TW274620B - - Google Patents

Info

Publication number
TW274620B
TW274620B TW082101467A TW82101467A TW274620B TW 274620 B TW274620 B TW 274620B TW 082101467 A TW082101467 A TW 082101467A TW 82101467 A TW82101467 A TW 82101467A TW 274620 B TW274620 B TW 274620B
Authority
TW
Taiwan
Application number
TW082101467A
Other languages
Chinese (zh)
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4090045A external-priority patent/JPH05258790A/ja
Priority claimed from JP4090044A external-priority patent/JPH05258789A/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of TW274620B publication Critical patent/TW274620B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H10W70/635—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H10W72/073—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW082101467A 1992-03-13 1993-03-01 TW274620B (cg-RX-API-DMAC10.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4090045A JPH05258790A (ja) 1992-03-13 1992-03-13 異方導電性接着フィルムおよびこれを用いた接続構造
JP4090044A JPH05258789A (ja) 1992-03-13 1992-03-13 異方導電性接着フィルムおよびこれを用いた接続構造

Publications (1)

Publication Number Publication Date
TW274620B true TW274620B (cg-RX-API-DMAC10.html) 1996-04-21

Family

ID=26431560

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082101467A TW274620B (cg-RX-API-DMAC10.html) 1992-03-13 1993-03-01

Country Status (4)

Country Link
US (1) US5438223A (cg-RX-API-DMAC10.html)
EP (1) EP0560072A3 (cg-RX-API-DMAC10.html)
KR (1) KR100260478B1 (cg-RX-API-DMAC10.html)
TW (1) TW274620B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8987607B2 (en) 2010-08-31 2015-03-24 Dexerials Corporation Conductive particle, and anisotropic conductive film, bonded structure, and bonding method

