TW289851B - - Google Patents

Info

Publication number
TW289851B
TW289851B TW084113365A TW84113365A TW289851B TW 289851 B TW289851 B TW 289851B TW 084113365 A TW084113365 A TW 084113365A TW 84113365 A TW84113365 A TW 84113365A TW 289851 B TW289851 B TW 289851B
Authority
TW
Taiwan
Application number
TW084113365A
Other languages
Chinese (zh)
Original Assignee
Toshiba Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP29523194A external-priority patent/JP3325410B2/ja
Priority claimed from JP6295230A external-priority patent/JPH08153738A/ja
Priority claimed from JP29523394A external-priority patent/JP3272889B2/ja
Application filed by Toshiba Co Ltd filed Critical Toshiba Co Ltd
Application granted granted Critical
Publication of TW289851B publication Critical patent/TW289851B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
TW084113365A 1994-11-29 1995-12-14 TW289851B (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP29523194A JP3325410B2 (ja) 1994-11-29 1994-11-29 半導体装置の製造方法
JP6295230A JPH08153738A (ja) 1994-11-29 1994-11-29 半導体装置の製造方法
JP29523394A JP3272889B2 (ja) 1994-11-29 1994-11-29 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
TW289851B true TW289851B (https=) 1996-11-01

Family

ID=27337965

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084113365A TW289851B (https=) 1994-11-29 1995-12-14

Country Status (4)

