TW256826B - - Google Patents

Info

Publication number
TW256826B
TW256826B TW083100837A TW83100837A TW256826B TW 256826 B TW256826 B TW 256826B TW 083100837 A TW083100837 A TW 083100837A TW 83100837 A TW83100837 A TW 83100837A TW 256826 B TW256826 B TW 256826B
Authority
TW
Taiwan
Application number
TW083100837A
Other languages
Chinese (zh)
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of TW256826B publication Critical patent/TW256826B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H10W70/093—
    • H10W70/098—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW083100837A 1993-02-02 1994-02-01 TW256826B (oth)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1520393 1993-02-02

Publications (1)

Publication Number Publication Date
TW256826B true TW256826B (oth) 1995-09-11

Family

ID=11882315

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083100837A TW256826B (oth) 1993-02-02 1994-02-01

Country Status (5)

Country Link
US (2) US5547530A (oth)
EP (1) EP0609861B1 (oth)
KR (1) KR0179404B1 (oth)
DE (1) DE69434049T2 (oth)
TW (1) TW256826B (oth)

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US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US6033764A (en) * 1994-12-16 2000-03-07 Zecal Corp. Bumped substrate assembly
WO1996039298A1 (en) * 1995-06-06 1996-12-12 Sarnoff Corporation Method for the reduction of lateral shrinkage in multilayer circuit boards on a support
US6709749B1 (en) * 1995-06-06 2004-03-23 Lamina Ceramics, Inc. Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate
DE19541976A1 (de) * 1995-11-10 1997-05-15 Ego Elektro Blanc & Fischer Elektrische Schaltung
JP2751912B2 (ja) * 1996-03-28 1998-05-18 日本電気株式会社 半導体装置およびその製造方法
DE19634646A1 (de) * 1996-08-27 1998-03-05 Pac Tech Gmbh Verfahren zur selektiven Belotung
JPH10107440A (ja) * 1996-09-30 1998-04-24 Sumitomo Kinzoku Electro Device:Kk セラミック基板及びその製造方法
JP3570599B2 (ja) * 1997-01-14 2004-09-29 株式会社村田製作所 圧電素子およびその製造方法
US6202918B1 (en) 1997-01-28 2001-03-20 Eric Hertz Method and apparatus for placing conductive preforms
US6230963B1 (en) 1997-01-28 2001-05-15 Eric L. Hertz Method and apparatus using colored foils for placing conductive preforms
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US6162661A (en) * 1997-05-30 2000-12-19 Tessera, Inc. Spacer plate solder ball placement fixture and methods therefor
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US5904502A (en) * 1997-09-04 1999-05-18 International Business Machines Corporation Multiple 3-dimensional semiconductor device processing method and apparatus
US5924003A (en) * 1997-11-14 1999-07-13 Kinetrix, Inc. Method of manufacturing ball grid arrays for improved testability
US6117367A (en) * 1998-02-09 2000-09-12 International Business Machines Corporation Pastes for improved substrate dimensional control
US6300254B1 (en) * 1998-04-17 2001-10-09 Tessera, Inc. Methods of making compliant interfaces and microelectronic packages using same
US5923955A (en) * 1998-05-28 1999-07-13 Xerox Corporation Fine flip chip interconnection
JP4151136B2 (ja) 1998-06-15 2008-09-17 松下電器産業株式会社 基板および半導体装置とその製造方法
DE19842276A1 (de) * 1998-09-16 2000-03-30 Bosch Gmbh Robert Paste zum Verschweißen von Keramiken mit Metallen und Verfahren zur Herstellung einer Schweißverbindung
JP3771099B2 (ja) * 1999-01-27 2006-04-26 松下電器産業株式会社 グリーンシート及びその製造方法、多層配線基板の製造方法、両面配線基板の製造方法
US6376054B1 (en) * 1999-02-10 2002-04-23 International Business Machines Corporation Surface metallization structure for multiple chip test and burn-in
US6047637A (en) * 1999-06-17 2000-04-11 Fujitsu Limited Method of paste printing using stencil and masking layer
US6361735B1 (en) * 1999-09-01 2002-03-26 General Electric Company Composite ceramic article and method of making
KR100315751B1 (ko) * 1999-12-31 2001-12-12 송재인 저온 소성 세라믹 다층기판
JP4795602B2 (ja) * 2000-01-31 2011-10-19 京セラキンセキ株式会社 発振器
DE10035170B4 (de) * 2000-07-19 2005-11-24 Siemens Ag Keramikkörper mit Temperiervorrichtung, Verfahren zum Herstellen und Verwendung des Keramikkörpers
US7506438B1 (en) * 2000-11-14 2009-03-24 Freescale Semiconductor, Inc. Low profile integrated module interconnects and method of fabrication
US20040099441A1 (en) * 2001-04-24 2004-05-27 Akira Ichiryu Printed circuit board,its manufacturing method and csp manufacturing method
JP4034073B2 (ja) * 2001-05-11 2008-01-16 株式会社ルネサステクノロジ 半導体装置の製造方法
KR20030050396A (ko) * 2001-12-18 2003-06-25 오리온전기 주식회사 저온 동시 소성 세라믹 모듈 제조 방법
KR20040051961A (ko) * 2002-12-13 2004-06-19 삼화전자공업 주식회사 태양전지용 기판 및 그 제조방법
US20060142413A1 (en) * 2003-02-25 2006-06-29 Jose Zimmer Antimicrobial active borosilicate glass
US7378049B2 (en) * 2003-12-08 2008-05-27 Matsushita Electric Industrial Co., Ltd. Method for producing ceramic substrate and electronic component module using ceramic substrate
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JPWO2006035528A1 (ja) * 2004-09-29 2008-05-15 株式会社村田製作所 スタックモジュール及びその製造方法
US20090139759A1 (en) * 2004-12-20 2009-06-04 Murata Manufacturing Co., Ltd. Laminated ceramic electronic component and manufacturing method therefor
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JP4361572B2 (ja) * 2007-02-28 2009-11-11 株式会社新川 ボンディング装置及び方法
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JP4337950B2 (ja) * 2007-09-06 2009-09-30 株式会社村田製作所 回路基板の製造方法
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KR102005274B1 (ko) * 2017-06-29 2019-07-31 주식회사 디아이티 다층 세라믹 기판 및 그의 제조 방법
JP7666601B2 (ja) * 2021-07-05 2025-04-22 株式会社村田製作所 回路基板
WO2025005462A1 (ko) * 2023-06-29 2025-01-02 (주) 알엔투테크놀로지 세라믹 회로 기판, 그 제조방법, 및 이를 구비한 양면 냉각형 파워 모듈
WO2025005463A1 (ko) * 2023-06-29 2025-01-02 (주) 알엔투테크놀로지 세라믹 회로 기판, 그 제조방법, 및 이를 구비한 양면 냉각형 파워 모듈
WO2025005457A1 (ko) * 2023-06-29 2025-01-02 (주) 알엔투테크놀로지 세라믹 회로 기판, 그 제조방법, 및 이를 구비한 양면 냉각형 파워 모듈

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Also Published As

Publication number Publication date
DE69434049D1 (de) 2004-11-11
KR940020875A (ko) 1994-09-16
US5547530A (en) 1996-08-20
EP0609861B1 (en) 2004-10-06
EP0609861A2 (en) 1994-08-10
DE69434049T2 (de) 2005-02-10
EP0609861A3 (en) 1995-01-04
KR0179404B1 (ko) 1999-05-15
US5525402A (en) 1996-06-11

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