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995012643A1 (en) * 1993-11-03 1995-05-11 W. L. Gore & Associates, Inc. Electrically conductive adhesives
US5814180A (en) * 1993-11-03 1998-09-29 W. L. Gore & Associates, Inc. Low temperature method for mounting electrical components
EP0692137B1 (en) * 1994-01-27 2002-04-10 Loctite (Ireland) Limited Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
FR2726397B1 (fr) * 1994-10-28 1996-11-22 Commissariat Energie Atomique Film conducteur anisotrope pour la microconnectique
US5698496A (en) * 1995-02-10 1997-12-16 Lucent Technologies Inc. Method for making an anisotropically conductive composite medium
US5661901A (en) 1995-07-10 1997-09-02 Micron Technology, Inc. Method for mounting and electrically interconnecting semiconductor dice
US5851644A (en) * 1995-08-01 1998-12-22 Loctite (Ireland) Limited Films and coatings having anisotropic conductive pathways therein
US5673846A (en) * 1995-08-24 1997-10-07 International Business Machines Corporation Solder anchor decal and method
US5661042A (en) * 1995-08-28 1997-08-26 Motorola, Inc. Process for electrically connecting electrical devices using a conductive anisotropic material
GB2310315A (en) * 1996-02-15 1997-08-20 Motorola Gmbh Semiconductor die mounting arrangement
US5789271A (en) * 1996-03-18 1998-08-04 Micron Technology, Inc. Method for fabricating microbump interconnect for bare semiconductor dice
US5726075A (en) * 1996-03-29 1998-03-10 Micron Technology, Inc. Method for fabricating microbump interconnect for bare semiconductor dice
US5741430A (en) * 1996-04-25 1998-04-21 Lucent Technologies Inc. Conductive adhesive bonding means
US5761053A (en) * 1996-05-08 1998-06-02 W. L. Gore & Associates, Inc. Faraday cage
US5808360A (en) * 1996-05-15 1998-09-15 Micron Technology, Inc. Microbump interconnect for bore semiconductor dice
US5789278A (en) * 1996-07-30 1998-08-04 Micron Technology, Inc. Method for fabricating chip modules
US6977025B2 (en) * 1996-08-01 2005-12-20 Loctite (R&D) Limited Method of forming a monolayer of particles having at least two different sizes, and products formed thereby
US5916641A (en) * 1996-08-01 1999-06-29 Loctite (Ireland) Limited Method of forming a monolayer of particles
US6402876B1 (en) 1997-08-01 2002-06-11 Loctite (R&D) Ireland Method of forming a monolayer of particles, and products formed thereby
JP3878677B2 (ja) 1996-08-01 2007-02-07 ロックタイト（アイルランド）リミテッド 粒子の単一層を形成させる方法及びそれにより形成される生成物
US6202918B1 (en) 1997-01-28 2001-03-20 Eric Hertz Method and apparatus for placing conductive preforms
US6230963B1 (en) 1997-01-28 2001-05-15 Eric L. Hertz Method and apparatus using colored foils for placing conductive preforms
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US5973389A (en) * 1997-04-22 1999-10-26 International Business Machines Corporation Semiconductor chip carrier assembly
CA2292671A1 (en) 1997-06-12 1998-12-17 Zetfolie B.V. Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
JPH11168263A (ja) 1997-09-30 1999-06-22 Canon Inc 光デバイス装置及びその製造方法
US6156484A (en) * 1997-11-07 2000-12-05 International Business Machines Corporation Gray scale etching for thin flexible interposer
US6260264B1 (en) 1997-12-08 2001-07-17 3M Innovative Properties Company Methods for making z-axis electrical connections
TW359884B (en) * 1998-01-07 1999-06-01 Nanya Technology Co Ltd Multi-level interconnects with I-plug and production process therefor
US6897855B1 (en) * 1998-02-17 2005-05-24 Sarnoff Corporation Tiled electronic display structure
US6476783B2 (en) 1998-02-17 2002-11-05 Sarnoff Corporation Contrast enhancement for an electronic display device by using a black matrix and lens array on outer surface of display
US6370019B1 (en) 1998-02-17 2002-04-09 Sarnoff Corporation Sealing of large area display structures
US6084296A (en) * 1998-07-09 2000-07-04 Satcon Technology Corporation Low cost high power hermetic package with electrical feed-through bushings
KR100298829B1 (ko) * 1999-07-21 2001-11-01 윤종용 칩 사이즈 패키지의 솔더 접합 구조 및 방법
US6365977B1 (en) 1999-08-31 2002-04-02 International Business Machines Corporation Insulating interposer between two electronic components and process thereof
US6287894B1 (en) 1999-10-04 2001-09-11 Andersen Laboratories, Inc. Acoustic device packaged at wafer level
WO2001051580A1 (en) * 2000-01-13 2001-07-19 Nitto Denko Corporation Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof
JP2001217279A (ja) * 2000-02-01 2001-08-10 Mitsubishi Electric Corp 高密度実装装置
WO2001075970A2 (en) * 2000-03-31 2001-10-11 Dyconex Patente Ag Element and method for connecting constituents of an electronic assembly
JP2001351345A (ja) * 2000-06-12 2001-12-21 Alps Electric Co Ltd 磁気ヘッド装置および前記磁気ヘッド装置を搭載した磁気記録及び／または再生装置
JP4030285B2 (ja) * 2001-10-10 2008-01-09 株式会社トクヤマ 基板及びその製造方法
DE10392199T5 (de) * 2002-01-18 2005-01-05 Avery Dennison Corp., Pasadena Folie mit Mikroarchitektur
US20030155656A1 (en) * 2002-01-18 2003-08-21 Chiu Cindy Chia-Wen Anisotropically conductive film
