TW223688B - - Google Patents

Info

Publication number
TW223688B
TW223688B TW81104852A TW81104852A TW223688B TW 223688 B TW223688 B TW 223688B TW 81104852 A TW81104852 A TW 81104852A TW 81104852 A TW81104852 A TW 81104852A TW 223688 B TW223688 B TW 223688B
Authority
TW
Taiwan
Application number
TW81104852A
Other languages
Chinese (zh)
Original Assignee
Fu Chieh Hsu
Wingyu Leung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fu Chieh Hsu, Wingyu Leung filed Critical Fu Chieh Hsu
Application granted granted Critical
Publication of TW223688B publication Critical patent/TW223688B/zh

Links

TW81104852A 1992-04-08 1992-06-20 TW223688B (ar)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86541092A 1992-04-08 1992-04-08

Publications (1)

Publication Number Publication Date
TW223688B true TW223688B (ar) 1994-05-11

Family

ID=25345448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW81104852A TW223688B (ar) 1992-04-08 1992-06-20

Country Status (2)

Country Link
JP (1) JP3192220B2 (ar)
TW (1) TW223688B (ar)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551844B1 (en) 1997-01-15 2003-04-22 Formfactor, Inc. Test assembly including a test die for testing a semiconductor product die
CN1280755C (zh) 1997-12-10 2006-10-18 精工爱普生株式会社 系统大规模集成电路与电子设备
JP3816034B2 (ja) 2002-07-16 2006-08-30 松下電器産業株式会社 メモリ混載半導体集積回路
JP4821198B2 (ja) 2005-07-12 2011-11-24 ソニー株式会社 半導体集積回路とその製造方法
JP4552803B2 (ja) 2005-08-10 2010-09-29 ソニー株式会社 半導体集積回路
JP2007101395A (ja) 2005-10-05 2007-04-19 Sony Corp 回路装置の検査装置、検査方法及び製造方法
US10055316B2 (en) * 2016-01-29 2018-08-21 Varex Imaging Corporation Row driver fault isolation circuitry for matrix type integrated circuit
TWI738328B (zh) * 2017-09-28 2021-09-01 美商伊路米納有限公司 流體施配器總成與用於將流體施配至流體匣中的方法
CN117153817A (zh) * 2022-05-23 2023-12-01 华为技术有限公司 芯片和用于芯片互联的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6095641A (ja) * 1983-10-28 1985-05-29 Nec Corp ２重化装置
JPS63246843A (ja) * 1987-04-02 1988-10-13 Toshiba Corp 半導体集積回路装置
JPS6419745A (en) * 1987-07-15 1989-01-23 Hitachi Ltd Wafer scale integrated circuit device
JPH03201551A (ja) * 1989-12-28 1991-09-03 Hitachi Ltd 半導体集積回路装置
JP2660090B2 (ja) * 1990-08-31 1997-10-08 株式会社東芝 半導体集積回路

Also Published As

Publication number Publication date
JPH06295958A (ja) 1994-10-21
JP3192220B2 (ja) 2001-07-23

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Legal Events

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