TW240325B - - Google Patents
Info
- Publication number
- TW240325B TW240325B TW083107338A TW83107338A TW240325B TW 240325 B TW240325 B TW 240325B TW 083107338 A TW083107338 A TW 083107338A TW 83107338 A TW83107338 A TW 83107338A TW 240325 B TW240325 B TW 240325B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/03—Pressure vessels, or vacuum vessels, having closure members or seals specially adapted therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical Vapour Deposition (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22068093A JP3158264B2 (ja) | 1993-08-11 | 1993-08-11 | ガス処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW240325B true TW240325B (zh) | 1995-02-11 |
Family
ID=16754789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083107338A TW240325B (zh) | 1993-08-11 | 1994-08-11 |
Country Status (4)
Country | Link |
---|---|
US (2) | US5522412A (zh) |
JP (1) | JP3158264B2 (zh) |
KR (1) | KR100381822B1 (zh) |
TW (1) | TW240325B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI412091B (zh) * | 2005-11-15 | 2013-10-11 | Toray Eng Co Ltd | 分配裝置及安裝系統 |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5688359A (en) * | 1995-07-20 | 1997-11-18 | Micron Technology, Inc. | Muffle etch injector assembly |
JP3601153B2 (ja) * | 1995-12-27 | 2004-12-15 | 東京エレクトロン株式会社 | 処理ガス供給装置のクリーニング方法 |
US6132522A (en) * | 1996-07-19 | 2000-10-17 | Cfmt, Inc. | Wet processing methods for the manufacture of electronic components using sequential chemical processing |
US6019848A (en) * | 1996-11-13 | 2000-02-01 | Applied Materials, Inc. | Lid assembly for high temperature processing chamber |
TW471031B (en) * | 1997-01-08 | 2002-01-01 | Ebara Corp | Vapor feed supply system |
AT407586B (de) * | 1997-05-23 | 2001-04-25 | Sez Semiconduct Equip Zubehoer | Anordnung zum behandeln scheibenförmiger gegenstände, insbesondere von siliziumwafern |
US5972078A (en) * | 1997-07-31 | 1999-10-26 | Fsi International, Inc. | Exhaust rinse manifold for use with a coating apparatus |
US5913721A (en) * | 1998-04-06 | 1999-06-22 | Taiwan Semiconductor Manufacturing Co. Ltd. | Ventilation hood with enhanced particle control and method of using |
JP3403357B2 (ja) | 1999-06-03 | 2003-05-06 | 株式会社半導体先端テクノロジーズ | 配線形成方法及び配線形成装置 |
US6221164B1 (en) | 2000-01-25 | 2001-04-24 | Advanced Micro Devices, Inc. | Method of in-situ cleaning for LPCVD teos pump |
TW552165B (en) * | 2000-02-03 | 2003-09-11 | Winbond Electronics Corp | New clean method and equipment for dispersion head |
JP4121269B2 (ja) * | 2001-11-27 | 2008-07-23 | 日本エー・エス・エム株式会社 | セルフクリーニングを実行するプラズマcvd装置及び方法 |
TWI294155B (en) * | 2002-06-21 | 2008-03-01 | Applied Materials Inc | Transfer chamber for vacuum processing system |
JP4262004B2 (ja) * | 2002-08-29 | 2009-05-13 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
US6997197B2 (en) * | 2002-12-13 | 2006-02-14 | International Business Machines Corporation | Apparatus and method for rapid thermal control of a workpiece in liquid or dense phase fluid |
US7045020B2 (en) * | 2003-05-22 | 2006-05-16 | Applied Materials, Inc. | Cleaning a component of a process chamber |
US7044997B2 (en) * | 2003-09-24 | 2006-05-16 | Micron Technology, Inc. | Process byproduct trap, methods of use, and system including same |
JP4936497B2 (ja) * | 2004-01-09 | 2012-05-23 | 株式会社日立国際電気 | 基板処理装置及び基板処理方法 |
US7784164B2 (en) * | 2004-06-02 | 2010-08-31 | Applied Materials, Inc. | Electronic device manufacturing chamber method |
CN103199039B (zh) * | 2004-06-02 | 2016-01-13 | 应用材料公司 | 电子装置制造室及其形成方法 |
US20060201074A1 (en) * | 2004-06-02 | 2006-09-14 | Shinichi Kurita | Electronic device manufacturing chamber and methods of forming the same |
US20070256710A1 (en) * | 2004-06-10 | 2007-11-08 | Dtl Technologies, Inc. | Chemical process operations on wafers having through-holes and a pressure differential between the major surfaces thereof |
KR100763667B1 (ko) | 2005-12-28 | 2007-10-04 | 동부일렉트로닉스 주식회사 | 반도체 제조용 식각장치 |
