TW215079B - - Google Patents

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Publication number
TW215079B
TW215079B TW080107345A TW80107345A TW215079B TW 215079 B TW215079 B TW 215079B TW 080107345 A TW080107345 A TW 080107345A TW 80107345 A TW80107345 A TW 80107345A TW 215079 B TW215079 B TW 215079B
Authority
TW
Taiwan
Prior art keywords
air
item
patent application
ceramic
moisture
Prior art date
Application number
TW080107345A
Other languages
English (en)
Chinese (zh)
Original Assignee
Boc Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boc Group Inc filed Critical Boc Group Inc
Application granted granted Critical
Publication of TW215079B publication Critical patent/TW215079B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • H10W70/05—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Ceramic Capacitors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW080107345A 1990-10-11 1991-09-17 TW215079B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59612290A 1990-10-11 1990-10-11

Publications (1)

Publication Number Publication Date
TW215079B true TW215079B (enExample) 1993-10-21

Family

ID=24386063

Family Applications (1)

Application Number Title Priority Date Filing Date
TW080107345A TW215079B (enExample) 1990-10-11 1991-09-17

Country Status (8)

Country Link
EP (1) EP0487196A1 (enExample)
JP (1) JP2506520B2 (enExample)
CN (1) CN1062444A (enExample)
AU (1) AU644481B2 (enExample)
CA (1) CA2051843A1 (enExample)
IE (1) IE913574A1 (enExample)
TW (1) TW215079B (enExample)
ZA (1) ZA917489B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682018A (en) * 1991-10-18 1997-10-28 International Business Machines Corporation Interface regions between metal and ceramic in a metal/ceramic substrate
DE4443365A1 (de) * 1994-12-06 1996-06-13 Philips Patentverwaltung Brenn- und Sinterverfahren für ein keramisches elektronisches Bauteil
WO2004014647A1 (de) * 2002-08-02 2004-02-19 Epcos Ag Verfahren zur herstellung eines keramischen substrats
JP4638382B2 (ja) * 2006-06-05 2011-02-23 田中貴金属工業株式会社 接合方法
CN102869207B (zh) * 2012-09-24 2014-08-13 胜宏科技（惠州）股份有限公司 一种多层led混合材料线路板的层压方法
US11527754B2 (en) 2017-09-29 2022-12-13 Robert Bosch Gmbh Solid composite electrode with coated materials
CN115863289B (zh) * 2022-11-25 2025-11-18 上海富乐华半导体科技有限公司 一种多层铜片键合方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60221358A (ja) * 1984-04-13 1985-11-06 日本碍子株式会社 電気絶縁体用セラミック組成物
US4906405A (en) * 1987-05-19 1990-03-06 Matsushita Electric Industrial Co., Ltd. Conductor composition and method of manufacturing a multilayered ceramic body using the composition
FR2626270B1 (fr) * 1988-01-22 1992-04-30 Pechiney Recherche Procede de cofrittage, de conducteurs en cuivre ou en alliages a base de cuivre et de leur substrat ceramique en cordierite
FR2643364B1 (fr) * 1989-02-22 1993-08-13 Air Liquide Procede d'elaboration de composants multicouches ceramique-metal et appareil pour sa mise en oeuvre
FR2643365B1 (fr) * 1989-02-22 1993-11-05 Air Liquide Procede de metallisation de ceramiques et appareil pour sa mise en oeuvr

Also Published As

Publication number Publication date
JP2506520B2 (ja) 1996-06-12
ZA917489B (en) 1993-03-05
AU8551791A (en) 1992-04-16
CA2051843A1 (en) 1992-04-12
IE913574A1 (en) 1992-04-22
EP0487196A1 (en) 1992-05-27
JPH0616489A (ja) 1994-01-25
CN1062444A (zh) 1992-07-01
AU644481B2 (en) 1993-12-09

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