KR900701040A - 레이저 가공용 중합체 - Google Patents

레이저 가공용 중합체

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Publication number
KR900701040A
KR900701040A KR1019890701831A KR890701831A KR900701040A KR 900701040 A KR900701040 A KR 900701040A KR 1019890701831 A KR1019890701831 A KR 1019890701831A KR 890701831 A KR890701831 A KR 890701831A KR 900701040 A KR900701040 A KR 900701040A
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KR
South Korea
Prior art keywords
article
polymeric material
aromatic
laser
polyimide
Prior art date
Application number
KR1019890701831A
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English (en)
Inventor
미첼 조셉 러든
리차드 존 펀넥
니콜라스 제이. 지. 스미스
Original Assignee
원본미기재
레이켐 리미티드
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Publication date
Priority claimed from GB888802568A external-priority patent/GB8802568D0/en
Priority claimed from GB888828245A external-priority patent/GB8828245D0/en
Application filed by 원본미기재, 레이켐 리미티드 filed Critical 원본미기재
Publication of KR900701040A publication Critical patent/KR900701040A/ko

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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
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    • B23K2103/30—Organic material
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Abstract

내용 없음

Description

레이저 가공용 중합체
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (31)

  1. (a) 방향족 및/또는 비정질 폴리아미드재, 또는 (b) 중합체뼈대에 방향족고리 및 지방족 사슬을 반복하여 갖는 (단, 방향족사슬은 고분자재료가 폴리에스테르인 경우 적어도 4개의 탄소원자를 갖는다) 고분자재료로 적어도 부분적으로 구성된 레이저-융제-가공물품.
  2. 고분자재료의 일부를 제거할 정도의 에너지 플루엔스, 출력밀도, 및 레이저 파장에서 고분자재료의 본체를 레이저-융제-가공함으로 이루어지는 고분자재료의 물품을 제조하는 방법으로서, 상기 본체는 (a) 방향족 및/또는 비정질 폴리아미드재 또는 (b) 중합체뼈대에 방향족 고리 및 지방족사슬을 반복하여 갖는 (단, 방향족 사슬은, 고분자재료가 폴리에스테르인 경우, 적어도 4개의 탄소원자를 갖는다)고분자재료로 적어도 부분적으로 구성됨을 특징으로 하는 고분자재료의 물품을 제조하는 방법.
  3. 제1 또는 2항에 있어서, 고분자재료가 중합체뼈대에 방향성고리 및 지방족사슬을 갖는 폴리이미드 및 폴리에테르에스테르로부터 선택됨을 특징으로 하는 물품 또는 방법.
  4. 제3항에 있어서, 고분자재료가 에스테르 블록의 뼈대에 방향족고리를 갖는 폴리에테르에스테르 블록 공중합체로 이루어짐을 특징으로 하는 물품 또는 방법.
  5. 제4항에 있어서, 고분자재료가 에스테르 블록의 뼈대에 지방족사슬을 또한 갖는 폴리에테르에스테르 블록 공중합체로 이루어짐을 특징으로 하는 물품 또는 방법.
  6. 제3, 4 또는 5항에 있어서, 고분자재료가 에스테르블록의 뼈대에 지방족사슬을 가지지만 방향족고리를 가지지 않는 폴리에테르 에스테르 블록 공중합체로 이루어짐을 특징으로 하는 물품 또는 방법.
  7. 제1 내지 6항중 어느 항에 있어서, 상기의 지방족사슬의 적어도 일부는 적어도 4개의 탄소원자를 포함함을 특징으로 하는 물품 또는 방법.
  8. 제4항에 있어서, 공중합체는 반복단위식
    의 폴리에스테르 블록 및 반복단위식
    의 폴리에테르 블록으로 이루어짐을 특징으로 하는 물품 또는 방법.
  9. 제1 또는 2항에 있어서, 고분자재료가 폴리아미드로 이루어짐을 특징으로 하는 물품 또는 방법.
  10. 제9항에 있어서, 폴리아미드가 방향경임을 특징으로 하는 물품 또는 방법.
  11. 제10항에 있어서, 폴리아미드가 2뼈대에 프탈산으로부터 유도된 방향족고리를 가짐을 특징으로 하는 물품 또는 방법.
  12. 제9,10 또는 11항에 있어서, 고분자재료가 (a) 테레프탈산의 트리메틱사메틸렌 디아민(바람직하게는 2.2.4- 및 2.4.4-트리메틸헥사메틸렌 디아민 이성체의 혼합물을 함유하는 트리메틸헥사메틸린 디아민)과의 축합반응을 기본으로 하는 폴리아미드, (b) 하나이상의 지방족, 환상지방족 또는 방향족 디카르복실산, 예를 들면 테레프탈산 및 경우에 따라서는 하나이상의 아미노산 또는 락탐 예를들면 r-카프로락탐 공단량체와 하나 이상의 비스아미노 메틸노브보르난 이성체의 축합반응에 의해 형성될 폴리아미드 또는 (c) 라우린락탐, 이소프탈산 및 비스-(4-아미노-3-메틸시클로헥실) 메탄에서 유도된 단위체들을 기본으로 폴리아미드, 또는 (d) 아디프산 및 아젤라산과 2.2-비스(p-아미노시클로헥실)프로판의 축합반응에 기초한 폴리아미드 및, 상기(A)에서 언급된 트리메틸 헥사메틸렌 디아민 이성체와 트랜스시클로헥산-1.4-디카르복실산의 축합반응에 기초한 폴리아미드 또는, (e) m-크실렌디아민 및 아디프산에서 유도된 단위체들을 기본으로 한 폴리아미드로 이루어짐을 특징으로 하는 물품 또는 방법.
