TW286427B - - Google Patents
Info
- Publication number
- TW286427B TW286427B TW084100743A TW84100743A TW286427B TW 286427 B TW286427 B TW 286427B TW 084100743 A TW084100743 A TW 084100743A TW 84100743 A TW84100743 A TW 84100743A TW 286427 B TW286427 B TW 286427B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/60—Seals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/181,687 US5455386A (en) | 1994-01-14 | 1994-01-14 | Chamfered electronic package component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW286427B true TW286427B (member.php) | 1996-09-21 |
Family
ID=22665347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084100743A TW286427B (member.php) | 1994-01-14 | 1995-01-27 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5455386A (member.php) |
| EP (1) | EP0739541A4 (member.php) |
| JP (1) | JPH09507614A (member.php) |
| AU (1) | AU1407295A (member.php) |
| PH (1) | PH30837A (member.php) |
| TW (1) | TW286427B (member.php) |
| WO (1) | WO1995019644A1 (member.php) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3239695B2 (ja) * | 1995-07-17 | 2001-12-17 | 株式会社村田製作所 | 電子部品 |
| US5723905A (en) * | 1995-08-04 | 1998-03-03 | International Business Machines Corporation | Semiconductor package with low strain seal |
| US5764484A (en) * | 1996-11-15 | 1998-06-09 | Olin Corporation | Ground ring for a metal electronic package |
| US5767447A (en) * | 1995-12-05 | 1998-06-16 | Lucent Technologies Inc. | Electronic device package enclosed by pliant medium laterally confined by a plastic rim member |
| US6730991B1 (en) * | 1996-06-11 | 2004-05-04 | Raytheon Company | Integrated circuit chip package |
| US6204454B1 (en) * | 1997-12-27 | 2001-03-20 | Tdk Corporation | Wiring board and process for the production thereof |
| IL123207A0 (en) | 1998-02-06 | 1998-09-24 | Shellcase Ltd | Integrated circuit device |
| IL133453A0 (en) * | 1999-12-10 | 2001-04-30 | Shellcase Ltd | Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
| US6395998B1 (en) * | 2000-09-13 | 2002-05-28 | International Business Machines Corporation | Electronic package having an adhesive retaining cavity |
| KR100855015B1 (ko) * | 2000-12-21 | 2008-08-28 | 테쎄라 테크놀로지스 헝가리 케이에프티. | 패키징된 집적회로 및 그 제조 방법 |
| JP3888228B2 (ja) * | 2002-05-17 | 2007-02-28 | 株式会社デンソー | センサ装置 |
| US7033664B2 (en) * | 2002-10-22 | 2006-04-25 | Tessera Technologies Hungary Kft | Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
| WO2005004195A2 (en) * | 2003-07-03 | 2005-01-13 | Shellcase Ltd. | Method and apparatus for packaging integrated circuit devices |
| US7566853B2 (en) * | 2005-08-12 | 2009-07-28 | Tessera, Inc. | Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture |
| JP2007287669A (ja) * | 2006-03-23 | 2007-11-01 | Canon Inc | 有機発光装置及び有機発光装置の製造方法 |
| DE102006025868A1 (de) * | 2006-06-02 | 2007-12-06 | Robert Bosch Gmbh | Bonddraht und Bondverbindung mit einem Bonddraht |
| DE102007019096B4 (de) * | 2007-04-23 | 2015-03-12 | Continental Automotive Gmbh | Elektronikgehäuse |
| US8220142B2 (en) * | 2007-10-03 | 2012-07-17 | Apple Inc. | Method of forming a housing component |
