TW212153B - - Google Patents

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Publication number
TW212153B
TW212153B TW081110376A TW81110376A TW212153B TW 212153 B TW212153 B TW 212153B TW 081110376 A TW081110376 A TW 081110376A TW 81110376 A TW81110376 A TW 81110376A TW 212153 B TW212153 B TW 212153B
Authority
TW
Taiwan
Prior art keywords
light
screen
patent application
item
masking plate
Prior art date
Application number
TW081110376A
Other languages
English (en)
Chinese (zh)
Original Assignee
Nippon Petrochemicals Co Ltd
Kobunshi Kako Kenkyusho
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Petrochemicals Co Ltd, Kobunshi Kako Kenkyusho filed Critical Nippon Petrochemicals Co Ltd
Application granted granted Critical
Publication of TW212153B publication Critical patent/TW212153B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/16Composite materials, e.g. fibre reinforced
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/36Wood or similar materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/38Fabrics, fibrous materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Advancing Webs (AREA)
  • Nonwoven Fabrics (AREA)
  • Laser Beam Processing (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
TW081110376A 1991-12-27 1992-12-24 TW212153B (en:Method)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36147291 1991-12-27
JP4274777A JPH05228669A (ja) 1991-12-27 1992-09-01 光線による穴開きウェブの製法および装置

Publications (1)

Publication Number Publication Date
TW212153B true TW212153B (en:Method) 1993-09-01

Family

ID=26551194

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081110376A TW212153B (en:Method) 1991-12-27 1992-12-24

Country Status (7)

Country Link
US (1) US5382773A (en:Method)
EP (1) EP0549357B1 (en:Method)
JP (1) JPH05228669A (en:Method)
CA (1) CA2086202A1 (en:Method)
DE (1) DE69218569T2 (en:Method)
ES (1) ES2100312T3 (en:Method)
TW (1) TW212153B (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385033B (zh) * 2009-08-19 2013-02-11 Univ Nat Pingtung Sci & Tech 微槽孔過篩板之製作方法

