TW250583B - - Google Patents

Info

Publication number
TW250583B
TW250583B TW083100744A TW83100744A TW250583B TW 250583 B TW250583 B TW 250583B TW 083100744 A TW083100744 A TW 083100744A TW 83100744 A TW83100744 A TW 83100744A TW 250583 B TW250583 B TW 250583B
Authority
TW
Taiwan
Application number
TW083100744A
Other languages
Chinese (zh)
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Application granted granted Critical
Publication of TW250583B publication Critical patent/TW250583B/zh

Links

Classifications

    • H10W74/124—
    • H10W76/10—
    • H10W40/778—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07338—
    • H10W72/075—
    • H10W72/077—
    • H10W72/354—
    • H10W72/381—
    • H10W72/5522—
    • H10W72/5525—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—
TW083100744A 1992-09-17 1994-01-29 TW250583B (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/946,119 US5367196A (en) 1992-09-17 1992-09-17 Molded plastic semiconductor package including an aluminum alloy heat spreader

Publications (1)

Publication Number Publication Date
TW250583B true TW250583B (index.php) 1995-07-01

Family

ID=25483981

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083100744A TW250583B (index.php) 1992-09-17 1994-01-29

Country Status (11)

Country Link
US (1) US5367196A (index.php)
EP (1) EP0662244B1 (index.php)
JP (1) JPH08501414A (index.php)
KR (1) KR100258543B1 (index.php)
AU (1) AU4842893A (index.php)
CA (1) CA2144881A1 (index.php)
DE (1) DE69330607T2 (index.php)
MX (1) MX9305446A (index.php)
PH (1) PH30198A (index.php)
TW (1) TW250583B (index.php)
WO (1) WO1994007263A1 (index.php)

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JP3910144B2 (ja) * 2003-01-06 2007-04-25 シャープ株式会社 半導体発光装置およびその製造方法
JP3841768B2 (ja) * 2003-05-22 2006-11-01 新光電気工業株式会社 パッケージ部品及び半導体パッケージ
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JP4610414B2 (ja) * 2005-03-22 2011-01-12 京セラ株式会社 電子部品収納用パッケージおよび電子装置ならびに電子装置の実装構造
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JP5949742B2 (ja) * 2008-12-09 2016-07-13 日本軽金属株式会社 液冷ジャケット
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JP6057498B2 (ja) * 2011-03-09 2017-01-11 株式会社三社電機製作所 半導体装置
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JP2013145814A (ja) * 2012-01-16 2013-07-25 Hitachi Ltd パワーモジュール
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JP5941787B2 (ja) * 2012-08-09 2016-06-29 日立オートモティブシステムズ株式会社 パワーモジュールおよびパワーモジュールの製造方法
JP6028592B2 (ja) 2013-01-25 2016-11-16 三菱電機株式会社 半導体装置
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US10096573B2 (en) * 2015-07-28 2018-10-09 Bridge Semiconductor Corporation Face-to-face semiconductor assembly having semiconductor device in dielectric recess
US10721840B2 (en) 2017-10-11 2020-07-21 DISH Technologies L.L.C. Heat spreader assembly
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Also Published As

Publication number Publication date
DE69330607D1 (de) 2001-09-20
EP0662244A4 (en) 1995-09-13
AU4842893A (en) 1994-04-12
JPH08501414A (ja) 1996-02-13
CA2144881A1 (en) 1994-03-31
KR100258543B1 (ko) 2000-06-15
WO1994007263A1 (en) 1994-03-31
EP0662244B1 (en) 2001-08-16
EP0662244A1 (en) 1995-07-12
DE69330607T2 (de) 2002-07-04
KR950703794A (ko) 1995-09-20
PH30198A (en) 1997-02-05
MX9305446A (es) 1994-05-31
US5367196A (en) 1994-11-22

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