TW240325B - - Google Patents

Info

Publication number
TW240325B
TW240325B TW083107338A TW83107338A TW240325B TW 240325 B TW240325 B TW 240325B TW 083107338 A TW083107338 A TW 083107338A TW 83107338 A TW83107338 A TW 83107338A TW 240325 B TW240325 B TW 240325B
Authority
TW
Taiwan
Application number
TW083107338A
Original Assignee
Tokyo Electron Co Ltd
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd, Fujitsu Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW240325B publication Critical patent/TW240325B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/03—Pressure vessels, or vacuum vessels, having closure members or seals specially adapted therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
TW083107338A 1993-08-11 1994-08-11 TW240325B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22068093A JP3158264B2 (ja) 1993-08-11 1993-08-11 ガス処理装置

Publications (1)

Publication Number Publication Date
TW240325B true TW240325B (zh) 1995-02-11

Family

ID=16754789

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083107338A TW240325B (zh) 1993-08-11 1994-08-11

Country Status (4)

Country Link
US (2) US5522412A (zh)
JP (1) JP3158264B2 (zh)
KR (1) KR100381822B1 (zh)
TW (1) TW240325B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412091B (zh) * 2005-11-15 2013-10-11 Toray Eng Co Ltd 分配裝置及安裝系統

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US5688359A (en) 1995-07-20 1997-11-18 Micron Technology, Inc. Muffle etch injector assembly
JP3601153B2 (ja) * 1995-12-27 2004-12-15 東京エレクトロン株式会社 処理ガス供給装置のクリーニング方法
US6132522A (en) * 1996-07-19 2000-10-17 Cfmt, Inc. Wet processing methods for the manufacture of electronic components using sequential chemical processing
US6019848A (en) * 1996-11-13 2000-02-01 Applied Materials, Inc. Lid assembly for high temperature processing chamber
TW471031B (en) * 1997-01-08 2002-01-01 Ebara Corp Vapor feed supply system
AT407586B (de) * 1997-05-23 2001-04-25 Sez Semiconduct Equip Zubehoer Anordnung zum behandeln scheibenförmiger gegenstände, insbesondere von siliziumwafern
US5972078A (en) * 1997-07-31 1999-10-26 Fsi International, Inc. Exhaust rinse manifold for use with a coating apparatus
US5913721A (en) * 1998-04-06 1999-06-22 Taiwan Semiconductor Manufacturing Co. Ltd. Ventilation hood with enhanced particle control and method of using
JP3403357B2 (ja) 1999-06-03 2003-05-06 株式会社半導体先端テクノロジーズ 配線形成方法及び配線形成装置
US6221164B1 (en) 2000-01-25 2001-04-24 Advanced Micro Devices, Inc. Method of in-situ cleaning for LPCVD teos pump
TW552165B (en) * 2000-02-03 2003-09-11 Winbond Electronics Corp New clean method and equipment for dispersion head
JP4121269B2 (ja) * 2001-11-27 2008-07-23 日本エー・エス・エム株式会社 セルフクリーニングを実行するプラズマｃｖｄ装置及び方法
AU2003245592A1 (en) * 2002-06-21 2004-01-06 Applied Materials, Inc. Transfer chamber for vacuum processing system
JP4262004B2 (ja) * 2002-08-29 2009-05-13 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US6997197B2 (en) * 2002-12-13 2006-02-14 International Business Machines Corporation Apparatus and method for rapid thermal control of a workpiece in liquid or dense phase fluid
US7045020B2 (en) * 2003-05-22 2006-05-16 Applied Materials, Inc. Cleaning a component of a process chamber
US7044997B2 (en) * 2003-09-24 2006-05-16 Micron Technology, Inc. Process byproduct trap, methods of use, and system including same
JP4936497B2 (ja) * 2004-01-09 2012-05-23 株式会社日立国際電気 基板処理装置及び基板処理方法
US7784164B2 (en) * 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
US20060201074A1 (en) * 2004-06-02 2006-09-14 Shinichi Kurita Electronic device manufacturing chamber and methods of forming the same
CN103199039B (zh) * 2004-06-02 2016-01-13 应用材料公司 电子装置制造室及其形成方法
US20070256710A1 (en) * 2004-06-10 2007-11-08 Dtl Technologies, Inc. Chemical process operations on wafers having through-holes and a pressure differential between the major surfaces thereof
KR100763667B1 (ko) 2005-12-28 2007-10-04 동부일렉트로닉스 주식회사 반도체 제조용 식각장치
JP5239546B2 (ja) * 2008-06-23 2013-07-17 三菱電機株式会社 恒温槽
JP2010209419A (ja) * 2009-03-11 2010-09-24 Mitsui Eng & Shipbuild Co Ltd 原子層成長装置
JP5553898B2 (ja) * 2010-07-13 2014-07-16 株式会社アルバック 成膜装置及び成膜装置の洗浄方法
JP5720954B2 (ja) * 2012-03-06 2015-05-20 株式会社ダイフク 天井搬送車の清掃装置
US20140027060A1 (en) * 2012-07-27 2014-01-30 Applied Matericals, Inc Gas distribution apparatus for substrate processing systems
US10174422B2 (en) 2012-10-25 2019-01-08 Applied Materials, Inc. Apparatus for selective gas injection and extraction
TWM487519U (zh) * 2014-06-17 2014-10-01 Full Power Idea Tech Ltd 箱體清洗治具
US10816901B2 (en) * 2014-09-16 2020-10-27 Acm Research (Shanghai) Inc. Coater with automatic cleaning function and coater automatic cleaning method
CN106269607B (zh) * 2016-08-16 2018-09-28 泰州市美斯顿机械制造有限公司 一种马赛克瓷砖精细保养装置
JP6535649B2 (ja) * 2016-12-12 2019-06-26 株式会社荏原製作所 基板処理装置、排出方法およびプログラム