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GB9202434D0 (en) * 1992-02-05 1992-03-18 Xaar Ltd Method of and apparatus for forming nozzles
JP3211525B2 (ja) * 1993-04-22 2001-09-25 オムロン株式会社 薄材メッシュ、その製造方法及びその製造装置
DE4435532A1 (de) * 1994-10-05 1996-04-11 Mann & Hummel Filter Verfahren zur Herstellung von Filtern
JP3431706B2 (ja) * 1994-12-16 2003-07-28 新日本石油化学株式会社 積層体・不織布または織布並びにそれらを用いた強化積層体
SE513841C2 (sv) * 1994-12-22 2000-11-13 Sca Hygiene Prod Ab Förfarande för hål- eller slitsbildning i ett materialskikt och samtidig sammanfogning av detta skikt med ett annat materialskikt
FR2730657B1 (fr) * 1995-02-22 1997-03-28 Solaic Sa Procede et installation pour realiser des trous dans le film isolant d'une bande support pour modules de cartes electroniques
US6054086A (en) * 1995-03-24 2000-04-25 Nippon Petrochemicals Co., Ltd. Process of making high-strength yarns
FR2740714B1 (fr) * 1995-11-02 1998-01-23 Heidelberg Harris Sa Dispositif de coupe de matiere
GB9601049D0 (en) 1996-01-18 1996-03-20 Xaar Ltd Methods of and apparatus for forming nozzles
US6117294A (en) 1996-01-19 2000-09-12 Micron Technology, Inc. Black matrix material and methods related thereto
US5879494A (en) * 1996-09-23 1999-03-09 Minnesota Mining And Manufacturing Company Method of aperturing thin sheet materials
EP0835714A1 (en) * 1996-10-09 1998-04-15 LVD Company NV Laser focusing unit for laser beam devices
DE19722799A1 (de) * 1997-05-30 1998-12-03 Hauni Maschinenbau Ag Verfahren zum Bearbeiten eines Streifens und Anordnung in einer Filteransetzmaschine
AT407615B (de) * 1997-07-02 2001-05-25 Inst Spanlose Fertigung Und Ho Verfahren zum biegen mit laserunterstützung
US6313435B1 (en) 1998-11-20 2001-11-06 3M Innovative Properties Company Mask orbiting for laser ablated feature formation
FR2794675B1 (fr) * 1999-06-11 2001-08-31 Brodart Microperforation laser de films thermoplastiques ou cellulosiques par fibres optiques
CN1376100A (zh) * 1999-09-28 2002-10-23 住友重机械工业株式会社 激光钻孔的加工方法及其加工装置
US7265439B1 (en) 1999-11-30 2007-09-04 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Low cost, high speed, high efficiency infrared transceiver
DE10066062A1 (de) * 2000-08-04 2004-05-27 Sca Hygiene Products Gmbh Vorrichtung zum Trennen und/oder Perforieren
AU2002243288A1 (en) * 2000-10-30 2002-06-24 Pactiv Corporation Laser for forming bags from a web of material
US7367931B2 (en) * 2000-10-30 2008-05-06 Pactiv Corporation Laser cutoff stacker assembly
DE10154508A1 (de) 2001-11-07 2003-05-22 Mlt Micro Laser Technology Gmb Vorrichtung zur Substratbehandlung mittels Laserstrahlung
US6821348B2 (en) * 2002-02-14 2004-11-23 3M Innovative Properties Company In-line deposition processes for circuit fabrication
US6897164B2 (en) 2002-02-14 2005-05-24 3M Innovative Properties Company Aperture masks for circuit fabrication
DE50201160D1 (de) * 2002-05-16 2004-11-04 Leister Process Technologies S Verfahren und Vorrichtung zum Verbinden von Kunststoffmaterialien mit hoher Schweissgeschwindigkeit
ITPN20040078A1 (it) * 2004-10-25 2005-01-25 Gmi Srl Dispositivo di taglio ed incisione a laser di materiali per macchine da ricamo automatiche a controllo elettronico, e-o per plotter o roller e programma di lavorazione a ricamo di materiali di vario genere per elaboratori elettronici di controllo di
ITBO20060586A1 (it) * 2006-08-03 2006-11-02 El En Spa Dispositivo per il taglio laser di un nastro continuo.
IT1394891B1 (it) * 2008-07-25 2012-07-20 Matteo Baistrocchi Impianto di scribing laser per il trattamento superficiale di lamierini magnetici con spot a sezione ellittica
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CN102642090B (zh) * 2012-04-01 2015-03-25 汤振华 可回转激光掩模在线式切割或刻印系统
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CN107106342B (zh) 2014-11-06 2020-09-15 宝洁公司 开孔纤维网及其制作方法
KR101711853B1 (ko) * 2014-12-24 2017-03-03 주식회사 포스코 강판 표면 홈 형성 방법 및 그 장치
US11247428B2 (en) * 2016-11-07 2022-02-15 Marstonmap, Llc Apparatus and method for producing microperforated patches and labels applicable to modified atmosphere packaging
EP3582733B1 (en) 2017-02-16 2022-08-17 The Procter & Gamble Company Absorbent articles with substrates having repeating patterns of apertures comprising a plurality of repeat units
EP3388188B1 (en) * 2017-03-29 2020-09-09 Preco, Inc. Reverse draft hole apparatus and method
JP6607649B2 (ja) * 2017-09-01 2019-11-20 株式会社ワイヤード レーザ加工装置、レーザ加工方法およびこれを用いて加工された薄板
US11338394B2 (en) 2017-09-01 2022-05-24 Wired Co., Ltd. Laser processing apparatus, laser processing method and thin plate processed using the same
CH714377B1 (de) * 2017-11-30 2021-10-15 Laesser Ag Verfahren und Vorrichtung, um mittels einer Stickmaschine flächige Applikationen auf einem Stickboden zu applizieren.
PL3765232T3 (pl) * 2018-03-16 2024-09-02 Preco, Llc Laserowo wykonane mikroperforacje w folii
US12127925B2 (en) 2018-04-17 2024-10-29 The Procter & Gamble Company Webs for absorbent articles and methods of making the same
EP3958809A1 (en) 2019-04-24 2022-03-02 The Procter & Gamble Company Highly extensible nonwoven webs and absorbent articles having such webs
JP7516895B2 (ja) * 2020-06-15 2024-07-17 大日本印刷株式会社 孔付きシートの製造方法
EP4070908A1 (de) * 2021-04-09 2022-10-12 INTERLAS GmbH & Co. KG Mikroperforationsverfahren und -vorrichtung mit einer sich bewegenden bahn

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JPS63188486A (ja) * 1987-01-30 1988-08-04 Japan Tobacco Inc 帯状シ−ト材料の穿孔方法及び装置
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385033B (zh) * 2009-08-19 2013-02-11 Univ Nat Pingtung Sci & Tech 微槽孔過篩板之製作方法

Also Published As

Publication number Publication date
EP0549357B1 (en) 1997-03-26
DE69218569T2 (de) 1997-11-13
ES2100312T3 (es) 1997-06-16
DE69218569D1 (de) 1997-04-30
JPH05228669A (ja) 1993-09-07
EP0549357A1 (en) 1993-06-30
CA2086202A1 (en) 1993-06-28
US5382773A (en) 1995-01-17

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