TW204412B - - Google Patents

Download PDF

Info

Publication number
TW204412B
TW204412B TW081108412A TW81108412A TW204412B TW 204412 B TW204412 B TW 204412B TW 081108412 A TW081108412 A TW 081108412A TW 81108412 A TW81108412 A TW 81108412A TW 204412 B TW204412 B TW 204412B
Authority
TW
Taiwan
Prior art keywords
base
layer
pole
wave
island
Prior art date
Application number
TW081108412A
Other languages
English (en)
Chinese (zh)
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW204412B publication Critical patent/TW204412B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/01Manufacture or treatment
    • H10D10/021Manufacture or treatment of heterojunction BJTs [HBT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/80Heterojunction BJTs
    • H10D10/821Vertical heterojunction BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/133Emitter regions of BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/133Emitter regions of BJTs
    • H10D62/136Emitter regions of BJTs of heterojunction BJTs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/137Collector regions of BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/177Base regions of bipolar transistors, e.g. BJTs or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/118Electrodes comprising insulating layers having particular dielectric or electrostatic properties, e.g. having static charges
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0107Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs
    • H10D84/0109Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs the at least one component covered by H10D12/00 or H10D30/00 being a MOS device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs

Landscapes

  • Bipolar Transistors (AREA)
TW081108412A 1991-02-28 1992-10-22 TW204412B (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US66209391A 1991-02-28 1991-02-28

Publications (1)

Publication Number Publication Date
TW204412B true TW204412B (cg-RX-API-DMAC7.html) 1993-04-21

Family

ID=24656356

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081108412A TW204412B (cg-RX-API-DMAC7.html) 1991-02-28 1992-10-22

Country Status (5)

Country Link
US (1) US5528060A (cg-RX-API-DMAC7.html)
EP (1) EP0501279A1 (cg-RX-API-DMAC7.html)
JP (1) JPH07169776A (cg-RX-API-DMAC7.html)
KR (1) KR920017278A (cg-RX-API-DMAC7.html)
TW (1) TW204412B (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0160542B1 (ko) * 1994-12-15 1999-02-01 정선종 모노리틱 마이크로 웨이브 집적회로용 기판 및 그 제조방법
US5761028A (en) * 1996-05-02 1998-06-02 Chrysler Corporation Transistor connection assembly having IGBT (X) cross ties
CN101189728A (zh) * 2005-06-01 2008-05-28 Nxp股份有限公司 利用改进的npn双极晶体管基极接入电阻的方法和器件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3444443A (en) * 1966-12-26 1969-05-13 Hitachi Ltd Semiconductor device for high frequency and high power use
JPS51128268A (en) * 1975-04-30 1976-11-09 Sony Corp Semiconductor unit
FR2352404A1 (fr) * 1976-05-20 1977-12-16 Comp Generale Electricite Transistor a heterojonction
KR900001394B1 (en) * 1985-04-05 1990-03-09 Fujitsu Ltd Super high frequency intergrated circuit device
US5063427A (en) * 1987-10-13 1991-11-05 Northrop Corporation Planar bipolar transistors including heterojunction transistors
JP2851044B2 (ja) * 1988-03-30 1999-01-27 株式会社東芝 半導体装置の製造方法
US5097312A (en) * 1989-02-16 1992-03-17 Texas Instruments Incorporated Heterojunction bipolar transistor and integration of same with field effect device
JP2804095B2 (ja) * 1989-07-10 1998-09-24 株式会社東芝 ヘテロ接合バイボーラトランジスタ

Also Published As

Publication number Publication date
US5528060A (en) 1996-06-18
KR920017278A (ko) 1992-09-26
EP0501279A1 (en) 1992-09-02
JPH07169776A (ja) 1995-07-04

Similar Documents

Publication Publication Date Title
US10312358B2 (en) High electron mobility transistors with improved heat dissipation
TWI358829B (en) Metal-semiconductor field effect transistors (mesf
CN110112215B (zh) 兼具栅介质与刻蚀阻挡功能结构的功率器件及制备方法
TWI360197B (en) Method of fabricating an integrated circuit channe
Lind High frequency III–V nanowire MOSFETs
TW483171B (en) Ultra high speed heterojunction bipolar transistor having a cantilevered base.
CN110504354A (zh) 基于反铁磁性材料的纳米太赫兹波振荡器阵列及制备方法
CN113345957B (zh) 基于载流子调控的自旋波场效应晶体管及制备方法和应用
CN107170673A (zh) 具有石墨烯掩埋散热层和源接地的GaNMMIC器件及制备方法
Münzenrieder et al. Focused ion beam milling for the fabrication of 160 nm channel length IGZO TFTs on flexible polymer substrates
TW204412B (cg-RX-API-DMAC7.html)
CN112071902B (zh) 一种自旋极化耦合的GaN高电子迁移率晶体管
TWI243432B (en) Semiconductor device, method of making the same and liquid crystal display device
JPS59208821A (ja) 気相合成によるダイヤモンド半導体およびその製造方法
CN109360856A (zh) 一种具有高散热结构的N面GaN HEMT器件及制作方法
CN106952812A (zh) 一种GaN器件键合方法
CN209199933U (zh) 具有电极的半导体装置
TW448580B (en) Collector-up RF power transistor
CN111446289B (zh) 基于石墨烯覆盖层的氮化镓器件结构及其制备方法
CN208284503U (zh) 一种霍尔元件
JPS5956740A (ja) 半導体装置の製造方法
CN101950722B (zh) 利用双层多晶硅器件结构自对准制备微波功率器件的方法
Zhang et al. Spacer Side-wall Processed 0.15 μ m GaN HEMT for Ka-band Application
JP2002334837A (ja) 半導体基板および半導体装置
CN105449004B (zh) 一种AlGaAs梁式引线PIN二极管及其制备方法