TW279271B - - Google Patents

Info

Publication number
TW279271B
TW279271B TW083110727A TW83110727A TW279271B TW 279271 B TW279271 B TW 279271B TW 083110727 A TW083110727 A TW 083110727A TW 83110727 A TW83110727 A TW 83110727A TW 279271 B TW279271 B TW 279271B
Authority
TW
Taiwan
Application number
TW083110727A
Original Assignee
Samsug Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsug Electronics Co Ltd filed Critical Samsug Electronics Co Ltd
Application granted granted Critical
Publication of TW279271B publication Critical patent/TW279271B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
    • H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
    • H01L28/91—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions made by depositing layers, e.g. by depositing alternating conductive and insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H01L28/75—Electrodes comprising two or more layers, e.g. comprising a barrier layer and a metal layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H10B12/318—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/014—Capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
TW083110727A 1993-11-24 1994-11-18 TW279271B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930025136A KR0132859B1 (ko) 1993-11-24 1993-11-24 반도체장치의 커패시터 제조방법

Publications (1)

Publication Number Publication Date
TW279271B true TW279271B (zh) 1996-06-21

Family

ID=19368841

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083110727A TW279271B (zh) 1993-11-24 1994-11-18

Country Status (4)

Country Link
US (2) US5443993A (zh)
JP (1) JP3483326B2 (zh)
KR (1) KR0132859B1 (zh)
TW (1) TW279271B (zh)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5688726A (en) * 1994-08-03 1997-11-18 Hyundai Electronics Industries Co., Ltd. Method for fabricating capacitors of semiconductor device having cylindrical storage electrodes
US5573963A (en) * 1995-05-03 1996-11-12 Vanguard International Semiconductor Corporation Method of forming self-aligned twin tub CMOS devices
JP2751952B2 (ja) * 1995-11-10 1998-05-18 日本電気株式会社 半導体装置の製造方法
JP3062067B2 (ja) * 1995-12-18 2000-07-10 日本電気株式会社 半導体装置及びその製造方法
US5543345A (en) * 1995-12-27 1996-08-06 Vanguard International Semiconductor Corp. Method for fabricating crown capacitors for a dram cell
KR0186069B1 (ko) * 1995-12-28 1999-03-20 문정환 스택형 디램 셀의 캐패시터 제조방법
US5656532A (en) * 1996-01-11 1997-08-12 Vanguard International Semiconductor Corporation Method for fabricating a coaxial capacitor of a semiconductor device
US5733808A (en) * 1996-01-16 1998-03-31 Vanguard International Semiconductor Corporation Method for fabricating a cylindrical capacitor for a semiconductor device
US5552334A (en) * 1996-01-22 1996-09-03 Vanguard International Semiconductor Company Method for fabricating a Y-shaped capacitor in a DRAM cell
US5856220A (en) * 1996-02-08 1999-01-05 Taiwan Semiconductor Manufacturing Company, Ltd. Method for fabricating a double wall tub shaped capacitor
JP3063606B2 (ja) * 1996-02-13 2000-07-12 日本電気株式会社 半導体装置の製造方法
JP2917912B2 (ja) * 1996-06-07 1999-07-12 日本電気株式会社 半導体記憶装置およびその製造方法
US5807775A (en) * 1996-06-24 1998-09-15 Vanguard International Semiconductor Corporation Method for forming a double walled cylindrical capacitor for a DRAM
TW312831B (en) * 1996-08-16 1997-08-11 United Microelectronics Corp Manufacturing method of semiconductor memory device with capacitor(3)
US5744833A (en) * 1996-08-16 1998-04-28 United Microelectronics Corporation Semiconductor memory device having tree-type capacitor
TW308727B (en) * 1996-08-16 1997-06-21 United Microelectronics Corp Semiconductor memory device with capacitor (4)
TW312828B (en) * 1996-08-16 1997-08-11 United Microelectronics Corp Manufacturing method of semiconductor memory device with capacitor(5)
TW304290B (en) * 1996-08-16 1997-05-01 United Microelectronics Corp The manufacturing method for semiconductor memory device with capacitor
TW302524B (en) * 1996-08-16 1997-04-11 United Microelectronics Corp Memory cell structure of dynamic random access memory and manufacturing method thereof
US5796138A (en) * 1996-08-16 1998-08-18 United Microelectronics Corporation Semiconductor memory device having a tree type capacitor
TW351846B (en) * 1996-08-16 1999-02-01 United Microelectronics Corp Method for fabricating memory cell for DRAM
TW306064B (en) * 1996-08-16 1997-05-21 United Microelectronics Corp Semiconductor memory device with capacitor (part 6)
US5739060A (en) * 1996-08-16 1998-04-14 United Microelecrtronics Corporation Method of fabricating a capacitor structure for a semiconductor memory device
TW308729B (en) * 1996-08-16 1997-06-21 United Microelectronics Corp Semiconductor memory device with capacitor (3)
TW304288B (en) * 1996-08-16 1997-05-01 United Microelectronics Corp Manufacturing method of semiconductor memory device with capacitor
TW427012B (en) * 1996-08-16 2001-03-21 United Microelectronics Corp The manufacturing method of double-combined capacitor DRAM cells