JP5239546B2 (ja) * | 2008-06-23 | 2013-07-17 | 三菱電機株式会社 | 恒温槽 |
JP2010209419A (ja) * | 2009-03-11 | 2010-09-24 | Mitsui Eng & Shipbuild Co Ltd | 原子層成長装置 |
JP5553898B2 (ja) * | 2010-07-13 | 2014-07-16 | 株式会社アルバック | 成膜装置及び成膜装置の洗浄方法 |
JP5720954B2 (ja) * | 2012-03-06 | 2015-05-20 | 株式会社ダイフク | 天井搬送車の清掃装置 |
US20140027060A1 (en) * | 2012-07-27 | 2014-01-30 | Applied Matericals, Inc | Gas distribution apparatus for substrate processing systems |
US10174422B2 (en) | 2012-10-25 | 2019-01-08 | Applied Materials, Inc. | Apparatus for selective gas injection and extraction |
TWM487519U (zh) * | 2014-06-17 | 2014-10-01 | Full Power Idea Tech Ltd | 箱體清洗治具 |
KR102284064B1 (ko) * | 2014-09-16 | 2021-08-02 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 자동 클리닝 기능을 갖는 코터 및 코터 자동 클리닝 방법 |
CN106269607B (zh) * | 2016-08-16 | 2018-09-28 | 泰州市美斯顿机械制造有限公司 | 一种马赛克瓷砖精细保养装置 |
JP6535649B2 (ja) * | 2016-12-12 | 2019-06-26 | 株式会社荏原製作所 | 基板処理装置、排出方法およびプログラム |
CN113333363A (zh) * | 2021-06-24 | 2021-09-03 | 嘉兴汉工汽车紧固件有限公司 | 一种气囊螺纹套筒生产用清洗装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3479679A (en) * | 1967-10-23 | 1969-11-25 | Us Navy | Apparatus for cleansing a contaminated chamber |
US4141373A (en) * | 1977-09-28 | 1979-02-27 | Rjr Archer, Inc. | Method for deoiling metal scrap |
US4316750A (en) * | 1981-01-16 | 1982-02-23 | Western Electric Company, Inc. | Apparatus and method for cleaning a flux station of a soldering system |
US4469143A (en) * | 1982-02-16 | 1984-09-04 | Chevron Research Company | Tank truck purging system |
JPS61176113A (ja) * | 1985-01-31 | 1986-08-07 | Toshiba Corp | 半導体処理装置 |
JPS62294351A (ja) * | 1986-06-13 | 1987-12-21 | Matsushita Electric Ind Co Ltd | 音響カプラ |
US4816081A (en) * | 1987-02-17 | 1989-03-28 | Fsi Corporation | Apparatus and process for static drying of substrates |
JPH0663096B2 (ja) * | 1988-11-25 | 1994-08-17 | コマツ電子金属株式会社 | 気相成長用反応炉の洗浄方法 |
US5051135A (en) * | 1989-01-30 | 1991-09-24 | Kabushiki Kaisha Tiyoda Seisakusho | Cleaning method using a solvent while preventing discharge of solvent vapors to the environment |
US5095925A (en) * | 1989-03-13 | 1992-03-17 | Elledge David M | Aseptic cleaning apparatus |
JPH034530A (ja) * | 1989-06-01 | 1991-01-10 | Matsushita Electric Ind Co Ltd | 半導体製造装置 |
JP2847166B2 (ja) * | 1989-09-08 | 1999-01-13 | 富士通株式会社 | 半導体製造装置 |
JP3020065B2 (ja) * | 1990-02-26 | 2000-03-15 | 富士通株式会社 | 半導体製造装置の洗浄方法及び半導体製造装置 |
US5027841A (en) * | 1990-04-24 | 1991-07-02 | Electronic Controls Design, Inc. | Apparatus to clean printed circuit boards |
JPH0456770A (ja) * | 1990-06-25 | 1992-02-24 | Hitachi Electron Eng Co Ltd | プラズマcvd装置のクリーニング方法 |
US5069235A (en) * | 1990-08-02 | 1991-12-03 | Bold Plastics, Inc. | Apparatus for cleaning and rinsing wafers |
JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
US5401321A (en) * | 1991-11-11 | 1995-03-28 | Leybold Aktiengesellschaft | Method for cleaning material contaminated with greasy or oily substances |
EP0632144B1 (en) * | 1993-06-30 | 1999-09-08 | Applied Materials, Inc. | Method of purging and pumping vacuum chamber to ultra-high vacuum |
US5388601A (en) * | 1994-03-15 | 1995-02-14 | Mansur; Pierre G. | Spray gun washing apparatus |
-
1993
- 1993-08-11 JP JP22068093A patent/JP3158264B2/ja not_active Expired - Fee Related
-
1994
- 1994-08-11 TW TW083107338A patent/TW240325B/zh active
- 1994-08-11 US US08/289,117 patent/US5522412A/en not_active Ceased
- 1994-08-11 KR KR1019940019789A patent/KR100381822B1/ko not_active IP Right Cessation
-
1998
- 1998-06-02 US US09/088,377 patent/USRE36925E/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI412091B (zh) * | 2005-11-15 | 2013-10-11 | Toray Eng Co Ltd | 分配裝置及安裝系統 |
Also Published As
Publication number | Publication date |
---|---|
KR100381822B1 (ko) | 2003-06-27 |
US5522412A (en) | 1996-06-04 |
KR950005364A (ko) | 1995-03-20 |
USRE36925E (en) | 2000-10-31 |
JP3158264B2 (ja) | 2001-04-23 |
JPH0758034A (ja) | 1995-03-03 |