TW265464B - - Google Patents

Info

Publication number
TW265464B
TW265464B TW083106990A TW83106990A TW265464B TW 265464 B TW265464 B TW 265464B TW 083106990 A TW083106990 A TW 083106990A TW 83106990 A TW83106990 A TW 83106990A TW 265464 B TW265464 B TW 265464B
Authority
TW
Taiwan
Application number
TW083106990A
Other languages
Chinese (zh)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW265464B publication Critical patent/TW265464B/zh

Links

Classifications

    • H10W74/012—
    • H10W74/40—
    • H10W74/114—
    • H10W74/121—
    • H10W74/15—
    • H10W74/47—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/5522—
    • H10W72/856—
    • H10W72/884—
    • H10W74/00—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—
TW083106990A 1993-08-03 1994-07-30 TW265464B (Direct)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/101,168 US5390082A (en) 1992-07-06 1993-08-03 Chip carrier with protective coating for circuitized surface

Publications (1)

Publication Number Publication Date
TW265464B true TW265464B (Direct) 1995-12-11

Family

ID=22283349

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083106990A TW265464B (Direct) 1993-08-03 1994-07-30

Country Status (10)

Country Link
US (1) US5390082A (Direct)
EP (1) EP0637839B1 (Direct)
JP (1) JP2723123B2 (Direct)
KR (1) KR0177138B1 (Direct)
CN (2) CN1051402C (Direct)
BR (1) BR9402986A (Direct)
CA (1) CA2126121C (Direct)
DE (1) DE69418395T2 (Direct)
MY (1) MY112247A (Direct)
TW (1) TW265464B (Direct)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2643074B2 (ja) * 1993-03-17 1997-08-20 インターナショナル・ビジネス・マシーンズ・コーポレイション 電気的接続構造
US5554821A (en) * 1994-07-15 1996-09-10 National Semiconductor Corporation Removable computer peripheral cards having a solid one-piece housing
US6150716A (en) * 1995-01-25 2000-11-21 International Business Machines Corporation Metal substrate having an IC chip and carrier mounting
US5677511A (en) * 1995-03-20 1997-10-14 National Semiconductor Corporation Overmolded PC board with ESD protection and EMI suppression
US6404049B1 (en) 1995-11-28 2002-06-11 Hitachi, Ltd. Semiconductor device, manufacturing method thereof and mounting board
US5851311A (en) * 1996-03-29 1998-12-22 Sophia Systems Co., Ltd. Polymerizable flux composition for encapsulating the solder in situ
AU6541996A (en) * 1996-06-24 1998-01-14 International Business Machines Corporation Stacked semiconductor device package
US5811883A (en) * 1996-09-30 1998-09-22 Intel Corporation Design for flip chip joint pad/LGA pad
US5760337A (en) * 1996-12-16 1998-06-02 Shell Oil Company Thermally reworkable binders for flip-chip devices
US5840215A (en) * 1996-12-16 1998-11-24 Shell Oil Company Anisotropic conductive adhesive compositions
US5912282A (en) * 1996-12-16 1999-06-15 Shell Oil Company Die attach adhesive compositions
HUP9701377A3 (en) * 1997-01-15 2000-01-28 Ibm Case and method for mouting an ic chip onto a carrier board or similar
US6403882B1 (en) * 1997-06-30 2002-06-11 International Business Machines Corporation Protective cover plate for flip chip assembly backside
GB9814317D0 (en) * 1997-07-23 1998-09-02 Murata Manufacturing Co Ceramic electronic part and method for producing the same
US6326696B1 (en) 1998-02-04 2001-12-04 International Business Machines Corporation Electronic package with interconnected chips
US6177726B1 (en) * 1999-02-11 2001-01-23 Philips Electronics North America Corporation SiO2 wire bond insulation in semiconductor assemblies
US20020014688A1 (en) * 1999-03-03 2002-02-07 Suresh Ramalingam Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials
US6506448B1 (en) 1999-06-01 2003-01-14 Fry's Metals, Inc. Method of protective coating BGA solder alloy spheres