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US3479679A (en) * 1967-10-23 1969-11-25 Us Navy Apparatus for cleansing a contaminated chamber
US4141373A (en) * 1977-09-28 1979-02-27 Rjr Archer, Inc. Method for deoiling metal scrap
US4316750A (en) * 1981-01-16 1982-02-23 Western Electric Company, Inc. Apparatus and method for cleaning a flux station of a soldering system
US4469143A (en) * 1982-02-16 1984-09-04 Chevron Research Company Tank truck purging system
JPS61176113A (ja) * 1985-01-31 1986-08-07 Toshiba Corp 半導体処理装置
JPS62294351A (ja) * 1986-06-13 1987-12-21 Matsushita Electric Ind Co Ltd 音響カプラ
US4816081A (en) * 1987-02-17 1989-03-28 Fsi Corporation Apparatus and process for static drying of substrates
JPH0663096B2 (ja) * 1988-11-25 1994-08-17 コマツ電子金属株式会社 気相成長用反応炉の洗浄方法
US5051135A (en) * 1989-01-30 1991-09-24 Kabushiki Kaisha Tiyoda Seisakusho Cleaning method using a solvent while preventing discharge of solvent vapors to the environment
US5095925A (en) * 1989-03-13 1992-03-17 Elledge David M Aseptic cleaning apparatus
JPH034530A (ja) * 1989-06-01 1991-01-10 Matsushita Electric Ind Co Ltd 半導体製造装置
JP2847166B2 (ja) 1989-09-08 1999-01-13 富士通株式会社 半導体製造装置
JP3020065B2 (ja) * 1990-02-26 2000-03-15 富士通株式会社 半導体製造装置の洗浄方法及び半導体製造装置
US5027841A (en) * 1990-04-24 1991-07-02 Electronic Controls Design, Inc. Apparatus to clean printed circuit boards
JPH0456770A (ja) * 1990-06-25 1992-02-24 Hitachi Electron Eng Co Ltd プラズマｃｖｄ装置のクリーニング方法
US5069235A (en) * 1990-08-02 1991-12-03 Bold Plastics, Inc. Apparatus for cleaning and rinsing wafers
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
US5401321A (en) * 1991-11-11 1995-03-28 Leybold Aktiengesellschaft Method for cleaning material contaminated with greasy or oily substances
DE69420474T2 (de) * 1993-06-30 2000-05-18 Applied Materials Inc Verfahren zum Spülen und Auspumpen einer Vakuumkammer bis Ultra-Hoch-Vakuum
US5388601A (en) * 1994-03-15 1995-02-14 Mansur; Pierre G. Spray gun washing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412091B (zh) * 2005-11-15 2013-10-11 Toray Eng Co Ltd 分配裝置及安裝系統

Also Published As

Publication number Publication date
JPH0758034A (ja) 1995-03-03
KR100381822B1 (ko) 2003-06-27
JP3158264B2 (ja) 2001-04-23
US5522412A (en) 1996-06-04
USRE36925E (en) 2000-10-31
KR950005364A (ko) 1995-03-20

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