TW306036B (en) * 1996-08-16 1997-05-21 United Microelectronics Corp Semiconductor memory device with capacitor (part 2)
TW297948B (en) * 1996-08-16 1997-02-11 United Microelectronics Corp Memory cell structure of DRAM
US5759890A (en) * 1996-08-16 1998-06-02 United Microelectronics Corporation Method for fabricating a tree-type capacitor structure for a semiconductor memory device
TW366592B (en) * 1996-08-16 1999-08-11 United Microelectronics Corp DRAM memory and the manufacturing method for the memory cells
TW312829B (en) * 1996-08-16 1997-08-11 United Microelectronics Corp Semiconductor memory device with capacitor(6)
US5688713A (en) * 1996-08-26 1997-11-18 Vanguard International Semiconductor Corporation Method of manufacturing a DRAM cell having a double-crown capacitor using polysilicon and nitride spacers
US5933742A (en) * 1996-09-06 1999-08-03 Powerchip Semiconductor Corp. Multi-crown capacitor for high density DRAMS
KR100282413B1 (ko) * 1996-10-24 2001-03-02 김영환 아산화질소 가스를 이용한 박막 형성 방법
US5998256A (en) * 1996-11-01 1999-12-07 Micron Technology, Inc. Semiconductor processing methods of forming devices on a substrate, forming device arrays on a substrate, forming conductive lines on a substrate, and forming capacitor arrays on a substrate, and integrated circuitry
KR100227070B1 (ko) * 1996-11-04 1999-10-15 구본준 커패시터 및 그의 제조방법
KR100244281B1 (ko) 1996-11-27 2000-02-01 김영환 반도체 소자의 커피시터 제조방법
US5668039A (en) * 1996-12-05 1997-09-16 Vanguard International Semiconductor Corp. Method for forming crown-shape capacitor node with tapered etching
US5854105A (en) * 1997-11-05 1998-12-29 Vanguard International Semiconductor Corporation Method for making dynamic random access memory cells having double-crown stacked capacitors with center posts
US6590250B2 (en) 1997-11-25 2003-07-08 Micron Technology, Inc. DRAM capacitor array and integrated device array of substantially identically shaped devices
TW427014B (en) * 1997-12-24 2001-03-21 United Microelectronics Corp The manufacturing method of the capacitors of DRAM
TW392282B (en) * 1998-01-20 2000-06-01 Nanya Technology Corp Manufacturing method for cylindrical capacitor
GB2341271B (en) * 1998-09-01 2001-04-18 United Semiconductor Corp Method of fabricating capacitor
KR100532393B1 (ko) * 1998-09-03 2006-04-21 삼성전자주식회사 다층의 절연막을 동시에 식각하는 공정을 포함하는 반도체 메모리장치의 제조방법
US6121108A (en) * 1998-10-28 2000-09-19 United Microelectroincs Corp. Method for fabricating a capacitor in a dynamic random access memory
US6403416B1 (en) * 1999-01-07 2002-06-11 Taiwan Semiconductor Manufacturing Company Method for making a double-cylinder-capacitor structure for dynamic random access memory (DRAM)
US6294436B1 (en) * 1999-08-16 2001-09-25 Infineon Technologies Ag Method for fabrication of enlarged stacked capacitors using isotropic etching
US20080113483A1 (en) * 2006-11-15 2008-05-15 Micron Technology, Inc. Methods of etching a pattern layer to form staggered heights therein and intermediate semiconductor device structures
US20140167220A1 (en) * 2012-12-14 2014-06-19 Spansion Llc Three dimensional capacitor
KR102101407B1 (ko) * 2013-03-14 2020-04-16 삼성전자주식회사 자기 저항 메모리 장치 및 그 제조 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235199A (en) * 1988-03-25 1993-08-10 Kabushiki Kaisha Toshiba Semiconductor memory with pad electrode and bit line under stacked capacitor
KR950003915B1 (ko) * 1990-04-10 1995-04-20 마쯔시다덴기산교 가부시기가이샤 반도체집적회로장치 및 그 제조방법
KR930009583B1 (ko) * 1990-11-29 1993-10-07 삼성전자 주식회사 융모모양의 커패시터구조를 가진 반도체 메모리장치의 제조방법
US5061650A (en) * 1991-01-17 1991-10-29 Micron Technology, Inc. Method for formation of a stacked capacitor
US5084405A (en) * 1991-06-07 1992-01-28 Micron Technology, Inc. Process to fabricate a double ring stacked cell structure
TW243541B (zh) * 1991-08-31 1995-03-21 Samsung Electronics Co Ltd
US5266512A (en) * 1991-10-23 1993-11-30 Motorola, Inc. Method for forming a nested surface capacitor
US5150276A (en) * 1992-01-24 1992-09-22 Micron Technology, Inc. Method of fabricating a vertical parallel cell capacitor having a storage node capacitor plate comprising a center fin effecting electrical communication between itself and parallel annular rings
KR960008865B1 (en) * 1992-07-15 1996-07-05 Samsung Electronics Co Ltd Method for manufacturing a capacitor in semiconductor memory device

Also Published As

Publication number Publication date
KR0132859B1 (ko) 1998-04-16
US5700709A (en) 1997-12-23
KR950015770A (ko) 1995-06-17
JP3483326B2 (ja) 2004-01-06
JPH07193143A (ja) 1995-07-28
US5443993A (en) 1995-08-22

Similar Documents

Publication Publication Date Title
FR2709599B1 (zh)
FR10C0012I2 (zh)
FR2706747B1 (zh)
FR2712297B1 (zh)
FR2713975B1 (zh)
FR2701905B1 (zh)
EP0702629A4 (zh)
EP0708807A4 (zh)
GB9306672D0 (zh)
FR2706981B1 (zh)
DK0611885T3 (zh)
DK22893A (zh)
FR2706898B1 (zh)
FR2706953B1 (zh)
FR2706742B1 (zh)
FR2706944B1 (zh)
FR2707016B1 (zh)
FR2706843B3 (zh)
IN176915B (zh)
IN181156B (zh)
IN175919B (zh)
IN178359B (zh)
IN178212B (zh)
ECSDI930175S (zh)
IN175598B (zh)