TW275134B - - Google Patents

Info

Publication number
TW275134B
TW275134B TW084110084A TW84110084A TW275134B TW 275134 B TW275134 B TW 275134B TW 084110084 A TW084110084 A TW 084110084A TW 84110084 A TW84110084 A TW 84110084A TW 275134 B TW275134 B TW 275134B
Authority
TW
Taiwan
Application number
TW084110084A
Other languages
Chinese (zh)
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW275134B publication Critical patent/TW275134B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/30—Devices controlled by electric currents or voltages
    • H10D48/32—Devices controlled by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H10D48/36—Unipolar devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113—Isolations within a component, i.e. internal isolations
    • H10D62/115—Dielectric isolations, e.g. air gaps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00—Bipolar junction transistors [BJT]
    • H10D10/01—Manufacture or treatment
    • H10D10/021—Manufacture or treatment of heterojunction BJTs [HBT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00—Bipolar junction transistors [BJT]
    • H10D10/80—Heterojunction BJTs
    • H10D10/821—Vertical heterojunction BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/137—Collector regions of BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/072—Heterojunctions
TW084110084A 1994-08-09 1995-09-27 TW275134B (en, 2012)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/287,741 US5445976A (en) 1994-08-09 1994-08-09 Method for producing bipolar transistor having reduced base-collector capacitance

Publications (1)

Publication Number Publication Date
TW275134B true TW275134B (en, 2012) 1996-05-01

Family

ID=23104139

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084110084A TW275134B (en, 2012) 1994-08-09 1995-09-27

Country Status (6)

Country Link
US (1) US5445976A (en, 2012)
EP (1) EP0703607B1 (en, 2012)
JP (1) JPH0864610A (en, 2012)
KR (1) KR100379208B1 (en, 2012)
DE (1) DE69524516T2 (en, 2012)
TW (1) TW275134B (en, 2012)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298438A (en) * 1992-08-31 1994-03-29 Texas Instruments Incorporated Method of reducing extrinsic base-collector capacitance in bipolar transistors
US5700701A (en) * 1992-10-30 1997-12-23 Texas Instruments Incorporated Method for reducing junction capacitance and increasing current gain in collector-up bipolar transistors
US5702958A (en) * 1994-08-09 1997-12-30 Texas Instruments Incorporated Method for the fabrication of bipolar transistors
US5485025A (en) * 1994-12-02 1996-01-16 Texas Instruments Incorporated Depleted extrinsic emitter of collector-up heterojunction bipolar transistor
US5665614A (en) * 1995-06-06 1997-09-09 Hughes Electronics Method for making fully self-aligned submicron heterojunction bipolar transistor
US5625206A (en) * 1996-06-03 1997-04-29 Lucent Technologies Inc. High-speed double-heterostructure bipolar transistor devices
US5859447A (en) * 1997-05-09 1999-01-12 Yang; Edward S. Heterojunction bipolar transistor having heterostructure ballasting emitter
US6060402A (en) * 1998-07-23 2000-05-09 The Whitaker Corporation Process for selective recess etching of epitaxial field effect transistors with a novel etch-stop layer
DE19834491A1 (de) 1998-07-31 2000-02-03 Daimler Chrysler Ag Anordnung und Verfahren zur Herstellung eines Heterobipolartransistors
JP3509682B2 (ja) * 2000-01-31 2004-03-22 シャープ株式会社 ヘテロ接合バイポーラトランジスタおよびその製造方法、並びに、通信装置
EP1274133A3 (en) * 2001-07-04 2003-01-22 Sumitomo Chemical Company, Limited Thin-film crystal wafer having a pn junction and its manufacturing method
JP3507828B2 (ja) 2001-09-11 2004-03-15 シャープ株式会社 ヘテロ接合バイポーラトランジスタ及びその製造方法
JP2004327904A (ja) * 2003-04-28 2004-11-18 Renesas Technology Corp バイポーラトランジスタおよびその製造方法
CN101960584B (zh) * 2008-02-28 2013-11-20 Nxp股份有限公司 半导体器件及其制造方法
US9105488B2 (en) 2010-11-04 2015-08-11 Skyworks Solutions, Inc. Devices and methodologies related to structures having HBT and FET
US9679869B2 (en) 2011-09-02 2017-06-13 Skyworks Solutions, Inc. Transmission line for high performance radio frequency applications
US9059138B2 (en) 2012-01-25 2015-06-16 International Business Machines Corporation Heterojunction bipolar transistor with reduced sub-collector length, method of manufacture and design structure
JP5893800B2 (ja) 2012-06-14 2016-03-23 スカイワークス ソリューションズ, インコーポレイテッドSkyworks Solutions, Inc. パワーアンプモジュールを含む関連するシステム、デバイス、および方法
US11355586B2 (en) * 2020-10-22 2022-06-07 Walter Tony WOHLMUTH Heterojuction bipolar transistor
US11728380B2 (en) 2021-06-24 2023-08-15 Globalfoundries U.S. Inc. Bipolar transistor with base horizontally displaced from collector

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3788527T2 (de) * 1986-04-01 1994-05-11 Matsushita Electric Ind Co Ltd Bipolarer Transistor und sein Herstellungsverfahren.
JPH01238161A (ja) * 1988-03-18 1989-09-22 Fujitsu Ltd 半導体装置及びその製造方法
JP2574862B2 (ja) * 1988-04-15 1997-01-22 富士通株式会社 ホットエレクトロントランジスタ及びその製造方法
CA1318418C (en) * 1988-09-28 1993-05-25 Richard Norman Nottenburg Heterostructure bipolar transistor
JPH02159036A (ja) * 1988-12-13 1990-06-19 Matsushita Electric Ind Co Ltd バイポーラトランジスタの製造方法
JPH02235341A (ja) * 1989-03-08 1990-09-18 Matsushita Electric Ind Co Ltd ヘテロ接合バイポーラトランジスタ
JP2808145B2 (ja) * 1989-08-24 1998-10-08 富士通株式会社 半導体装置
JPH03108339A (ja) * 1989-09-22 1991-05-08 Hitachi Ltd ヘテロ接合バイポーラトランジスタおよびその製造方法
JPH03291942A (ja) * 1990-04-09 1991-12-24 Fujitsu Ltd ヘテロ接合半導体装置の製造方法
JPH0414831A (ja) * 1990-05-08 1992-01-20 Sony Corp 配線形成方法
US5118382A (en) * 1990-08-10 1992-06-02 Ibm Corporation Elimination of etch stop undercut
EP0478923B1 (en) * 1990-08-31 1997-11-05 Texas Instruments Incorporated Method of fabricating self-aligned heterojunction bipolar transistors
US5270223A (en) * 1991-06-28 1993-12-14 Texas Instruments Incorporated Multiple layer wide bandgap collector structure for bipolar transistors
US5298438A (en) * 1992-08-31 1994-03-29 Texas Instruments Incorporated Method of reducing extrinsic base-collector capacitance in bipolar transistors

Also Published As

Publication number Publication date
KR100379208B1 (ko) 2003-07-18
EP0703607B1 (en) 2001-12-12
KR960009213A (ko) 1996-03-22
DE69524516T2 (de) 2002-07-04
EP0703607A3 (en, 2012) 1996-04-24
EP0703607A2 (en) 1996-03-27
JPH0864610A (ja) 1996-03-08
US5445976A (en) 1995-08-29
DE69524516D1 (de) 2002-01-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees