TW294821B - - Google Patents

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Publication number
TW294821B
TW294821B TW084109275A TW84109275A TW294821B TW 294821 B TW294821 B TW 294821B TW 084109275 A TW084109275 A TW 084109275A TW 84109275 A TW84109275 A TW 84109275A TW 294821 B TW294821 B TW 294821B
Authority
TW
Taiwan
Prior art keywords
processing
wafer
liquid
item
patent application
Prior art date
Application number
TW084109275A
Other languages
English (en)
Chinese (zh)
Original Assignee
Tokyo Electron Co Ltd
Tel Kyushu Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP24080694A external-priority patent/JP3230128B2/ja
Priority claimed from JP26191694A external-priority patent/JP3164739B2/ja
Application filed by Tokyo Electron Co Ltd, Tel Kyushu Kk filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW294821B publication Critical patent/TW294821B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials For Photolithography (AREA)
TW084109275A 1994-09-09 1995-09-05 TW294821B (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24080694A JP3230128B2 (ja) 1994-09-09 1994-09-09 処理装置
JP26191694A JP3164739B2 (ja) 1994-09-30 1994-09-30 塗布膜形成方法及びその装置

Publications (1)

Publication Number Publication Date
TW294821B true TW294821B (https=) 1997-01-01

Family

ID=26534934

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084109275A TW294821B (https=) 1994-09-09 1995-09-05

Country Status (3)

Country Link
US (1) US5665200A (https=)
KR (1) KR0167481B1 (https=)
TW (1) TW294821B (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW346649B (en) * 1996-09-24 1998-12-01 Tokyo Electron Co Ltd Method for wet etching a film
KR100521701B1 (ko) * 1996-11-27 2006-01-12 동경 엘렉트론 주식회사 도포막형성장치및도포막형성방법
US5904863A (en) * 1997-04-30 1999-05-18 Coates Asi, Inc. Process for etching trace side walls
JP3926890B2 (ja) * 1997-06-11 2007-06-06 東京エレクトロン株式会社 処理システム
SG115335A1 (en) 1997-07-04 2005-10-28 Tokyo Electron Ltd Process solution supplying apparatus
JPH1133471A (ja) * 1997-07-23 1999-02-09 Tokyo Electron Ltd 塗布装置
JP3320648B2 (ja) 1997-12-04 2002-09-03 東京エレクトロン株式会社 レジスト膜の形成方法及びレジスト膜の形成装置
US6527007B2 (en) * 1998-12-16 2003-03-04 Carl Cheung Tung Kong Fluid transfer system
JP3998386B2 (ja) * 2000-01-26 2007-10-24 三菱電機株式会社 液晶表示装置の製造装置および液晶表示装置の製造方法
EP1124252A2 (en) * 2000-02-10 2001-08-16 Applied Materials, Inc. Apparatus and process for processing substrates
US6616762B2 (en) 2000-10-13 2003-09-09 Tokyo Electron Limited Treatment solution supply apparatus and treatment solution supply method
EP1432639A1 (en) 2001-10-01 2004-06-30 Fsi International, Inc. Fluid dispensing apparatus
US6680263B2 (en) * 2002-02-12 2004-01-20 Sandia National Laboratories Method for applying a photoresist layer to a substrate having a preexisting topology
US7449099B1 (en) * 2004-04-13 2008-11-11 Novellus Systems, Inc. Selectively accelerated plating of metal features
US7396412B2 (en) 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7942514B2 (en) * 2006-12-21 2011-05-17 Xerox Corporation Keying elements for solid ink loader
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
JP6145061B2 (ja) * 2014-03-04 2017-06-07 東京エレクトロン株式会社 接合システムおよび接合方法
EP3144962A4 (en) * 2014-12-02 2018-01-10 Sigma-Technology Inc. Cleaning method and cleaning device using micro/nano-bubbles
CN104808446B (zh) * 2015-05-07 2021-02-02 合肥京东方光电科技有限公司 一种涂布机
CN115605667A (zh) 2020-04-02 2023-01-13 艺达思健康与科学有限责任公司（Us） 具有波纹管密闭密封件的精密容积泵
JP7667035B2 (ja) * 2021-08-27 2025-04-22 キオクシア株式会社 基板処理装置および半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609129A (ja) * 1983-06-29 1985-01-18 Fujitsu Ltd ウエツト処理装置
JP2843134B2 (ja) * 1990-09-07 1999-01-06 東京エレクトロン株式会社 塗布装置および塗布方法
JP2949547B2 (ja) * 1993-02-08 1999-09-13 東京エレクトロン株式会社 処理装置及び処理方法

Also Published As

Publication number Publication date
KR960012286A (ko) 1996-04-20
KR0167481B1 (ko) 1999-02-01
US5665200A (en) 1997-09-09

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