Country Link
US (1) US5677246A (https=)
EP (1) EP0715348A3 (https=)
KR (1) KR0184371B1 (https=)
TW (1) TW289851B (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5766982A (en) 1996-03-07 1998-06-16 Micron Technology, Inc. Method and apparatus for underfill of bumped or raised die
US6238223B1 (en) * 1997-08-20 2001-05-29 Micro Technology, Inc. Method of depositing a thermoplastic polymer in semiconductor fabrication
WO2000002245A1 (en) * 1998-07-01 2000-01-13 Seiko Epson Corporation Semiconductor device, method of manufacture thereof, circuit board, and electronic device
US6018192A (en) * 1998-07-30 2000-01-25 Motorola, Inc. Electronic device with a thermal control capability
US6288905B1 (en) * 1999-04-15 2001-09-11 Amerasia International Technology Inc. Contact module, as for a smart card, and method for making same
US6048656A (en) * 1999-05-11 2000-04-11 Micron Technology, Inc. Void-free underfill of surface mounted chips
KR100309161B1 (ko) * 1999-10-11 2001-11-02 윤종용 메모리 카드 및 그 제조방법
US6400033B1 (en) 2000-06-01 2002-06-04 Amkor Technology, Inc. Reinforcing solder connections of electronic devices
JP3945968B2 (ja) * 2000-09-06 2007-07-18 三洋電機株式会社 半導体装置およびその製造方法
JP2002092575A (ja) * 2000-09-19 2002-03-29 Mitsubishi Electric Corp 小型カードとその製造方法
US20040070080A1 (en) * 2001-02-27 2004-04-15 Chippac, Inc Low cost, high performance flip chip package structure
USRE44438E1 (en) 2001-02-27 2013-08-13 Stats Chippac, Ltd. Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
US20020121707A1 (en) * 2001-02-27 2002-09-05 Chippac, Inc. Super-thin high speed flip chip package
US8143108B2 (en) * 2004-10-07 2012-03-27 Stats Chippac, Ltd. Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
JP4303609B2 (ja) * 2004-01-29 2009-07-29 富士通株式会社 スペーサ
JP4207004B2 (ja) 2005-01-12 2009-01-14 セイコーエプソン株式会社 半導体装置の製造方法
GB0505824D0 (en) * 2005-03-22 2005-04-27 Conductive Inkjet Tech Ltd Treatment of items
JP2007059693A (ja) * 2005-08-25 2007-03-08 Toshiba Corp 半導体メモリカードおよび半導体メモリカードの製造方法
US7381590B2 (en) * 2006-03-09 2008-06-03 International Business Machines Corporation Method and device including reworkable alpha particle barrier and corrosion barrier
JP2012049175A (ja) * 2010-08-24 2012-03-08 Toshiba Corp 半導体装置の製造方法
US8193036B2 (en) * 2010-09-14 2012-06-05 Stats Chippac, Ltd. Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850572A (ja) * 1981-09-22 1983-03-25 株式会社東芝 デイスプレイ装置の製造方法
JPS60262430A (ja) 1984-06-08 1985-12-25 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS643626A (en) * 1987-06-26 1989-01-09 Matsushita Electric Industrial Co Ltd Production of liquid crystal display device
JP2574369B2 (ja) * 1988-03-07 1997-01-22 松下電器産業株式会社 半導体チップの実装体およびその実装方法
JPH027180A (ja) * 1988-06-27 1990-01-11 Hitachi Ltd 命令一斉発火方式
JP2596615B2 (ja) * 1989-02-08 1997-04-02 沖電気工業株式会社 樹脂封止用回路基板
US5071787A (en) * 1989-03-14 1991-12-10 Kabushiki Kaisha Toshiba Semiconductor device utilizing a face-down bonding and a method for manufacturing the same
US5121190A (en) * 1990-03-14 1992-06-09 International Business Machines Corp. Solder interconnection structure on organic substrates
JPH04169002A (ja) * 1990-11-01 1992-06-17 Matsushita Electric Ind Co Ltd 導電性ペーストとそれを用いた多層セラミック配線基板の製造方法
JP2861368B2 (ja) * 1990-11-05 1999-02-24 住友電気工業株式会社 回路基板の加工方法
KR970011620B1 (ko) * 1991-05-23 1997-07-12 모토로라 인코포레이티드 집적회로 칩 캐리어
JPH04352439A (ja) * 1991-05-30 1992-12-07 Toshiba Corp 半導体装置の製造方法
US5436913A (en) * 1992-06-02 1995-07-25 Kabushiki Kaisha Toshiba Non-volatile semiconductor memory device using successively longer write pulses
JPH0632296A (ja) 1992-07-20 1994-02-08 Nec Corp 分離機構
JPH0650757A (ja) 1992-07-29 1994-02-25 Nagano Japan Radio Co 方位検出装置
JPH0660493A (ja) 1992-08-14 1994-03-04 Matsushita Electric Ind Co Ltd 磁気記録再生装置
JPH06151701A (ja) * 1992-11-09 1994-05-31 Sharp Corp 半導体装置の製造方法
JPH06283561A (ja) * 1993-03-29 1994-10-07 Takeshi Ikeda 半導体装置のパッケージ
FR2704691B1 (fr) * 1993-04-30 1995-06-02 Commissariat Energie Atomique Procédé d'enrobage de composants électroniques hybrides par billes sur un substrat.
JP3332555B2 (ja) * 1993-12-17 2002-10-07 株式会社東芝 半導体装置およびその製造方法
JPH07245360A (ja) * 1994-03-02 1995-09-19 Toshiba Corp 半導体パッケージおよびその製造方法
JP3246826B2 (ja) * 1994-03-30 2002-01-15 株式会社東芝 半導体パッケージ
JPH07302858A (ja) * 1994-04-28 1995-11-14 Toshiba Corp 半導体パッケージ
US5471027A (en) * 1994-07-22 1995-11-28 International Business Machines Corporation Method for forming chip carrier with a single protective encapsulant
US5579573A (en) * 1994-10-11 1996-12-03 Ford Motor Company Method for fabricating an undercoated chip electrically interconnected to a substrate
US5578527A (en) * 1995-06-23 1996-11-26 Industrial Technology Research Institute Connection construction and method of manufacturing the same

Also Published As

Publication number Publication date
EP0715348A3 (en) 1998-07-15
EP0715348A2 (en) 1996-06-05
KR960019690A (ko) 1996-06-17
US5677246A (en) 1997-10-14
KR0184371B1 (ko) 1999-03-20

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