997-05-06 International Business Machines Corporation Linkage drive mechanism for ultrasonic wirebonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449245B (zh) * 2011-04-07 2014-08-11 Nissan Motor Separator welding device, and the isolation of the welding method

Also Published As

Publication number Publication date
KR100456381B1 (ko) 2005-04-06
KR970008448A (ko) 1997-02-24
JPH0945736A (ja) 1997-02-14
JP3086158B2 (ja) 2000-09-11
US5884835A (en) 1999-03-23

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MM4A Annulment or lapse of patent due to non-payment of fees