TW271432B - - Google Patents

Info

Publication number
TW271432B
TW271432B TW083105263A TW83105263A TW271432B TW 271432 B TW271432 B TW 271432B TW 083105263 A TW083105263 A TW 083105263A TW 83105263 A TW83105263 A TW 83105263A TW 271432 B TW271432 B TW 271432B
Authority
TW
Taiwan
Application number
TW083105263A
Other languages
Chinese (zh)
Original Assignee
Nitto Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Chemical Industry Co Ltd filed Critical Nitto Chemical Industry Co Ltd
Application granted granted Critical
Publication of TW271432B publication Critical patent/TW271432B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28Compounds of silicon
    • C09C1/30Silicic acid
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/157After-treatment of gels
    • C01B33/159Coating or hydrophobisation
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/157After-treatment of gels
    • C01B33/158Purification; Drying; Dehydrating
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/16Preparation of silica xerogels
    • C01B33/166Preparation of silica xerogels by acidification of silicate in the presence of an inert organic phase
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/295Organic, e.g. plastic containing a filler
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/30Particle morphology extending in three dimensions
    • C01P2004/32Spheres
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/51Particles with a specific particle size distribution
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/61Micrometer sized, i.e. from 1-100 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/10Solid density
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/12Surface area
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/40Electric properties
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/80Compositional purity
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW083105263A 1993-06-29 1994-06-09 TW271432B (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18207393 1993-06-29
JP14412494A JP3400548B2 (ja) 1993-06-29 1994-06-03 高純度球状シリカの製造方法

Publications (1)

Publication Number Publication Date
TW271432B true TW271432B (enrdf_load_stackoverflow) 1996-03-01

Family

ID=26475646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083105263A TW271432B (enrdf_load_stackoverflow) 1993-06-29 1994-06-09

Country Status (5)

Country Link
JP (1) JP3400548B2 (enrdf_load_stackoverflow)
KR (1) KR100279083B1 (enrdf_load_stackoverflow)
GB (1) GB2279944B (enrdf_load_stackoverflow)
SG (1) SG43819A1 (enrdf_load_stackoverflow)
TW (1) TW271432B (enrdf_load_stackoverflow)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4199885B2 (ja) * 1999-10-14 2008-12-24 東ソー・シリカ株式会社 インクジェット記録シート用非晶質シリカおよびその製造方法
JP4822576B2 (ja) * 2000-05-30 2011-11-24 京セラ株式会社 無機質中空粉体とその製造方法
US7070748B2 (en) 2000-09-27 2006-07-04 Mitsubishi Rayon Co., Ltd. Non-porous spherical silica and method for production thereof
JP2003137970A (ja) * 2001-08-24 2003-05-14 Sanyo Chem Ind Ltd 電気電子素子用エポキシ樹脂組成物
DE602004028364D1 (de) * 2003-05-13 2010-09-09 Asahi Glass Co Ltd Verfahren zur herstellung von anorganischen kugeln
US6955949B2 (en) 2003-10-16 2005-10-18 Kulicke & Soffa Investments, Inc. System and method for reducing or eliminating semiconductor device wire sweep
US7179688B2 (en) 2003-10-16 2007-02-20 Kulicke And Soffa Industries, Inc. Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method
US6847122B1 (en) * 2003-10-16 2005-01-25 Kulicke & Soffa Investments, Inc. System and method for preventing and alleviating short circuiting in a semiconductor device
KR100620215B1 (ko) 2004-07-29 2006-09-08 한국원자력연구소 스와이프 시료 분석을 위한 실리카기반 표준물질
KR100651243B1 (ko) 2005-03-04 2006-11-30 (주) 에스오씨 구형 실리카의 제조 방법
JP4707186B2 (ja) * 2005-10-03 2011-06-22 株式会社四国総合研究所 シリカ粉体の製法およびそれによって得られたシリカ粉体
JP5042252B2 (ja) * 2009-02-20 2012-10-03 学校法人 芝浦工業大学 ガラス材料の回収方法
CA2755648A1 (en) * 2009-03-16 2010-09-23 Basf Se Catalyst carrier based on silica gel
JP6059519B2 (ja) * 2012-11-28 2017-01-11 旭硝子株式会社 シリカ含有粒子の製造方法
JP2014105126A (ja) * 2012-11-28 2014-06-09 Asahi Glass Co Ltd シリカ含有粒子の製造方法
JP6203672B2 (ja) * 2013-03-29 2017-09-27 株式会社アドマテックス 3次元実装型半導体装置、樹脂組成物及びその製造方法
JP6196462B2 (ja) * 2013-04-11 2017-09-13 株式会社トクヤマ 多孔質球状金属酸化物
JP5865466B2 (ja) * 2014-11-17 2016-02-17 株式会社アドマテックス シリカ粒子材料及びフィラー含有樹脂組成物
WO2022210102A1 (ja) * 2021-03-31 2022-10-06 デンカ株式会社 金属酸化物粉末及びその製造方法
JP7656692B2 (ja) * 2021-03-31 2025-04-03 デンカ株式会社 二酸化ケイ素粉末

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2921839A (en) * 1955-12-23 1960-01-19 Columbia Southern Chem Corp Silica precipitation method
JPH01230422A (ja) * 1988-03-10 1989-09-13 Nippon Chem Ind Co Ltd 高純度シリカ及びその製造方法
IT1263807B (it) * 1992-01-24 1996-09-03 Mizusawa Industrial Chem Granuli sferici di silice porosa oppure di silicato poroso, procedimento per la loro produzione e loro impiego
JP3410522B2 (ja) * 1993-09-09 2003-05-26 水澤化学工業株式会社 粒状非晶質シリカの製造方法

Also Published As

Publication number Publication date
KR100279083B1 (ko) 2001-02-01
SG43819A1 (en) 1997-11-14
JPH0769617A (ja) 1995-03-14
KR950000563A (ko) 1995-01-03
GB9413100D0 (en) 1994-08-17
GB2279944A (en) 1995-01-18
JP3400548B2 (ja) 2003-04-28
GB2279944B (en) 1996-10-02

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