US7514045B2 (en) * 2002-01-18 2009-04-07 Avery Dennison Corporation Covered microchamber structures
JP2004031555A (ja) * 2002-06-25 2004-01-29 Nec Corp 回路基板装置および基板間の接続方法
EP1515399B1 (en) * 2003-09-09 2008-12-31 Nitto Denko Corporation Anisotropic conductive film, production method thereof and method of use thereof
EP1686655A4 (en) * 2003-11-17 2008-02-13 Jsr Corp Anisotropic conductive sheet, manufacturing method thereof, and product using the same
JP2006278014A (ja) 2005-03-28 2006-10-12 Three M Innovative Properties Co 異方導電性構造体
US8802214B2 (en) * 2005-06-13 2014-08-12 Trillion Science, Inc. Non-random array anisotropic conductive film (ACF) and manufacturing processes
US20060280912A1 (en) * 2005-06-13 2006-12-14 Rong-Chang Liang Non-random array anisotropic conductive film (ACF) and manufacturing processes
US20070170599A1 (en) * 2006-01-24 2007-07-26 Masazumi Amagai Flip-attached and underfilled stacked semiconductor devices
US7923488B2 (en) * 2006-10-16 2011-04-12 Trillion Science, Inc. Epoxy compositions
JP2008117945A (ja) 2006-11-06 2008-05-22 Nitto Denko Corp ウォータージェットレーザダイシング用粘着シート
US20100186997A1 (en) * 2009-01-29 2010-07-29 Samtec Inc. Crimped solder on a flexible circuit board
US8507804B2 (en) * 2010-02-22 2013-08-13 Tyco Electronics Corporation Electrical connector with solder columns
US8138020B2 (en) * 2010-03-25 2012-03-20 International Business Machines Corporation Wafer level integrated interconnect decal and manufacturing method thereof
KR101310256B1 (ko) 2011-06-28 2013-09-23 삼성전기주식회사 인쇄회로기판의 무전해 표면처리 도금층 및 이의 제조방법
US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
US9102851B2 (en) 2011-09-15 2015-08-11 Trillion Science, Inc. Microcavity carrier belt and method of manufacture
US9365749B2 (en) 2013-05-31 2016-06-14 Sunray Scientific, Llc Anisotropic conductive adhesive with reduced migration
US9777197B2 (en) 2013-10-23 2017-10-03 Sunray Scientific, Llc UV-curable anisotropic conductive adhesive
JP6513281B2 (ja) * 2016-02-29 2019-05-15 富士フイルム株式会社 異方導電性接合部材、半導体デバイス、半導体パッケージおよび半導体デバイスの製造方法
US10038264B2 (en) 2016-11-14 2018-07-31 Microsoft Technology Licensing, Llc Universal coupling for electrically connecting a flexible printed circuit to another flexible printed circuit in multiple different orientations
JP6950747B2 (ja) * 2017-11-16 2021-10-13 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
WO2019098011A1 (ja) * 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
KR102650926B1 (ko) * 2017-11-17 2024-03-27 인스티튜시오 카탈라나 드 르세르카 아이 에스투디스 아반카츠 직접 그래핀 전사 및 그래핀 기반 디바이스
JP7370926B2 (ja) * 2020-04-24 2023-10-30 新光電気工業株式会社 端子構造、配線基板及び端子構造の製造方法
KR20220166865A (ko) * 2020-05-29 2022-12-19 미쓰이 가가쿠 가부시키가이샤 이방 도전성 시트, 이방 도전성 시트의 제조 방법, 전기 검사 장치 및 전기 검사 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5463200A (en) * 1977-10-31 1979-05-21 Shin Etsu Chem Co Ltd Acryloyloxy group-containing organopolysiloxane and its preparation
US4323914A (en) * 1979-02-01 1982-04-06 International Business Machines Corporation Heat transfer structure for integrated circuit package
JPS55161306A (en) * 1979-06-05 1980-12-15 Asahi Chemical Ind Partly plated porous sheet
CA1284523C (en) * 1985-08-05 1991-05-28 Leo G. Svendsen Uniaxially electrically conductive articles with porous insulating substrate
AU588925B2 (en) * 1985-11-06 1989-09-28 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
JPS6340218A (ja) * 1986-08-05 1988-02-20 住友スリ−エム株式会社 異方導電膜とその製造方法
JPS6394504A (ja) * 1986-10-08 1988-04-25 セイコーエプソン株式会社 異方性導電膜
EP0308971B1 (en) * 1987-09-24 1993-11-24 Kabushiki Kaisha Toshiba Bump and method of manufacturing the same
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
KR900701040A (ko) * 1988-02-05 1990-08-17 원본미기재 레이저 가공용 중합체
EP0344702B1 (en) * 1988-05-30 1996-03-13 Canon Kabushiki Kaisha Electric circuit apparatus
JP3022565B2 (ja) * 1988-09-13 2000-03-21 株式会社日立製作所 半導体装置
JP2984064B2 (ja) * 1989-12-19 1999-11-29 日東電工株式会社 異方導電フィルムの製造方法
SG47635A1 (en) * 1989-12-19 1998-04-17 Nitto Denko Corp Anisotropic conductive film and process for producing same
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
US5086558A (en) * 1990-09-13 1992-02-11 International Business Machines Corporation Direct attachment of semiconductor chips to a substrate with a substrate with a thermoplastic interposer
US5232702A (en) * 1991-07-22 1993-08-03 Dow Corning Corporation Silicone pressure sensitive adhesive compositons for transdermal drug delivery devices and related medical devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8987607B2 (en) 2010-08-31 2015-03-24 Dexerials Corporation Conductive particle, and anisotropic conductive film, bonded structure, and bonding method

Also Published As

Publication number Publication date
EP0560072A2 (en) 1993-09-15
EP0560072A3 (en) 1993-10-06
KR930019791A (ko) 1993-10-18
KR100260478B1 (ko) 2000-07-01
US5438223A (en) 1995-08-01

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