| WO2011013776A1 (ja) * | 2009-07-31 | 2011-02-03 | 旭硝子株式会社 | 半導体デバイス用封着ガラス、封着材料、封着材料ペースト、および半導体デバイスとその製造方法 |
| CN101894857B (zh) * | 2010-02-08 | 2012-11-07 | 昆山维信诺显示技术有限公司 | 一种有机电致发光器件 |
| JP5864890B2 (ja) * | 2011-04-26 | 2016-02-17 | キヤノン株式会社 | 撮像装置 |
| JP6282394B2 (ja) * | 2012-10-30 | 2018-02-21 | Ｎｇｋエレクトロデバイス株式会社 | パワーモジュール用基板 |
| US9497868B2 (en) * | 2014-04-17 | 2016-11-15 | Continental Automotive Systems, Inc. | Electronics enclosure |
| US9799580B2 (en) * | 2016-03-24 | 2017-10-24 | Nxp Usa, Inc. | Semiconductor device package and methods of manufacture thereof |
| CN107808736A (zh) * | 2016-09-09 | 2018-03-16 | 德阳帛汉电子有限公司 | 电子装置的封装盒 |
| KR102242617B1 (ko) * | 2016-12-29 | 2021-04-20 | 미쓰비시덴키 가부시키가이샤 | 반도체 장치 |
| WO2019093269A1 (ja) * | 2017-11-09 | 2019-05-16 | Ｎｇｋエレクトロデバイス株式会社 | 蓋体および電子装置 |
| JP2019096797A (ja) * | 2017-11-27 | 2019-06-20 | 三菱電機株式会社 | 半導体装置および電力変換装置 |
| JP6929210B2 (ja) * | 2017-12-11 | 2021-09-01 | 株式会社ブリヂストン | タイヤ |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4262165A (en) * | 1976-03-26 | 1981-04-14 | Hitachi, Ltd. | Packaging structure for semiconductor IC chip |
| JPS5917271A (ja) * | 1982-07-20 | 1984-01-28 | Nec Corp | セラミツクパツケ−ジ半導体装置 |
| JPS6132490A (ja) * | 1984-07-24 | 1986-02-15 | 富士通株式会社 | フラツトリ−ドパツケ−ジ型電子部品の取付け構造 |
| JPS6265442A (ja) * | 1985-09-18 | 1987-03-24 | Ngk Spark Plug Co Ltd | 封着構造 |
| US4839716A (en) * | 1987-06-01 | 1989-06-13 | Olin Corporation | Semiconductor packaging |
| JPH0714102B2 (ja) * | 1988-01-28 | 1995-02-15 | 三菱電機株式会社 | 光結合装置 |
| US5013871A (en) * | 1988-02-10 | 1991-05-07 | Olin Corporation | Kit for the assembly of a metal electronic package |
| US4939316A (en) * | 1988-10-05 | 1990-07-03 | Olin Corporation | Aluminum alloy semiconductor packages |
| JPH03116760A (ja) * | 1989-09-28 | 1991-05-17 | Nec Kyushu Ltd | セラミックキャップ |
| US5073521A (en) * | 1989-11-15 | 1991-12-17 | Olin Corporation | Method for housing a tape-bonded electronic device and the package employed |
| JPH04279048A (ja) * | 1991-01-16 | 1992-10-05 | Nec Yamagata Ltd | 半導体装置 |
| US5239131A (en) * | 1992-07-13 | 1993-08-24 | Olin Corporation | Electronic package having controlled epoxy flow |
| US5293511A (en) * | 1993-03-16 | 1994-03-08 | Texas Instruments Incorporated | Package for a semiconductor device |
-
1994
- 1994-01-14 US US08/181,687 patent/US5455386A/en not_active Expired - Fee Related
- 1994-12-27 AU AU14072/95A patent/AU1407295A/en not_active Abandoned
- 1994-12-27 WO PCT/US1994/014874 patent/WO1995019644A1/en not_active Ceased
- 1994-12-27 EP EP95905466A patent/EP0739541A4/en not_active Withdrawn
- 1994-12-27 JP JP7519028A patent/JPH09507614A/ja active Pending
-
1995
- 1995-01-09 PH PH49756A patent/PH30837A/en unknown
- 1995-01-27 TW TW084100743A patent/TW286427B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP0739541A1 (en) | 1996-10-30 |
| JPH09507614A (ja) | 1997-07-29 |
| WO1995019644A1 (en) | 1995-07-20 |
| PH30837A (en) | 1997-11-03 |
| US5455386A (en) | 1995-10-03 |
| AU1407295A (en) | 1995-08-01 |
| EP0739541A4 (en) | 1999-04-28 |