TW268033B - - Google Patents

Info

Publication number
TW268033B
TW268033B TW083105821A TW83105821A TW268033B TW 268033 B TW268033 B TW 268033B TW 083105821 A TW083105821 A TW 083105821A TW 83105821 A TW83105821 A TW 83105821A TW 268033 B TW268033 B TW 268033B
Authority
TW
Taiwan
Application number
TW083105821A
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP24128493A external-priority patent/JPH0797563A/ja
Priority claimed from JP24481793A external-priority patent/JPH07102187A/ja
Priority claimed from JP5372294A external-priority patent/JPH07258360A/ja
Priority claimed from JP6595894A external-priority patent/JPH0770451A/ja
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Application granted granted Critical
Publication of TW268033B publication Critical patent/TW268033B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0605Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0611Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only one nitrogen atom in the ring, e.g. polypyrroles
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
TW083105821A 1993-06-30 1994-06-27 TW268033B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP16141693 1993-06-30
JP24128493A JPH0797563A (ja) 1993-09-28 1993-09-28 半導体素子の封止用樹脂組成物および樹脂封止型半導体装置
JP24481793A JPH07102187A (ja) 1993-09-30 1993-09-30 撥水性塗布膜形成用組成物および撥水性塗料
JP5372294A JPH07258360A (ja) 1994-03-24 1994-03-24 樹脂硬化物の製造方法
JP6595894A JPH0770451A (ja) 1993-06-30 1994-04-04 熱硬化性樹脂組成物、熱硬化物およびその製造方法

Publications (1)

Publication Number Publication Date
TW268033B true TW268033B (zh) 1996-01-11

Family

ID=27523106

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083105821A TW268033B (zh) 1993-06-30 1994-06-27

Country Status (4)

Country Link
EP (1) EP0632059A3 (zh)
KR (1) KR950000753A (zh)
CA (1) CA2126958A1 (zh)
TW (1) TW268033B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381199B (zh) * 2007-04-09 2013-01-01 Sony Chem & Inf Device Corp Resin composition and display device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5981614A (en) * 1996-09-13 1999-11-09 Adiletta; Joseph G. Hydrophobic-oleophobic fluoropolymer compositions
DE10155453A1 (de) * 2001-11-12 2003-08-14 Inst Verbundwerkstoffe Gmbh Zähe Duroplaste bestehend aus Vinylester- und Epoxidharzen
US8231973B2 (en) 2006-06-13 2012-07-31 3M Innovative Properties Company Fluoro(meth)acrylate polymer composition suitable for low index layer of antireflective film
US8343624B2 (en) 2006-06-13 2013-01-01 3M Innovative Properties Company Durable antireflective film
US7615283B2 (en) 2006-06-13 2009-11-10 3M Innovative Properties Company Fluoro(meth)acrylate polymer composition suitable for low index layer of antireflective film
US20070286994A1 (en) 2006-06-13 2007-12-13 Walker Christopher B Durable antireflective film
BR112015005393A2 (pt) * 2012-09-11 2017-07-04 Mirteq Pty Ltd métodos de preparação e uso de polímeros de rede interpenetrante de vinil funcional produzidos pela mistura física de resinas de vinil funcional com composições de resinas termoplásticas
CN115536985B (zh) * 2022-10-27 2024-04-19 云浮晨宝新材料有限公司 一种耐高温、强度高的树脂组合物的制备方法及其应用

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2939859A (en) * 1954-03-31 1960-06-07 Shell Oil Co Process for preparing resinified product from polyepoxy polyether and aromatic-substituted-alkene-1 and composition for production of said product
US4410680A (en) * 1982-11-04 1983-10-18 Shell Oil Company Two-phase, heat-curable polyepoxide-unsaturated monomer compositions
JPS59149038A (ja) * 1983-02-15 1984-08-25 Nitto Electric Ind Co Ltd 半導体装置
JPS62101648A (ja) * 1985-10-30 1987-05-12 Fujitsu Ltd 半導体封止用エポキシ樹脂成形材料
US4654383A (en) * 1985-11-27 1987-03-31 Shell Oil Company Flame-retardant epoxy resins
JPH072888B2 (ja) * 1986-05-27 1995-01-18 旭硝子株式会社 エポキシ樹脂組成物
JPS63189412A (ja) * 1987-01-30 1988-08-05 Asahi Glass Co Ltd 電子部品封止用のエポキシ樹脂組成物
JPS63222051A (ja) * 1987-03-11 1988-09-14 Toyobo Co Ltd 光フアイバ用接着剤
JPH02235917A (ja) * 1989-03-09 1990-09-18 Murata Mfg Co Ltd 光熱硬化併用型樹脂組成物
JPH0768330B2 (ja) * 1990-04-12 1995-07-26 日立化成工業株式会社 ハイブリツドic用被覆材料およびこれで外装被覆されたハイブリツドic
JPH04328151A (ja) * 1991-04-30 1992-11-17 Nippon Oil & Fats Co Ltd エポキシ樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381199B (zh) * 2007-04-09 2013-01-01 Sony Chem & Inf Device Corp Resin composition and display device

Also Published As

Publication number Publication date
KR950000753A (ko) 1995-01-03
CA2126958A1 (en) 1994-12-31
EP0632059A2 (en) 1995-01-04
EP0632059A3 (en) 1996-04-17

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