  13. 제3항에 있어서, 고분자재료가 뼈대에 피로멜릿이미드로부터 유도된 방향족고리를 갖는 폴리이미드로 이루어짐을 특징으로 하는 물품 또는 방법.
  14. 제3 또는 13항에 있어서, 고분자재료가 뼈대에 적어도 10개의 탄소원자의 지방족사슬을 갖는 폴리이미드로 이루어짐을 특징으로 하는 물품 또는 방법.
  15. 제13항에 있어서, 폴리이미드가 1.12-도데카메틸렌 피로멜릿 이미드 또는 1.13-트리데카메틸렌 피로멜릿이미드로부터 유도됨을 특징으로 하는 물품 또는 방법.
  16. 제1 내지 15항중 어느 항에 있어서, 레이저가공 고분자 재료가 비정질임을 특징으로 하는 물품 또는 방법.
  17. 제1 내지 16항중 어느 항에 있어서, UV파장, 바람직하게는 248nm이상의 파장으로 레이저가공됨을 특징으로 하는 물품 또는 방법.
  18. 제17항에 있어서, Xecl 또는 KrF엑시머 레이저에 의해 레이저가공됨을 특징으로 하는 물품 또는 방법.
  19. 제1내지 18항중 어느 항에 있어서, 고분자재료가 레이저 가공성을 향상시키기 위하여 방향족 카르보닐 화합물로 도핑됨을 특징으로 하는 물품 또는 방법.
  20. 제1 내지 19항중 어느 항에 있어서, 레이저 가공 고분자 재료는 폴리아미드재의 적어도 한층 및 폴리이미드재의 적어도 한층을 갖는 적층판으로 이루어짐을 특징으로 하는 물품 또는 방법.
  21. 제20항에 있어서, 폴리아미드층(들)은 제9내지 12항중 어느 항에서 청구된 폴리아미드로 이루어짐을 특징으로 하는 물품 또는 방법.
  22. 제20 또는 21항에 있어서, 폴리이미드층(들)은 제13내지 15층중 어느 항에서 청구된 폴리아미드로 이루어짐을 특징으로 하는 물품 또는 방법.
  23. 제20 또는 21항에 있어서, 폴리이미드는 4,4′-비페닐 디안히드라이드와 (4,4′-디아미노비페닐, 또는 4,4′-디아미노비페닐 에테르 또는 페닐렌디아민), 바람직하게는 페닐렌디아민의 중합반응으로부터 유도됨을 특징으로 하는 물품 또는 방법.
  24. 제20 내지 23항중 어느 항에 있어서, 폴리이미드재는 ASTM D882에 따라 4일간 100℃에서 pH10의 물에 담근후에 최초신율의 적어도 50%, 바람직하게는 적어도 75%보다 바람직하게는 적어도 85%를 유지할 수 있음을 특징으로 하는 물품 또는 방법.
  25. 제1 내지 24항중 어느 항에 있어서, 고분자재료는 판상이고, 관통구멍은 판상시이트를 통해서 레이저가공됨을 특징으로 하는 물품 또는 방법.
  26. 제1 내지 25항중 어느 항에 있어서, 레이저가공 고분자 재료는 지지기판상에서 스핀 피복됨을 특징으로 하는 물품 또는 방법.
  27. 제1 내지 26항중 어느 항에 있어서, 고분자재료의 적어도 일부는, 레이저가공을 위해 사용되는 출력보다 낮은 출력의 레이저광에 노출됨으로써 교차결합됨을 특징으로 하는 물품 또는 방법.
  28. 제1 및 3내지 26항중 어느 항에 있어서, 기판상에서 포토레지스트층의 형상을 이룸을 특징으로 하는 물품 또는 방법.
  29. 제2 내지 27항중 어느 항에 있어서, 제조물품이 고분자 포토레지스트층임을 특징으로 하는 물품.
  30. 제1 또는 2항에 있어서, 고분자재료가 사슬의 각 방향성핵과 사슬의 다음의 방향성 핵사이에 적어도 4개의 탄소원자의 지방족 사슬을 뼈대에 갖는 폴리에스테르로 이루어짐을 특징으로 하는 물품 또는 방법.
  31. 제1 내지 30항중 어느 항에 있어서, 고분자재료가 0.9이하, 바람직하게는 0.75이하, 보다 바람직하게는 0.65이하의 C : H비를 가짐을 특징으로 하는 물품 또는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890701831A 1988-02-05 1989-02-03 레이저 가공용 중합체 KR900701040A (ko)

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GB888802568A GB8802568D0 (en) 1988-02-05 1988-02-05 Laser-machining polymers
GB8802568 1988-02-05
GB8828245.4 1988-12-02
GB888828245A GB8828245D0 (en) 1988-12-02 1988-12-02 Anisotropically electrically conductive articles
PCT/GB1989/000109 WO1989007337A1 (en) 1988-02-05 1989-02-03 Laser-machining polymers

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DE68918300T2 (de) 1995-05-18
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ATE112098T1 (de) 1994-10-15
EP0400070A1 (en) 1990-12-05
DE68918300D1 (de) 1994-10-27
WO1989007337A1 (en) 1989-08-10
EP0327398A1 (en) 1989-08-09
US5487852A (en) 1996-01-30
EP0327398B1 (en) 1994-09-21

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