JP4611588B2 (ja) * 1999-07-08 2011-01-12 サンスター技研株式会社 半導体パッケージのアンダーフィル材
US6439698B1 (en) 2000-01-14 2002-08-27 Lexmark International, Inc Dual curable encapsulating material
JP2001222751A (ja) * 2000-02-14 2001-08-17 Toshiba Electric Appliance Co Ltd 自動販売機温度制御装置
JP3604988B2 (ja) 2000-02-14 2004-12-22 シャープ株式会社 半導体装置およびその製造方法
JP4723169B2 (ja) * 2000-10-11 2011-07-13 オライオンテクノロジーズ，エルエルシー 紫外線硬化性ウレタン外被層を有する薄くて柔軟性及び適応性に富んだシート状のエレクトロルミネッセンス構造体
US6425655B1 (en) 2001-06-05 2002-07-30 Lexmark International, Inc. Dual curable encapsulating material
EP1424728A1 (de) * 2002-11-27 2004-06-02 Abb Research Ltd. Leistungshalbleitermodul
JP2005002335A (ja) * 2003-05-21 2005-01-06 Japan Gore Tex Inc 接着フィルムおよびこれを使った半導体装置
JP4378239B2 (ja) * 2004-07-29 2009-12-02 株式会社日立製作所 半導体装置及びそれを使用した電力変換装置並びにこの電力変換装置を用いたハイブリッド自動車。
US8710618B2 (en) 2007-03-12 2014-04-29 Honeywell International Inc. Fibrous laminate interface for security coatings
US8957509B2 (en) * 2011-06-23 2015-02-17 Stats Chippac Ltd. Integrated circuit packaging system with thermal emission and method of manufacture thereof
US9064820B2 (en) 2012-04-05 2015-06-23 Mekiec Manufacturing Corporation (Thailand) Ltd Method and encapsulant for flip-chip assembly
JP6386746B2 (ja) * 2014-02-26 2018-09-05 株式会社ジェイデバイス 半導体装置
CN116536155B (zh) * 2023-05-17 2024-04-09 扬州大学 一种芯片培养装置及其使用方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4300184A (en) * 1979-07-11 1981-11-10 Johnson Controls, Inc. Conformal coating for electrical circuit assemblies
JPS6018145B2 (ja) * 1980-09-22 1985-05-09 株式会社日立製作所 樹脂封止型半導体装置
US4546283A (en) * 1984-05-04 1985-10-08 The United States Of America As Represented By The Secretary Of The Air Force Conductor structure for thick film electrical device
JPS6167246A (ja) * 1984-09-10 1986-04-07 Nec Corp 混成集積回路装置
DE3442131A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
US4623559A (en) * 1985-07-12 1986-11-18 Westinghouse Electric Corp. U.V. cured flexible polyester-monoacrylate protective thermistor coatings having good edge coverage and method of coating
EP0340492A3 (en) * 1988-05-02 1990-07-04 International Business Machines Corporation Conformal sealing and interplanar encapsulation of electronic device structures
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
US5121190A (en) * 1990-03-14 1992-06-09 International Business Machines Corp. Solder interconnection structure on organic substrates
US5117279A (en) * 1990-03-23 1992-05-26 Motorola, Inc. Semiconductor device having a low temperature uv-cured epoxy seal
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
US5185498A (en) * 1991-06-11 1993-02-09 Delco Electronics Corporation Circuit assembly encapsulated with polybutadiene urethane
US5194027A (en) * 1991-09-09 1993-03-16 Planar Systems, Inc. Solid seal for thin film electroluminescent display panels
US5243133A (en) * 1992-02-18 1993-09-07 International Business Machines, Inc. Ceramic chip carrier with lead frame or edge clip
US5249101A (en) * 1992-07-06 1993-09-28 International Business Machines Corporation Chip carrier with protective coating for circuitized surface

Also Published As

Publication number Publication date
US5390082A (en) 1995-02-14
CN1051402C (zh) 2000-04-12
CN1103734A (zh) 1995-06-14
DE69418395T2 (de) 1999-12-16
JPH0778914A (ja) 1995-03-20
MY112247A (en) 2001-05-31
JP2723123B2 (ja) 1998-03-09
CA2126121A1 (en) 1995-02-04
EP0637839A2 (en) 1995-02-08
KR0177138B1 (ko) 1999-03-20
BR9402986A (pt) 1995-07-18
CN1142589C (zh) 2004-03-17
EP0637839A3 (en) 1995-06-28
CN1228613A (zh) 1999-09-15
KR950007621A (ko) 1995-03-21
EP0637839B1 (en) 1999-05-12
CA2126121C (en) 1997-09-16
DE69418395D1 (de) 1999-06-17

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