JP2506520B2 - 多層セラミック物品を熱加工する方法 - Google Patents
多層セラミック物品を熱加工する方法Info
- Publication number
- JP2506520B2 JP2506520B2 JP3262347A JP26234791A JP2506520B2 JP 2506520 B2 JP2506520 B2 JP 2506520B2 JP 3262347 A JP3262347 A JP 3262347A JP 26234791 A JP26234791 A JP 26234791A JP 2506520 B2 JP2506520 B2 JP 2506520B2
- Authority
- JP
- Japan
- Prior art keywords
- atmosphere
- heating
- ceramic
- oxygen
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
-
- H10W70/05—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US596122 | 1984-04-02 | ||
| US59612290A | 1990-10-11 | 1990-10-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0616489A JPH0616489A (ja) | 1994-01-25 |
| JP2506520B2 true JP2506520B2 (ja) | 1996-06-12 |
Family
ID=24386063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3262347A Expired - Lifetime JP2506520B2 (ja) | 1990-10-11 | 1991-10-09 | 多層セラミック物品を熱加工する方法 |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0487196A1 (enExample) |
| JP (1) | JP2506520B2 (enExample) |
| CN (1) | CN1062444A (enExample) |
| AU (1) | AU644481B2 (enExample) |
| CA (1) | CA2051843A1 (enExample) |
| IE (1) | IE913574A1 (enExample) |
| TW (1) | TW215079B (enExample) |
| ZA (1) | ZA917489B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5682018A (en) * | 1991-10-18 | 1997-10-28 | International Business Machines Corporation | Interface regions between metal and ceramic in a metal/ceramic substrate |
| DE4443365A1 (de) * | 1994-12-06 | 1996-06-13 | Philips Patentverwaltung | Brenn- und Sinterverfahren für ein keramisches elektronisches Bauteil |
| WO2004014647A1 (de) * | 2002-08-02 | 2004-02-19 | Epcos Ag | Verfahren zur herstellung eines keramischen substrats |
| JP4638382B2 (ja) * | 2006-06-05 | 2011-02-23 | 田中貴金属工業株式会社 | 接合方法 |
| CN102869207B (zh) * | 2012-09-24 | 2014-08-13 | 胜宏科技(惠州)股份有限公司 | 一种多层led混合材料线路板的层压方法 |
| US11527754B2 (en) | 2017-09-29 | 2022-12-13 | Robert Bosch Gmbh | Solid composite electrode with coated materials |
| CN115863289B (zh) * | 2022-11-25 | 2025-11-18 | 上海富乐华半导体科技有限公司 | 一种多层铜片键合方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60221358A (ja) * | 1984-04-13 | 1985-11-06 | 日本碍子株式会社 | 電気絶縁体用セラミック組成物 |
| US4906405A (en) * | 1987-05-19 | 1990-03-06 | Matsushita Electric Industrial Co., Ltd. | Conductor composition and method of manufacturing a multilayered ceramic body using the composition |
| FR2626270B1 (fr) * | 1988-01-22 | 1992-04-30 | Pechiney Recherche | Procede de cofrittage, de conducteurs en cuivre ou en alliages a base de cuivre et de leur substrat ceramique en cordierite |
| FR2643364B1 (fr) * | 1989-02-22 | 1993-08-13 | Air Liquide | Procede d'elaboration de composants multicouches ceramique-metal et appareil pour sa mise en oeuvre |
| FR2643365B1 (fr) * | 1989-02-22 | 1993-11-05 | Air Liquide | Procede de metallisation de ceramiques et appareil pour sa mise en oeuvr |
-
1991
- 1991-09-17 TW TW080107345A patent/TW215079B/zh active
- 1991-09-19 ZA ZA917489A patent/ZA917489B/xx unknown
- 1991-09-19 CA CA002051843A patent/CA2051843A1/en not_active Abandoned
- 1991-09-24 CN CN91108028A patent/CN1062444A/zh active Pending
- 1991-10-01 AU AU85517/91A patent/AU644481B2/en not_active Ceased
- 1991-10-03 EP EP91309067A patent/EP0487196A1/en not_active Ceased
- 1991-10-09 JP JP3262347A patent/JP2506520B2/ja not_active Expired - Lifetime
- 1991-10-16 IE IE357491A patent/IE913574A1/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| ZA917489B (en) | 1993-03-05 |
| AU8551791A (en) | 1992-04-16 |
| CA2051843A1 (en) | 1992-04-12 |
| IE913574A1 (en) | 1992-04-22 |
| EP0487196A1 (en) | 1992-05-27 |
| JPH0616489A (ja) | 1994-01-25 |
| CN1062444A (zh) | 1992-07-01 |
| AU644481B2 (en) | 1993-12-09 |
| TW215079B (enExample) | 1993-10-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5004640A (en) | Multilayered ceramic substrates and method for manufacturing the same | |
| EP0163478B1 (en) | Process of manufacturing ceramic circuit board | |
| US5370759A (en) | Method for producing multilayered ceramic substrate | |
| US4795512A (en) | Method of manufacturing a multilayer ceramic body | |
| CA2216457C (en) | Nickel powder and process for preparing the same | |
| JPH0577197B2 (enExample) | ||
| JPH05139810A (ja) | ガラスセラミツク構造体焼成方法 | |
| JP2506520B2 (ja) | 多層セラミック物品を熱加工する方法 | |
| US5147484A (en) | Method for producing multi-layer ceramic substrates with oxidation resistant metalization | |
| US5230846A (en) | Method for preparing multilayered ceramic with internal copper conductor | |
| EP0352211B1 (en) | Enhanced removal of carbon from ceramic substrate laminates | |
| JP2528595B2 (ja) | セラミック複合構造およびその形成方法 | |
| US4776978A (en) | Method of controlling the sintering of metal particles | |
| US5139975A (en) | Sintering arrangement for enhancing removal of carbon from ceramic substrate laminates | |
| EP0834368B1 (en) | Nickel powder and process for preparing the same | |
| US5053361A (en) | Setter tile for use in sintering of ceramic substrate laminates | |
| EP0312824B1 (en) | Ceramic structure with copper based conductors and method for forming such a structure | |
| EP0267602A2 (en) | Method for producing high density multilayered glass-ceramic structures with metallic based conductors | |
| JPS61292392A (ja) | セラミツク配線基板の製造方法 | |
| JPH0320914B2 (enExample) | ||
| JPH06268373A (ja) | 多層回路基板の製造方法 | |
| JPH0554718B2 (enExample) | ||
| JPH0348676B2 (enExample) | ||
| JPH1116419A (ja) | 導電性ペースト及びこれを用いたセラミックス多層基板の製造方法 | |
| JPS62198198A (ja) | セラミツク多層配線基板の製造方法 |