TW274620B - - Google Patents

Info

Publication number
TW274620B
TW274620B TW082101467A TW82101467A TW274620B TW 274620 B TW274620 B TW 274620B TW 082101467 A TW082101467 A TW 082101467A TW 82101467 A TW82101467 A TW 82101467A TW 274620 B TW274620 B TW 274620B
Authority
TW
Taiwan
Application number
TW082101467A
Other languages
Chinese (zh)
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4090044A external-priority patent/JPH05258789A/ja
Priority claimed from JP4090045A external-priority patent/JPH05258790A/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of TW274620B publication Critical patent/TW274620B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H10W70/635—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H10W72/073—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
TW082101467A 1992-03-13 1993-03-01 TW274620B (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4090044A JPH05258789A (ja) 1992-03-13 1992-03-13 異方導電性接着フィルムおよびこれを用いた接続構造
JP4090045A JPH05258790A (ja) 1992-03-13 1992-03-13 異方導電性接着フィルムおよびこれを用いた接続構造

Publications (1)

Publication Number Publication Date
TW274620B true TW274620B (enExample) 1996-04-21

Family

ID=26431560

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082101467A TW274620B (enExample) 1992-03-13 1993-03-01

Country Status (4)

Country Link
US (1) US5438223A (enExample)
EP (1) EP0560072A3 (enExample)
KR (1) KR100260478B1 (enExample)
TW (1) TW274620B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8987607B2 (en) 2010-08-31 2015-03-24 Dexerials Corporation Conductive particle, and anisotropic conductive film, bonded structure, and bonding method

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JP6513281B2 (ja) * 2016-02-29 2019-05-15 富士フイルム株式会社 異方導電性接合部材、半導体デバイス、半導体パッケージおよび半導体デバイスの製造方法
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JP6950747B2 (ja) * 2017-11-16 2021-10-13 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8987607B2 (en) 2010-08-31 2015-03-24 Dexerials Corporation Conductive particle, and anisotropic conductive film, bonded structure, and bonding method

Also Published As

Publication number Publication date
KR930019791A (ko) 1993-10-18
US5438223A (en) 1995-08-01
EP0560072A2 (en) 1993-09-15
KR100260478B1 (ko) 2000-07-01
EP0560072A3 (en) 1993-10-06

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