TW300373B - - Google Patents

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Publication number
TW300373B
TW300373B TW084102913A TW84102913A TW300373B TW 300373 B TW300373 B TW 300373B TW 084102913 A TW084102913 A TW 084102913A TW 84102913 A TW84102913 A TW 84102913A TW 300373 B TW300373 B TW 300373B
Authority
TW
Taiwan
Prior art keywords
layer
carrier
item
fusible
pad area
Prior art date
Application number
TW084102913A
Other languages
English (en)
Chinese (zh)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW300373B publication Critical patent/TW300373B/zh

Links

Classifications

    • H10W72/071—
    • H10W72/0711—
    • H10W72/07178—
    • H10W72/07236—
    • H10W72/075—
    • H10W72/252—
    • H10W72/352—
    • H10W72/354—
    • H10W72/381—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/884—
    • H10W72/932—
    • H10W90/734—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/935—Delaminating means in preparation for post consumer recycling
    • Y10S156/937—Means for delaminating specified electronic component in preparation for recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49721—Repairing with disassembling
    • Y10T29/4973—Replacing of defective part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW084102913A 1994-12-06 1995-03-25 TW300373B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/349,854 US5601675A (en) 1994-12-06 1994-12-06 Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor

Publications (1)

Publication Number Publication Date
TW300373B true TW300373B (enExample) 1997-03-11

Family

ID=23374244

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084102913A TW300373B (enExample) 1994-12-06 1995-03-25

Country Status (2)

Country Link
US (1) US5601675A (enExample)
TW (1) TW300373B (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0764704B1 (en) * 1995-09-25 2000-03-08 Dow Corning Corporation Use of preceramic polymers as electronic adhesives
US6084299A (en) * 1995-11-09 2000-07-04 International Business Machines Corporation Integrated circuit package including a heat sink and an adhesive
JP3225854B2 (ja) * 1996-10-02 2001-11-05 株式会社デンソー 厚膜回路基板及びそのワイヤボンディング電極形成方法
US5757073A (en) * 1996-12-13 1998-05-26 International Business Machines Corporation Heatsink and package structure for wirebond chip rework and replacement
DE19730118B4 (de) 1997-07-14 2006-01-12 Infineon Technologies Ag Verfahren und Vorrichtung zur Herstellung einer Chip-Substrat-Verbindung
US6029730A (en) * 1997-12-30 2000-02-29 Intel Corporation Hot shear apparatus and method for removing a semiconductor chip from an existing package
JPH11298137A (ja) 1998-04-13 1999-10-29 Fuji Photo Film Co Ltd 回路基板の部品交換装置
JP3832102B2 (ja) * 1998-08-10 2006-10-11 ソニー株式会社 半導体装置の製造方法
US6084775A (en) * 1998-12-09 2000-07-04 International Business Machines Corporation Heatsink and package structures with fusible release layer
US6228197B1 (en) * 1999-02-23 2001-05-08 Trw Inc. Assembly method allowing easy re-attachment of large area electronic components to a substrate
US6253675B1 (en) 1999-06-29 2001-07-03 Carl P. Mayer Solder paste stenciling apparatus and method of use for rework
US6627517B1 (en) * 1999-12-08 2003-09-30 Altera Corporation Semiconductor package with improved thermal cycling performance, and method of forming same
US6796733B2 (en) 2000-10-31 2004-09-28 International Imaging Materials Inc. Thermal transfer ribbon with frosting ink layer
US6990904B2 (en) * 2000-10-31 2006-01-31 International Imaging Materials, Inc Thermal transfer assembly for ceramic imaging
US6854386B2 (en) * 2000-10-31 2005-02-15 International Imaging Materials Inc. Ceramic decal assembly
JP4178880B2 (ja) * 2002-08-29 2008-11-12 松下電器産業株式会社 モジュール部品
US20070024407A1 (en) * 2003-05-29 2007-02-01 Kenji Senda Temperature fuse element, temperature fuse and battery using the same
US7166491B2 (en) * 2003-06-11 2007-01-23 Fry's Metals, Inc. Thermoplastic fluxing underfill composition and method
US20050208700A1 (en) * 2004-03-19 2005-09-22 Chippac, Inc. Die to substrate attach using printed adhesive
US7247683B2 (en) * 2004-08-05 2007-07-24 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices
US20070166875A1 (en) * 2005-12-29 2007-07-19 Intel Corporation Method of forming a microelectronic package and microelectronic package formed according to the method
WO2009120687A2 (en) * 2008-03-24 2009-10-01 Vapor Works, Inc. Vapor phase rework station and methods
US9314869B2 (en) * 2012-01-13 2016-04-19 Asm Technology Singapore Pte. Ltd. Method of recovering a bonding apparatus from a bonding failure
HK1198351A2 (zh) * 2014-02-14 2015-04-02 Ltg Green-Tech R&D Company Limited 用於提取部件的系统和方法
US10044171B2 (en) * 2015-01-27 2018-08-07 TeraDiode, Inc. Solder-creep management in high-power laser devices
US10111322B2 (en) * 2016-12-09 2018-10-23 International Business Machines Corporation Implementing reworkable strain relief packaging structure for electronic component interconnects
US11228124B1 (en) 2021-01-04 2022-01-18 International Business Machines Corporation Connecting a component to a substrate by adhesion to an oxidized solder surface
CN118969746B (zh) * 2024-07-31 2025-10-14 杭州熙驰科技有限公司 一种集成电路封装结构

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4012832A (en) * 1976-03-12 1977-03-22 Sperry Rand Corporation Method for non-destructive removal of semiconductor devices
FR2458977A1 (fr) * 1979-06-13 1981-01-02 Cii Honeywell Bull Dispositif de demontage non destructif d'un composant electronique modulaire soude par une pluralite de cosses de raccordement sur un substrat
US4423435A (en) * 1980-10-27 1983-12-27 Texas Instruments Incorporated Assembly of an electronic device on an insulative substrate
US4436242A (en) * 1981-12-15 1984-03-13 Rca Corporation Desoldering tool and method of desoldering leadless components
JPS6187396A (ja) * 1984-10-05 1986-05-02 株式会社日立製作所 電子回路装置とその製造方法
JPH01272183A (ja) * 1988-04-25 1989-10-31 Toshiba Corp セラミックス回路基板
US5202288A (en) * 1990-06-01 1993-04-13 Robert Bosch Gmbh Method of manufacturing an electronic circuit component incorporating a heat sink
US5060844A (en) * 1990-07-18 1991-10-29 International Business Machines Corporation Interconnection structure and test method
US5065933A (en) * 1990-09-19 1991-11-19 At&T Bell Laboratories Electronic device manipulating apparatus and method
US5072874A (en) * 1991-01-31 1991-12-17 Microelectronics And Computer Technology Corporation Method and apparatus for using desoldering material
DE4201931C1 (enExample) * 1992-01-24 1993-05-27 Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh + Co.Kg, 4788 Warstein, De
US5268048A (en) * 1992-12-10 1993-12-07 Hewlett-Packard Company Reworkable die attachment

Also Published As

Publication number Publication date
US5601675A (en) 1997-02-11

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